Abstract: The present invention includes compounds of formula (I) and methods for its preparation and treatment of disorders with activated peroxisome preoliferator-activated receptor gamma (PPARG), particularly cancer.

Abstract: Methods and devices that prevent stasis in the LAA by either increasing the flow through the LAA or by closing off or sealing the LAA. Increasing the flow is accomplished through shunts, flow diverters, agitators, or by increasing the size of the ostium. Closing off the LAA is accomplished using seals or by cinching the LAA.

Abstract: The present disclosure includes an articulated coupler for attachment between a towed vehicle and a towing vehicle. The articulated coupler includes a first attachment member for attachment to the towing vehicle and a second attachment member for attachment to the towed vehicle. A ball joint member extends between the first and second attachment member. The ball joint member includes a ball at a proximal end and an elongated portion at a distal end such that the elongate portion is attachable to the first attachment member and the ball is attached to the second attachment member. The ball is retained to the second attachment member with a collar. The collar may have an aperture with an elliptical shape and a surface with a concave shape for defining a pivotal range of motion. The ball joint member may be pivotal relative to the first attachment member and may be rotatable and pivotal relative to the second attachment member.

Abstract: Disclosed is a light assembly that is removably attachable to a work surface such as a creeper assembly. The light assembly may include a light positioned along a top of a dome shaped housing and a base with a plurality of lugs. A pad member may be attached to the work surface and the lugs may be selectively engageable with attachment members extending from the pad member. The attachment member may include a biasing member having a self-locating detent configured to engage with a self-locating recess thereby generally aligning the pad member and the light assembly. The pad member or the base of the light assembly may include a magnet. The light assembly may also include at least one light array about the perimeter of the housing.

Abstract: A hitch mount assembly selectively securable to a hitch ball receiver is shown and described. The hitch mount assembly may include a mount body operatively engaged with an underside portion of the hitch ball receiver, where the mount body has an attachment feature to be selectively secured to an article such as a brush, and a clamp body selectively secured to the mount body and positioned on a top portion of the hitch ball receiver. The hitch mount assembly may also include at least one fastener selectively securing the clamp body to the mount body with the hitch ball receiver positioned between the clamp body and the mount body.

Abstract: The present disclosure includes an articulated coupler for attachment between a towed vehicle and a towing vehicle. The articulated coupler includes a first attachment member for attachment to the towing vehicle and a second attachment member for attachment to the towed vehicle. A ball joint member extends between the first and second attachment member. The ball joint member includes a ball at a proximal end and an elongated portion at a distal end such that the elongate portion is attachable to the first attachment member and the ball is attached to the second attachment member. The ball is retained to the second attachment member with a collar. The collar may have an aperture with an elliptical shape and a surface with a concave shape for defining a pivotal range of motion. The ball joint member may be pivotal relative to the first attachment member and may be rotatable and pivotal relative to the second attachment member.

Abstract: A method of manufacturing is provided that includes applying a thermal interface tape to a side of a semiconductor wafer that includes at least one semiconductor chip. The thermal interface material tape is positioned on the at least one semiconductor chip. The at least one semiconductor chip is singulated from the semiconductor wafer with at least a portion of the thermal interface tape still attached to the semiconductor chip.

Abstract: Disclosed is a folding tool assembly comprising a top tool having a head and a base with an annular surface, a center tool having a head and a base, and a bottom tool having a head and a base with an annular surface. The bases of the tools may be rotatable along a common axis within a housing relative to one another. An elongated pushbutton with cutouts may selectively align with the annual surfaces of the top and bottom tools wherein the pushbutton body may be spring loaded within the housing. Each of the tools may be placed in a closed locked position and an open locked position relative to the other tools. The top tool and bottom tool may be rotatably attached to a shaft aligned along the common axis.

Abstract: A hitch mount assembly selectively securable to a hitch ball receiver is shown and described. The hitch mount assembly may include a mount body operatively engaged with an underside portion of the hitch ball receiver, where the mount body has an attachment feature to be selectively secured to an article such as a brush, and a clamp body selectively secured to the mount body and positioned on a top portion of the hitch ball receiver. The hitch mount assembly may also include at least one fastener selectively securing the clamp body to the mount body with the hitch ball receiver positioned between the clamp body and the mount body.

Abstract: A method to test and package dies so as to increase overall yield is provided. The method includes performing a wafer test on a first die and mounting the first die on a package substrate to form a partial package, if the wafer test of the first die is successful. The method further includes performing a system test on the partial package including the first die and stacking a second die on the first die if the system test on the partial package and the first die is successful.

Abstract: A method of manufacturing is provided that includes applying a thermal interface tape to a side of a semiconductor wafer that includes at least one semiconductor chip. The thermal interface material tape is positioned on the at least one semiconductor chip. The at least one semiconductor chip is singulated from the semiconductor wafer with at least a portion of the thermal interface tape still attached to the semiconductor chip.

Abstract: A system and method are provided for sensing a physical stimulus of an integrated circuit. The system and method operate with one or more active thermal sensors embedded in the die of an integrated circuit to provide highly accurate die temperature measurements. The system and method are able to monitor and control the die temperature of the integrated circuit to avoid an integrated circuit malfunction due to an undesirable temperature condition.