Abstract: A system comprises a thermoelectric device, and a baseplate coupled to a first side of the thermoelectric device. The system also comprises a band coupled to the baseplate and a container. The band may be adjustable in a circumference and configured to thermally couple the baseplate and the container.

Abstract: A thermoelectric cooling system includes at least one thermoelectric cooling module and an electronic circuit. The at least one thermoelectric cooling module is arranged in at least one zone. The electronic circuit is electrically coupled to at least one of the thermoelectric cooling modules. Each of the thermoelectric cooling modules includes a first plate, a sink, a plurality of thermoelectric elements, and a second plate. The thermoelectric elements are coupled to the first plate and the second plate. The first plate is arranged to be thermally coupled to a first surface. The sink is arranged to be thermally coupled to an environment and is configured to dissipate heat by evaporating a liquid from the sink to the environment. The second plate is arranged to be thermally coupled to the sink.

Abstract: A system comprises a plurality of thermoelectric elements, a first plate coupled to the plurality of thermoelectric elements, and a second plate coupled to the plurality of thermoelectric elements. The second plate is arranged to be thermally coupled to an environment. The system further comprises a first plurality of ductile fibers coupled to the second plate. The plurality of ductile fibers are configured to transfer heat between the second plate and the environment.

Abstract: A system includes a first plate and a second plate. The first plate is arranged to be thermally coupled to a first surface and the second plate is arranged to be thermally coupled to an environment. The environment has a temperature that is different than the first surface. The system also includes a thermoelectric device that includes a plurality of thermoelectric elements. The thermoelectric device includes a third plate coupled to the plurality of thermoelectric elements and thermally coupled to the first plate. The thermoelectric device also includes a fourth plate coupled to the plurality of thermoelectric elements and thermally coupled to the second plate. The system also includes a dielectric fluid arranged between the first plate and the second plate. The thermoelectric elements are submersed in the dielectric fluid.

Abstract: A system comprises a thermoelectric device, and a baseplate coupled to a first side of the thermoelectric device. The system also comprises a band coupled to the baseplate and a container. The band may be adjustable in a circumference and configured to thermally couple the baseplate and the container.

Abstract: A thermoelectric cooling system comprises at least one thermoelectric cooling module and an electronic circuit. The at least one thermoelectric cooling module is arranged in at least one zone. The electronic circuit is electrically coupled to at least one of the thermoelectric cooling modules. Each of the thermoelectric cooling modules comprises a first plate, a sink, a plurality of thermoelectric elements, and a second plate. The thermoelectric elements are coupled to the first plate and the second plate. The first plate is arranged to be thermally coupled to a first surface. The sink is arranged to be thermally coupled to an environment and is configured to dissipate heat by evaporating a liquid from the sink to the environment. The second plate is arranged to be thermally coupled to the sink.

Abstract: A system comprises a plurality of thermoelectric elements, a first plate coupled to the plurality of thermoelectric elements, and a second plate coupled to the plurality of thermoelectric elements. The second plate is arranged to be thermally coupled to an environment. The system further comprises a first plurality of ductile fibers coupled to the second plate. The plurality of ductile fibers are configured to transfer heat between the second plate and the environment.

Abstract: A system includes a first plate and a second plate. The first plate is arranged to be thermally coupled to a first surface and the second plate is arranged to be thermally coupled to an environment. The environment has a temperature that is different than the first surface. The system also includes a thermoelectric device that includes a plurality of thermoelectric elements. The thermoelectric device includes a third plate coupled to the plurality of thermoelectric elements and thermally coupled to the first plate. The thermoelectric device also includes a fourth plate coupled to the plurality of thermoelectric elements and thermally coupled to the second plate. The system also includes a dielectric fluid arranged between the first plate and the second plate. The thermoelectric elements are submersed in the dielectric fluid.

Abstract: A system includes a first plate and a second plate. The first plate is arranged to be thermally coupled to a first surface and the second plate is arranged to be thermally coupled to an environment. The environment has a temperature that is different than the first surface. The system also includes a thermoelectric device that includes a plurality of thermoelectric elements. The thermoelectric device includes a third plate coupled to the plurality of thermoelectric elements and thermally coupled to the first plate. The thermoelectric device also includes a fourth plate coupled to the plurality of thermoelectric elements and thermally coupled to the second plate. The system also includes a dielectric fluid arranged between the first plate and the second plate. The thermoelectric elements are submersed in the dielectric fluid.

Abstract: In accordance with one embodiment of the present disclosure, a thermoelectric device includes a plurality of thermoelectric elements that each include a diffusion barrier. The diffusion barrier includes a refractory metal. The thermoelectric device also includes a plurality of conductors coupled to the plurality of thermoelectric elements. The plurality of conductors include aluminum. In addition, the thermoelectric device includes at least one plate coupled to the plurality of thermoelectric elements using a braze. The braze includes aluminum.

Abstract: In one embodiment, a system includes a strap configured to be coupled to a container. The strap includes a plurality of plates arranged to allow the strap to flex. The system also includes a thermoelectric device coupled to the strap. The strap is configured to transfer heat between the thermoelectric device and the container. The system includes a thermal interface situated between the thermoelectric device and the strap.

Abstract: In accordance with one embodiment of the present disclosure, a thermoelectric device includes a plurality of thermoelectric elements that each include a diffusion barrier. The diffusion barrier includes a refractory metal. The thermoelectric device also includes a plurality of conductors coupled to the plurality of thermoelectric elements. The plurality of conductors include aluminum. In addition, the thermoelectric device includes at least one plate coupled to the plurality of thermoelectric elements using a braze. The braze includes aluminum.

Abstract: A system includes a first plate and a second plate. The first plate is arranged to be thermally coupled to a first surface and the second plate is arranged to be thermally coupled to an environment. The environment has a temperature that is different than the first surface. The system also includes a thermoelectric device that includes a plurality of thermoelectric elements. The thermoelectric device includes a third plate coupled to the plurality of thermoelectric elements and thermally coupled to the first plate. The thermoelectric device also includes a fourth plate coupled to the plurality of thermoelectric elements and thermally coupled to the second plate. The system also includes a dielectric fluid arranged between the first plate and the second plate. The thermoelectric elements are submersed in the dielectric fluid.

Abstract: An active thermoelectric plate exchanger is provided that includes a plurality of thermally conductive plates and a thermoelectric (TE) assembly having an array of thermoelectric modules (TEM) (e.g., TE coolers or TE generators) for heating/cooling or power generation. For cooling/heating, the TECs actively transfer heat between two fluids. For power generation, the TEGs generate and output power when two fluids having a thermal differential therebetween is applied across the TEGs. Several TE assemblies may be disposed in a stacked configuration between thermally conductive plates contacting the fluids. Additional fluid turbulence generating structures may be included with the fluid flow chambers/paths to generate fluid turbulence and increase thermal efficiency. These structures may include a thermally conductive plate with surface structures or may be a thermally conductive wire cloth, woven wire or wire mesh or screen. The resulting plate exchanger is modular and scalable.

Abstract: In one embodiment, a system includes a strap configured to be coupled to a container. The strap includes a plurality of plates arranged to allow the strap to flex. The system also includes a thermoelectric device coupled to the strap. The strap is configured to transfer heat between the thermoelectric device and the container. The system includes a thermal interface situated between the thermoelectric device and the strap.

Abstract: In one embodiment, a method for forming a metallized ceramic includes thermal spraying metal directly onto a first side of a ceramic plate. The metal comprising aluminum. The method also includes densifying the thermally ceramic plate after spraying the metal onto the first side of the ceramic plate.

Abstract: In accordance with one embodiment of the present disclosure, a thermoelectric device includes a plurality of thermoelectric elements that each include a diffusion barrier. The diffusion barrier includes a refractory metal. The thermoelectric device also includes a plurality of conductors coupled to the plurality of thermoelectric elements. The plurality of conductors include aluminum. In addition, the thermoelectric device includes at least one plate coupled to the plurality of thermoelectric elements using a braze. The braze includes aluminum.

Abstract: A method for creating an array of thermoelectric elements includes applying a first coating of dielectric material to P-type wafers and N-type wafers to form coated P-type wafers and coated N-type wafers. A P/N-type ingot is formed from the coated P-type wafers and the coated N-type wafers. The coated P-type wafers and the coated N-type wafers are alternatingly arranged in the P/N-type ingot. P/N-type wafers comprising P-type elements and N-type elements are sliced from the P/N-type ingot and a second coating of the dielectric material is applied to the P/N-type wafers to form coated P/N-type wafers. Furthermore, a P/N-type array from the coated P/N-type wafers.

Abstract: A method of forming a thermoelectric device includes extruding a P/N-type billet to form a P/N-type extrusion having a first plurality of P-type regions and a first plurality of N-type regions. The P/N-type extrusion is sliced into a plurality of P/N-type wafers. A diffusion barrier metallization is applied to at least a subset of the P-type regions and N-type regions. One side of at least one P/N-type wafer is attached to a temporary substrate. The P/N-type regions of the P/N-type wafer are separated into an array of isolated P-type and N-type elements. The array of elements are coupled to a first plate having a first patterned metallization to form a thermoelectric circuit. The temporary substrate and bonding media may be detached from the P-type and N-type elements. The thermoelectric circuit may be coupled with a second plate at a second end of the thermoelectric circuit, second plate having a second patterned metallization.

Abstract: A method of manufacturing a thermoelectric module is provided. The method includes mounting a thermoelectric material to a substrate such that a portion of the thermoelectric material covers a removable pattern. The thermoelectric material is then segmented and the removable pattern is removed. The portions of the thermoelectric material which were covering the removable pattern are also removed, leaving the portions of the thermoelectric material not covering the removable pattern attached to the substrate.