Patents by Inventor Ju Ho Kim
Ju Ho Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230221574Abstract: A sensor shifting actuator includes a fixed body; a moving body disposed in the fixed body and including an image sensor having an imaging surface; a supporting substrate disposed in the fixed body and configured to support the moving body so that the moving body is movable with respect to the fixed body in first and second directions parallel to the imaging surface of the image sensor; and a driver configured to move the moving body in either one or both of the first and second directions. The supporting substrate includes a movable portion coupled to the moving body, a fixed portion coupled to the fixed body, and a connection portion disposed between the movable portion and the fixed portion. The movable portion and the connection portion are movable together in the first direction, and the movable portion is movable with respect to the connection portion in the second direction.Type: ApplicationFiled: January 13, 2023Publication date: July 13, 2023Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Ho KIM, Jung Hyun PARK, Dong Hoon LEE, Sang Hyun JI, Do Hwan KIM, Nam Keun OH
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Publication number: 20230224588Abstract: A sensor actuator is provided. The sensor actuator includes a movable body on which an image sensor having an imaging plane is disposed; a fixed body configured to accommodate the movable body; and a driver configured to provide a driving force to move the image sensor, wherein the driver includes a wire portion having a plurality of wires of which lengths change when power is applied to the plurality of wires, wherein each of the plurality of wires is configured to have a first end coupled to the fixed body and a second end coupled to the movable body, and wherein one of the first end and the second end of each of the plurality of wires is connected to the fixed body or the movable body through an elastic portion.Type: ApplicationFiled: December 20, 2022Publication date: July 13, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Ho KIM, Sang Hyun JI, Jung Hyun PARK, Doo Seub SHIN, Dong Hoon LEE, Do Hwan KIM
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Publication number: 20230209198Abstract: A sensor shifting actuator includes a sensor substrate on which an image sensor having an imaging surface is disposed; a base configured to accommodate the sensor substrate; and a driver configured to drive the image sensor in a first direction and a second direction, parallel to the imaging surface. The sensor substrate includes a movable portion on which the image sensor is disposed, a fixed portion coupled to the base, and a connection portion disposed between the movable portion and the fixed portion. Depending on a movement direction of the image sensor in the first direction or the second direction, the movable portion and the connection portion relatively move with respect to the fixed portion, or the movable portion relatively moves with respect to the connection portion.Type: ApplicationFiled: November 10, 2022Publication date: June 29, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sang Jong LEE, Su Bong JANG, Hee Soo YOON, Tae Ho YUN, Ju Ho KIM
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Publication number: 20230209200Abstract: A camera module includes a fixed frame having an internal space, a movable frame installed in the internal space of the fixed frame to be movable, with at least one optical member mounted thereon, and a driving wire including a wire member formed of a shape-memory alloy, and two coupling members coupled to the wire member and formed in a wedge shape, wherein the fixed frame includes a first wire coupling portion disposed to protrude toward the movable frame, and the movable frame includes a second wire coupling portion disposed to protrude toward the fixed frame, and the two coupling members of the driving wire are inserted into the first wire coupling portion and the second wire coupling portion, respectively, to connect the movable frame and the fixed frame to each other.Type: ApplicationFiled: December 1, 2022Publication date: June 29, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Hyun PARK, Ju Ho KIM, Sang Hyun JI, Nam Keun OH, Doo Seub SHIN, Do Hwan KIM, Dong Hoon LEE
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Publication number: 20230156310Abstract: A sensor shifting module includes a fixed body; a movable body movably, disposed in the fixed body, comprising an image sensor having an imaging plane oriented in a first direction; a substrate configured to deform based on a movement of the movable body with respect to the fixed body; and a driver, configured to move the movable body in a direction orthogonal to the first direction, comprising a driving coil coupled to one of the fixed body and the movable body, and a driving yoke coupled to another of the fixed body and the movable body. The driving yoke is disposed to oppose the driving coil in the direction orthogonal to the first direction. When current is applied to the driving coil, the movable body is configured to move in the direction orthogonal to the first direction by electromagnetic interaction between the driving coil and the driving yoke.Type: ApplicationFiled: October 17, 2022Publication date: May 18, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Su Bong JANG, Sang Jong LEE, Hee Soo YOON, Tae Ho YUN, Ju Ho KIM
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Patent number: 11600913Abstract: An antenna board includes a first base board unit including a first insulating layer having a first receiving groove; a first antenna board unit disposed in the first receiving groove, including a second insulating layer and a third insulating layer disposed on the second insulating layer, and further including at least one of a first patch pattern disposed on the second insulating layer and covered by the third insulating layer and a second patch pattern disposed on the third insulating layer; and a first encapsulant covering at least a portion of the first antenna board unit and filling at least a portion of the first receiving groove, wherein a dielectric constant of the second insulating layer is different from a dielectric constant of the third insulating layer.Type: GrantFiled: February 23, 2021Date of Patent: March 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ju Ho Kim, Chan Jin Park
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Patent number: 11569586Abstract: A antenna may include a first dielectric layer having a first surface and a second surface opposing the first surface; a second dielectric layer having a third surface, and a fourth surface opposing the third surface; an adhesive layer disposed between the second surface and the third surface and connecting the first dielectric layer to the second dielectric layer; a patch pattern disposed on the second surface and embedded in the adhesive layer; and a coupling pattern disposed on the fourth surface and having at least a portion overlapping the patch pattern on a plane. Each of the first dielectric layer and the second dielectric layer may include an organic binder and an inorganic filler.Type: GrantFiled: July 2, 2020Date of Patent: January 31, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sangik Cho, Ju Ho Kim
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Patent number: 11490512Abstract: A printed circuit board and an antenna module including the same are provided. The printed circuit board includes a core layer; a first build-up structure disposed on an upper side of the core layer, including first insulating layers and first bonding layers, alternately stacked, and further including first wiring layers disposed on upper surfaces of the first insulating layers, respectively, and embedded in the first bonding layers, respectively; and a second build-up structure disposed on a lower side of the core layer, including second insulating layers and second bonding layers, alternately stacked, and further including second wiring layers disposed on lower surfaces of the second insulating layers, respectively, and embedded in the second bonding layers, respectively. The printed circuit board has a through-portion penetrating through the core layer and the second build-up structure, and has a region in which the through-portion is disposed as a flexible region.Type: GrantFiled: February 19, 2020Date of Patent: November 1, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Hong Min, Ju Ho Kim
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Patent number: 11445598Abstract: A printed circuit board has a first stacked body having a flexible region and a rigid region, and a second stacked body disposed on the rigid region of the first stacked body. The first stacked body includes a plurality of first insulating layers, a plurality of first bonding layers, and a plurality of first wiring layers. The second stacked body includes a plurality of second insulating layers and a plurality of second wiring layers, and each of the plurality of first bonding layers integrally covers at least a portion of upper and side surfaces of a respective first wiring layer of the plurality of first wiring layers.Type: GrantFiled: October 12, 2020Date of Patent: September 13, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Hong Min, Ju Ho Kim
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Patent number: 11445433Abstract: An electronic device in a neighbor awareness networking (NAN) cluster is provided. The electronic device includes a wireless fidelity (Wi-Fi) transceiver; and a processor, coupled with the Wi-Fi transceiver, configured to perform a synchronization with at least one device in the NAN cluster, wherein the at least one device comprises an external electronic device, after performing the synchronization, receive, from the external electronic device through the Wi-Fi transceiver, a frame including first data within at least one discovery window (DW) among a plurality of DWs, wherein the first data comprises channel information for second data, and time information for the second data, and based on the channel information and the time information, control the Wi-Fi transceiver to receive the second data at a channel corresponding to the channel information of the received first data during a time duration corresponding to the time information of the received first data.Type: GrantFiled: October 8, 2020Date of Patent: September 13, 2022Inventors: Bu-Seop Jung, Young-Kwan Chung, Dong-Il Son, Yong-Hae Choi, Ju-Ho Kim, Christopher Kang, Hyuk Kang
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Patent number: 11430737Abstract: Provided is a printed circuit board including a laminate that is formed by vertically stacking a plurality of insulating layers including a rigid insulating layer, a flexible insulating layer having a first region in vertical contact with at least one of the plurality of insulating layers and a second region located on an outer side of the laminate, and a first electronic element embedded in the flexible insulating layer.Type: GrantFiled: August 12, 2019Date of Patent: August 30, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ho-Hyung Ham, Sa-Yong Lee, Ju-Ho Kim
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Patent number: 11420483Abstract: A tire noise reduction apparatus may include a housing mounted on an external circumferential surface of a wheel rim on which a tire is mounted, the housing having an internal space and being open at one side in a circumferential direction of the wheel rim, wherein the housing includes a neck at an opposite side which is opposite to the open one side; and a movable member inserted into the internal space of the housing through the open one side of the housing and having an internal space in fluidical communication with the internal space of the housing, the movable member being mounted to the housing to be movable in a direction in which the movable member is inserted into the internal space of the housing and in a direction in which the movable member is withdrawn out of the housing.Type: GrantFiled: January 31, 2019Date of Patent: August 23, 2022Assignees: Hyundai Motor Company, Kia Motors CorporationInventor: Ju Ho Kim
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Patent number: 11394130Abstract: An antenna includes a first dielectric layer having a first surface and a second surface, a second dielectric layer having a third surface and a fourth surface, and a reinforcing layer disposed between the first dielectric layer and the second dielectric layer and including an insulating material. A first adhesive layer is disposed between the first dielectric layer and the reinforcing layer, and a second adhesive layer is disposed between the second dielectric layer and the reinforcing layer. A first pattern layer is disposed on a surface of the first dielectric layer facing the first adhesive layer, and a second pattern layer is disposed on a surface of the second dielectric layer facing away from the second adhesive layer. The reinforcing layer has a first cavity penetrating a region between the first and second dielectric layers.Type: GrantFiled: July 2, 2020Date of Patent: July 19, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sangik Cho, Ju Ho Kim
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Publication number: 20220209397Abstract: An antenna board includes a first base board unit including a first insulating layer having a first receiving groove; a first antenna board unit disposed in the first receiving groove, including a second insulating layer and a third insulating layer disposed on the second insulating layer, and further including at least one of a first patch pattern disposed on the second insulating layer and covered by the third insulating layer and a second patch pattern disposed on the third insulating layer; and a first encapsulant covering at least a portion of the first antenna board unit and filling at least a portion of the first receiving groove, wherein a dielectric constant of the second insulating layer is different from a dielectric constant of the third insulating layer.Type: ApplicationFiled: February 23, 2021Publication date: June 30, 2022Inventors: Ju Ho Kim, Chan Jin Park
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Patent number: 11283174Abstract: An antenna includes a first dielectric layer having a first surface and a second surface opposing the first surface; a second dielectric layer having a third surface, and a fourth surface opposing the third surface; a third dielectric layer having a fifth surface and a sixth surface opposing the fifth surface; a first adhesive layer disposed between the second surface and the third surface; a second adhesive layer disposed between the fourth surface and the fifth surface; a patch pattern disposed on the second surface and embedded in the first adhesive layer; a first coupling pattern disposed on the fourth surface and embedded in the second adhesive layer, and a second coupling pattern disposed on the sixth surface. The patch pattern, the first coupling pattern, and the second coupling pattern at least partially overlap one another on a plane.Type: GrantFiled: June 18, 2020Date of Patent: March 22, 2022Inventors: Sangik Cho, Ju Ho Kim
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Patent number: 11272613Abstract: A printed circuit board includes: a laminate including a core layer and insulating layers stacked on first and second sides of the core layer; and a first antenna formed on a surface of the laminate. A thickness of the core layer is greater than a thickness of one of the insulating layers. A dielectric constant of the core layer is higher than a dielectric constant of the one of the insulating layers.Type: GrantFiled: November 5, 2019Date of Patent: March 8, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Tae-Hong Min, Ju-Ho Kim
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Patent number: 11266222Abstract: A cosmetic separately containing a different cosmetic material, which includes a cosmetic container; an impregnation member accommodated in the cosmetic container and impregnated with a cosmetic material; and a containing body provided separately from the cosmetic container, wherein the containing body contains another cosmetic material, and two kinds of cosmetic materials are mixed with each other for use while the containing body is placed on the impregnation member of the cosmetic container.Type: GrantFiled: May 25, 2017Date of Patent: March 8, 2022Assignee: AMOREPACIFIC CORPORATIONInventors: Jun Young Kim, Ju Ho Kim, Chang Gyu Yoo
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Patent number: 11194250Abstract: A metal oxide photosensitive resin composition for forming a blue pattern layer includes scattering particles including a metal oxide having an average particle diameter of 30 to 300 nm, provided that the metal oxide photosensitive resin composition does not include quantum dots.Type: GrantFiled: August 24, 2017Date of Patent: December 7, 2021Assignee: Dongwoo Fine-Chem Co., Ltd.Inventors: Hyun Jung Wang, Ju Ho Kim, Hyung Joo Kim, Sung Hun Hong
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Publication number: 20210375739Abstract: A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability is improved.Type: ApplicationFiled: August 13, 2021Publication date: December 2, 2021Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sung Han KIM, Masazumi AMAGAI, Ju Ho KIM, Tae Sung JEONG
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Patent number: 11166365Abstract: A printed circuit board includes: a first insulating layer; and a heat radiating circuit pattern disposed on a first surface of the first insulating layer and having a pad and a via. The heat radiating circuit pattern includes: a first metal layer disposed on the first insulating layer; a graphite layer disposed on the first metal layer; and a second metal layer disposed on the graphite layer.Type: GrantFiled: October 25, 2019Date of Patent: November 2, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: A-ran Lee, Kee-Ju Um, Ju-Ho Kim, Myeong-Hui Jung, Kyuong-Hwan Lim, Jin-Won Lee, Seung-On Kang, Jong-Guk Kim