Abstract: A tire noise reduction apparatus may include a housing mounted on an external circumferential surface of a wheel rim on which a tire is mounted, the housing having an internal space and being open at one side in a circumferential direction of the wheel rim, wherein the housing includes a neck at an opposite side which is opposite to the open one side; and a movable member inserted into the internal space of the housing through the open one side of the housing and having an internal space in fluidical communication with the internal space of the housing, the movable member being mounted to the housing to be movable in a direction in which the movable member is inserted into the internal space of the housing and in a direction in which the movable member is withdrawn out of the housing.

Abstract: A printed circuit board includes: a laminate including a core layer and insulating layers stacked on first and second sides of the core layer; and a first antenna formed on a surface of the laminate. A thickness of the core layer is greater than a thickness of one of the insulating layers. A dielectric constant of the core layer is higher than a dielectric constant of the one of the insulating layers.

Abstract: A printed circuit board including: a laminate having a plurality of stacked insulating layers including a rigid insulating layer; a flexible insulating layer having a partial region that overlaps and is in contact with at least one of the insulating layers and a remaining region disposed outside of the laminate; and a first antenna disposed on a surface of the laminate.

Abstract: A printed circuit board includes: a first insulating layer; and a heat radiating circuit pattern disposed on a first surface of the first insulating layer and having a pad and a via. The heat radiating circuit pattern includes: a first metal layer disposed on the first insulating layer; a graphite layer disposed on the first metal layer; and a second metal layer disposed on the graphite layer.

Abstract: A printed circuit board is provided. The printed circuit board includes an insulating material, and a circuit comprising a first region that partially penetrates the insulating material, and a second region formed on the first region and that protrudes from an upper portion of the insulating material, the first region includes a first electroplating layer and a first electroless plating layer that are formed between the insulating material and the first electroplating layer.

Abstract: Provided are a low-cost semiconductor device manufacturing method and a semiconductor device made using the method. The method includes forming multiple body regions in a semiconductor substrate, forming multiple gate insulating layers and multiple gate electrodes in the body region; implementing a blanket ion implantation in an entire surface of the substrate to form a low concentration doping region (LDD region) in the body region without a mask, forming a spacer at a side wall of the gate electrode, and implementing a high concentration ion implantation to form a high concentration source region and a high concentration drain region around the LDD region. According to the examples, devices have favorable electrical characteristics and at the same time, manufacturing costs are reduced. Since, when forming high concentration source region and drain regions, tilt and rotation co-implants are applied, an LDD masking step is potentially omitted.

Abstract: A fan-out sensor package includes: a first interconnection member having a through-hole; a sensor disposed in the through-hole of the first interconnection member and having an active surface having connection pads and microlenses disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the active surface or the inactive surface of the sensor; and a second interconnection member disposed on the first interconnection member and the inactive surface or the active surface of the sensor. The first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the sensor. A camera module includes the fan-out sensor package.

Abstract: A fan-out semiconductor package includes connection pads of a semiconductor chip that are redistributed and electrically connected to connection terminals by an interconnection member. In the fan-out semiconductor package, disposition forms of vias and pads in the interconnection member are designed so that stress may be reduced, such that reliability is improved.

Abstract: A cosmetic container including an impregnation member having the surface intaglio-patterned by laser beam machining is provided. The surface of the impregnation member is heated and burned by a laser to form an intaglio-pattern, and an intaglio-pattern part having the intaglio-pattern is formed with a width of 0.1 mm to 5.0 mm so that the intaglio-pattern part formed by the laser is maintained in the open cell structure and has the large discharge surface area, so a user easily adjusts an amount of discharged cosmetic material according to force applied to the impregnation member and use the cosmetic material. The cosmetic container includes an outer container having an open upper portion, an outer container lid coupled to the outer container, an inner container mounted inside the outer container, the impregnation member in the inner container and impregnated with cosmetic material and an inner container lid hinged with the inner container.

Abstract: A fan-out sensor package includes: a first interconnection member having a through-hole; a sensor disposed in the through-hole of the first interconnection member and having an active surface having connection pads and microlenses disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the active surface or the inactive surface of the sensor; and a second interconnection member disposed on the first interconnection member and the inactive surface or the active surface of the sensor. The first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the sensor. A camera module includes the fan-out sensor package.

Abstract: The present invention relates to a smart infant toilet system and a method thereof, and the system includes a first sensor mounted to an infant product to sense external temperature and humidity, a second sensor mounted to the infant product to sense gas, third sensor mounted to the infant product to sense whether an infant rides on the infant product, a control module configured to set critical temperature and humidity, and an alarming unit configured to provide an alarm to a guardian when it is determined that the comparative temperature and humidity are out of the preset range of the critical temperature and humidity.

Abstract: A fan-out sensor package includes: a core member including a wiring layer including a plurality of layers and having a through-hole; an integrated circuit (IC) for a sensor disposed in the through-hole; an encapsulant encapsulating at least portions of the core member and the IC for a sensor; and a connection member disposed on the core member and the IC for a sensor and including a plurality of circuit layers, wherein the circuit layer includes sensing patterns detecting a change in capacitance.

Abstract: The present invention relates to a cosmetic container comprising a refill container having a sealing ring and, more specifically, to a cosmetic container comprising a refill container having a sealing ring, the cosmetic container having a refill container holder embedded in an outer case, and having the refill container, which contains cosmetics, used by being coupled to the refill container holder, and improving refill convenience since after the cosmetics are completely used, a user easily separates the refill container from the refill container holder by pressing the refill container on the top thereof, and then can couple a new refill container to the refill container holder from the bottom of the outer case, thereby easily replacing the refill container.

Abstract: A fan-out sensor package includes: a first interconnection member having a through-hole; a sensor disposed in the through-hole of the first interconnection member and having an active surface having connection pads and microlenses disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the active surface or the inactive surface of the sensor; and a second interconnection member disposed on the first interconnection member and the inactive surface or the active surface of the sensor. The first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the sensor. A camera module includes the fan-out sensor package.

Abstract: According to the present invention, a spontaneous-emission type photosensitive resin composition comprises a cardo-based binder resin comprising at least one repeating unit of chemical formula 1 to chemical formula 4.

Abstract: A metal oxide photosensitive resin composition for forming a blue pattern layer includes scattering particles including a metal oxide having an average particle diameter of 30 to 300 nm, provided that the metal oxide photosensitive resin composition does not include quantum dots.

Abstract: An electronic device in a neighbor awareness networking (NAN) cluster is provided. The electronic device includes a wireless fidelity (Wi-Fi) transceiver; and a processor, coupled with the Wi-Fi transceiver, configured to perform a synchronization with at least one device in the NAN cluster, wherein the at least one device comprises an external electronic device, after performing the synchronization, receive, from the external electronic device through the Wi-Fi transceiver, a frame including first data within at least one discovery window (DW) among a plurality of DWs, wherein the first data comprises channel information for second data, and time information for the second data, and based on the channel information and the time information, control the Wi-Fi transceiver to receive the second data at a channel corresponding to the channel information of the received first data during a time duration corresponding to the time information of the received first data.

Abstract: A baby carrier is provided. The baby carrier includes a body part, a pair of shoulder bands coupled to opposite sides of an upper portion of the body part, a waist band coupled to a lower portion of the body part, a load control unit which is coupled to the waist band and is changed to any one posture of a first posture and a second posture to switch a load-applied direction. A ratio of loads applied to the shoulder bands and the waist band is changed in response to the load control unit being changed from the one posture of the first posture and the second posture to the other posture of the first posture and the second posture.

Abstract: An electronic device and a method of an electronic device are provided. The electronic device includes a receiver, and a processor configured to receive first proximity service data through the receiver, wherein the first proximity service data comprises guide information that contains information indicating a device for transmitting second proximity service data and a transmission time point of the second proximity service data. The method of an electronic device includes receiving first proximity service data, wherein the first proximity service data comprises guide information that contains information indicating a device for transmitting second proximity service data and a transmission time point of the second proximity service data.

Abstract: A photosensitive resin composition according to an example embodiment of the present disclosure includes a quantum dot, a photopolymerizable compound, a photopolymerization initiator, an alkali-soluble resin, and a solvent, wherein the alkali-soluble resin includes at least one of a monomer represented by Formula 1 and a monomer represented by Formula 2: