Abstract: A circuit assembly includes an integrated circuit (IC) die and a capacitor die. The IC die has a first hybrid bonding layer. The capacitor die is stacked with the IC die, and is configured to include a capacitor coupled to the IC die, and has a second hybrid bonding layer in contact with the first hybrid bonding layer; wherein the IC die is electrically coupled to the capacitor die through the first hybrid bonding layer and the second hybrid bonding layer.

Abstract: A method for manufacturing a semiconductor structures is provided. The method includes forming a first hybrid bonding layer over a first wafer having a logic structure, forming a second hybrid bonding layer over a second wafer having a first capacitor structure, bonding the first wafer and the second wafer through a hybrid bonding operation to connect the first hybrid bonding layer and the second hybrid bonding layer, thereby obtaining a first bonded wafer, and the first capacitor structure is electrically connected to the logic structure through the first hybrid bonding layer and the second hybrid bonding layer, and singulating the first bonded wafer to obtain a plurality of semiconductor structures.

Abstract: An information handling system may include a host system comprising a host system processor and a management controller communicatively coupled to the host system processor and configured to perform out-of-band management of a plurality of devices of the information handling system, and further configured to, during a powering on of the host system randomly select a subset of one or more devices of the plurality of devices for partial validation of firmware of the plurality of devices, randomly select a plurality of offsets associated with the one or more devices for partial verification of the firmware, and perform verification of the one or more devices at the plurality of offsets.

Abstract: A circuit assembly includes an integrated circuit (IC) die and a first capacitor die. The IC die provides an IC and includes a plurality of first conductive pads. The first capacitor die provides a plurality of capacitors, and includes a plurality of second conductive pads at the first side and a plurality of conductive vias at the second side. At least one of the second conductive pads electrically connects to the capacitors. The conductive vias is adapted to form a plurality of external signal connections of the IC die and the first capacitor die. The IC die is stacked with the first capacitor die in such a way that the first conductive pads electrically connect to the second conductive pads, and surfaces of the IC die and the first capacitor die attaching to each other are substantially of the same size.

Abstract: The present disclosure relates to an integrated light receiving and emitting device combined with a control circuit wafer and a manufacturing method thereof. The integrated light receiving and emitting device combined with a control circuit wafer according to an exemplary embodiment of the present disclosure includes: a light receiving and emitting unit which has an integrated wafer structure in which a light emitting unit and a light receiving unit are vertically formed on one surface of a single semiconductor substrate by wafer patterning and a control circuit wafer which is combined with the light receiving and emitting unit by vertical bonding to be operated as a single chip device, in which the control circuit wafer is connected to the light emitting unit and the light receiving unit.

Abstract: Disclosed are a device and a method for user authentication using a security card. The device for user authentication comprises: a card reader which, when a card is recognized, acquires a face image stored in the card; an infrared light source which emits infrared rays toward a user; an infrared camera which acquires an infrared image including the facial region of the user; a color camera which acquires a color image including the facial region of the user; and a control unit which determines a result of user authentication on the basis of at least one of the infrared image, the color image, and the face image, and generates a control signal according to the result of user authentication.

Abstract: An intersection traffic control method, apparatus and system are provided.

Abstract: A blockchain-based user privacy data providing method and apparatus is provided. The method includes receiving a data consumption request from a data consumer, where the data consumption request requests user privacy data of a target user, the user privacy data includes personal data that is pre-encrypted and uploaded to a trusted execution environment (TEE), and the TEE is constructed in a blockchain node; performing predetermined verification on the data consumption request in the TEE based on request body data corresponding to the data consumption request using a smart contract deployed in the blockchain to obtain a corresponding predetermined verification result; if the predetermined verification result satisfies a verification success condition, obtaining target privacy data for the data consumption request, and sending the encrypted target privacy data to the data consumer, where the target privacy data is obtained in the TEE based on the user privacy data stored in the blockchain.

Abstract: A system for controlling power settings is provided that includes a plurality of components, each component configured to implement a power control algorithm. A controller is coupled to each component and configured to control a power state of each component as a function of the power control algorithm for each component. The controller comprises a state machine having a plurality of states, wherein the power control algorithm of each component is controlled by the controller as a function of a state of the state machine.

Abstract: A system for setting a power cap state is disclosed. The system includes a plurality of power monitor sensors generating power monitor sensor data and a plurality of thermal monitor sensors generating thermal monitor sensor data. A controller has a plurality of inputs configured to receive the power monitor sensor data and the thermal monitor sensor data, to assign a priority to one of two or more power cap states and to generate a control signal. A power limiting circuit coupled to the controller is configured to receive the control signal and to modify one or more power settings.

Abstract: The present disclosure provides a grinding wheel cutting apparatus comprising a first laser distance sensor, a master controller and a grinding wheel. The first laser distance sensor is communicatively coupled to the master controller. The laser distance sensor is configured to obtain an outer diameter of a rod workpiece. The master controller is configured to determine a segment length of a segment to be cut from the rod workpiece based on the outer diameter, a material density of the rod workpiece and a preset segment weight. The master controller is configured to perform a control to circularly cut the rod workpiece with the grinding wheel according to the segment length. The present disclosure further relates to a cutting method using the grinding wheel cutting apparatus.

Abstract: A touch sensor includes a substrate, and an electrode formed from a conductive stack structure including a first conductive oxide layer, a copper-containing metal layer and a second conductive oxide layer sequentially stacked from the substrate. The first conductive oxide layer and the second conductive oxide layer each include a copper-metal oxide. Chemical and mechanical stability of an electrode may be improved by the first and second conductive oxide layers.

Abstract: The present disclosure relates to a single OPA (optical phased array) device including a light source; a waveguide which extends from the light source to allow light incident from the light source to pass through; a plurality of modulators which is disposed in the waveguide to modulate a phase of light in the waveguide; a two-dimensional material layer which passes or absorbs light incident from the light source; and an electrode which supplies charges to the two-dimensional material layer, in which the light incident from the light source passes through the two-dimensional material layer, the waveguide, and the modulator and is reflected by an external target of the single OPA device to pass through the modulator and the waveguide, and then absorbed by the two-dimensional material layer.

Abstract: A touch sensor according to an embodiment of the present invention includes a substrate layer, sensing electrodes arranged on a top surface of the substrate layer, the sensing electrodes having boundaries in which a plurality of convex portions are connected, and a dummy electrode disposed between the sensing electrodes, the dummy electrode having a boundary in which a plurality of convex portions are connected. The sensing electrodes include a first sensing electrode arranged in a column direction and a second sensing electrode arranged in a row direction. A convex portion in a region where the first sensing electrode, the second sensing electrode and the dummy electrode are adjacent to each other has a radius of curvature less than that of a convex portion in other regions.

Abstract: A method for registering customer premises equipment to provide an Internet service to the customer premises equipment by a network management apparatus of an access network structure, wherein the network management apparatus and the customer premises equipment are connected through a bundle cable including a plurality of lines in the access network structure, the method includes: transmitting a registration signal toward a customer premises equipment; receiving registration response signals transmitted from the customer premises equipment through the plurality of lines; analyzing the registration response signals introduced from the plurality of lines and distinguishing a direct signal transmitted through a properly connected line and interference signal from the registration response signals; and establishing a link with the customer premises equipment connected to the properly connected line.

Abstract: An integrated circuit chip includes an SOI substrate having a structure in which a bulk substrate, a buried insulating film, and a semiconductor body layer are sequentially stacked, a conductive ion implantation region formed at a position adjacent to the buried insulating film in the bulk substrate, an integrated circuit portion formed on an active surface of the semiconductor body layer, and a penetrating electrode portion arranged at a position spaced apart from the integrated circuit portion in a horizontal direction, the penetrating electrode portion penetrating the semiconductor body layer and the buried insulating layer in a vertical direction, and the penetrating electrode portion connected to the conductive ion implantation region. An integrated circuit package and a display device include the integrated circuit chip.

Abstract: Solutions for processing a redundant array of storage drives receiving a rebuilding request of a redundant array of storage drives. The redundant array has a first storage drive to be replaced. In response to no spare storage drive being available to logically replace the first storage drive, a second storage drive is identified, which is a source storage drive of a disk balance process being performed. A rebuilding of the redundant array is initiated by reconstructing data of the first storage drive on the second storage drive during the disk balance process.

Abstract: Disclosed is a method of preparing krill oil. A method of preparing krill oil may include providing a dried krill powder; obtaining an extract after adding spirits of wine to the dried krill powder; obtaining a passing solution from which salt and cholesterol are removed by passing the extract through a column; obtaining a krill concentrate by decompression-concentrating the passing solution; and obtaining krill oil by stationarily positioning a mixture obtained by adding spirits of wine to the krill concentrate, layer-separating the stationarily positioned mixture, extracting a supernatant of the layer-separated mixture, and concentrating the extracted supernatant.