Abstract: A system for controlling power settings is provided that includes a plurality of components, each component configured to implement a power control algorithm. A controller is coupled to each component and configured to control a power state of each component as a function of the power control algorithm for each component. The controller comprises a state machine having a plurality of states, wherein the power control algorithm of each component is controlled by the controller as a function of a state of the state machine.

Abstract: Integrated circuits (ICs)—depending on a current workload—may exceed thermal cooling budgets. As a result, ICs often implement thermal sensors to measure temperatures at junctions or hot spots along the IC. Due to a distance between the thermal sensors and the various junctions, a thermal offset may be added to the temperature readings from the thermal sensors to more accurately estimate the temperature at the junctions. To account for different workload distributions—e.g., asymmetric or symmetric—the systems and methods described herein may dynamically adjust the thermal offsets. As a result, the efficiency of the IC may be increased as thermal settings for the IC may take into account the ability of the thermal cooling budget to effectively cool the IC under a current operating condition—thereby reducing premature throttling back or shutting down of power to the IC.

Abstract: Integrated circuits (ICs)—depending on a current workload—may exceed thermal cooling budgets. As a result, ICs often implement thermal sensors to measure temperatures at junctions or hot spots along the IC. Due to a distance between the thermal sensors and the various junctions, a thermal offset may be added to the temperature readings from the thermal sensors to more accurately estimate the temperature at the junctions. To account for different workload distributions—e.g., asymmetric or symmetric—the systems and methods described herein may dynamically adjust the thermal offsets. As a result, the efficiency of the IC may be increased as thermal settings for the IC may take into account the ability of the thermal cooling budget to effectively cool the IC under a current operating condition—thereby reducing premature throttling back or shutting down of power to the IC.

Abstract: An integrated circuit chip includes an SOI substrate having a structure in which a bulk substrate, a buried insulating film, and a semiconductor body layer are sequentially stacked, a conductive ion implantation region formed at a position adjacent to the buried insulating film in the bulk substrate, an integrated circuit portion formed on an active surface of the semiconductor body layer, and a penetrating electrode portion arranged at a position spaced apart from the integrated circuit portion in a horizontal direction, the penetrating electrode portion penetrating the semiconductor body layer and the buried insulating layer in a vertical direction, and the penetrating electrode portion connected to the conductive ion implantation region. An integrated circuit package and a display device include the integrated circuit chip.

Abstract: A deammonification system 100 and process for treating wastewater are disclosed herein. The system and process may involve an anaerobic reactor 204 operable to produce biogas 2 from organic carbon in the wastewater 1, and a deammonification unit including (i) one or more anoxic chambers 302 in fluid communication with the anaerobic reactor 204, wherein each of the one or more anoxic chambers 302 houses a plurality of biocarriers 306, wherein each of the plurality of biocarriers 306 includes a biofilm of anaerobic ammonium oxidation bacteria, and (ii) one or more oxic chambers 304 operable to produce nitrite from ammonia and/or ammonium, wherein the wastewater processed in an anoxic chamber 302 of the one or more anoxic chambers 302 is channeled to an oxic chamber 304 of the one or more oxic chambers 304 which is adjacent to and downstream of the anoxic chamber 302.

Abstract: The present invention relates to a car wing type rainwater shield device that is configured to have bat wing-like shields unfolded to the outsides of a car when it rains, while the shields are being controlled in such a manner as to be moved up and down according to the amount of rain. The car wing type rainwater shield device includes: shield bodies located on both top sides of a car; a rainwater sensor located on one side of the car to sense changes in an outside environment of the car; and a controller adapted to produce a driving signal for the shield bodies according to a signal inputted by a user's terminal or a signal value measured by the rainwater sensor and to control upward and downward movements of the shield bodies and a degree of unfolding of the shield bodies according to the signal value measured by the rainwater sensor in a state where the shield bodies are driven.

Abstract: A computer-implemented method includes: receiving, by a platform including one or more computing devices, a blockchain authorization information generation request from a client, in which the blockchain authorization information generation request includes a target blockchain identifier and user information; determining, based on the target blockchain identifier, a target blockchain; determining a blockchain parameter of the target blockchain, in which the blockchain parameter indicates one or more requirements for authorization information used to join the target blockchain; generating blockchain authorization information based on the blockchain parameter and the user information, in which the blockchain authorization information conforms to the one or more requirements; and sending the blockchain authorization information to the client.

Abstract: A touch sensor according to an embodiment of the present invention includes a substrate layer, and sensing electrodes arranged on the substrate layer. The sensing electrodes includes a stacked structure of a transparent oxide electrode layer and a metal layer, and has an optical ratio of 5 or less. A structure of high transmittance and low reflectance can be implemented by a control of the optical ratio of the sensing electrodes.

Abstract: A method for manufacturing a semiconductor structures is provided. The method includes forming a first hybrid bonding layer over a first wafer having a logic structure, forming a second hybrid bonding layer over a second wafer having a first capacitor structure, bonding the first wafer and the second wafer through a hybrid bonding operation to connect the first hybrid bonding layer and the second hybrid bonding layer, thereby obtaining a first bonded wafer, and the first capacitor structure is electrically connected to the logic structure through the first hybrid bonding layer and the second hybrid bonding layer, and singulating the first bonded wafer to obtain a plurality of semiconductor structures.

Abstract: Disclosed is a device which incorporates a process by which an absorptive material is used to absorb fluid, the weight of said fluid causes the device to move without any outside energy source. The fluid, by way of evaporation or by being absorbed into another absorptive material, substantially disappears, causing the device to return back to its starting position on its own, and repeat the process. The fluid, which is stocked in a holding area, remains stagnant, until the device in its starting position is made in contact with the fluid by use of a counterweight, and thereby absorbs the fluid, however, when the device is saturated, the greater volume of absorbent on one side causes the device to move to its activated position. In its activated position, the device is not exposed to the fluid and therefore remains until the fluid is evaporated or absorbed into another absorbent.

Abstract: The present utility model discloses an air-purifying apparatus. The air-purifying apparatus comprises a filter screen, filter screen type determining component, and filter screen service life determining component. The filter screen is for filtering particles and at least one of specific chemical matters in the air. The filter screen determining component is configured to determine a type of the filter screen. The filter screen service life determining component is configured to determine whether the filter screen needs to be changed according to the determined type of the filter screen and a use condition of the filter screen. With the air-purifying device of the present disclosure, remaining service lives of the filter screens of different types or specifications may be obtained, then a user may be prompted when the filter screen needs to be changed, thereby allowing the user to maintain a good air-purifying effect at any time.

Abstract: A semiconductor device includes: a substrate including a first region and a second region; a first gate stack on the first region of the substrate; a first source/drain contact at a first side of the first gate stack, wherein the first source/drain contact is connected to the substrate; a second gate stack on the second region of the substrate; and a second source/drain contact at a first side of the second gate stack, wherein the second source/drain contact is connected to the substrate, wherein a height of the second source/drain contact is greater than a height of the first source/drain contact, and wherein a width of the second source/drain contact is greater than a width of the first source/drain contact.

Abstract: An improved touch sensor comprising a first sensing electrode unit formed on a substrate in a first direction and a second sensing electrode unit formed on the substrate in a second direction crossing the first direction. A plurality of fine etching patterns are formed in boundary portions of unit transparent electrodes included in the first sensing electrode unit and the second sensing electrode unit. Each unit transparent electrode may have a shape in which a portion of a curved line connecting the vertices of a polygon is removed. Adjacent unit transparent electrodes may be electrically connected to one another. The improved touch sensor prevents a transparent electrode from being visible to a user sensor and also results in the prevention of a reduction in light transmittance caused by the transparent electrode as well as the prevention a reduction in optical quality due to a moiré phenomenon.

Abstract: A touch sensor according to an embodiment of the present invention includes a substrate layer, and sensing electrodes which are disposed on the substrate layer, and have etching regions formed therein in a periodically repeated manner and respectively having a width of 5 to 15 ?m. Through the etching regions, transmittance may be improved and optical interference with an image display device may be reduced. The present invention also provides a window stack structure and an image display device including the touch sensor.

Abstract: There are provided isotope-enriched compounds of Formula (I) and pharmaceutically acceptable salts or esters thereof, as well as pharmaceutical compositions thereof and methods of use thereof for prevention and treatment of amyloid-? related diseases, such as Alzheimer's disease.

Abstract: The present disclosure relates to an unmanned lane keeping method and device, a computer device, and a storage medium. The method includes that: a vehicle road image collected by a data collector of the vehicle is received; the vehicle road image is transmitted to a preset DNN model of the vehicle for processing to obtain a steering wheel angle corresponding to the vehicle road image, wherein the DNN model of the vehicle is established by deep learning, and is used for characterizing a correspondence between the vehicle road image and the steering wheel angle; and the vehicle is controlled to keep driving in a corresponding lane according to the steering wheel angle.

Abstract: Aspects of the present disclosure involve systems, methods, devices, and the like for fraudulent scheme detection. In one embodiment, a time-evolving graph-based solution is presented for the Ponzi scheme detection. For the solution, unbounded and time-based relational data is transformed to the time-evolving graph structure. Time-based aggregate metrics are computed and captured based in part on changes occurring within user accounts and transactions identified within the time-evolving graph structure. Then, with the aid of know pattern flows and the application of filtering rules, detection of such a fraudulent scheme may be accomplished.

Abstract: A blockchain-based user privacy data providing method and apparatus is provided. The method includes receiving a data consumption request from a data consumer, where the data consumption request requests user privacy data of a target user, the user privacy data includes personal data that is pre-encrypted and uploaded to a trusted execution environment (TEE), and the TEE is constructed in a blockchain node; performing predetermined verification on the data consumption request in the TEE based on request body data corresponding to the data consumption request using a smart contract deployed in the blockchain to obtain a corresponding predetermined verification result; if the predetermined verification result satisfies a verification success condition, obtaining target privacy data for the data consumption request, and sending the encrypted target privacy data to the data consumer, where the target privacy data is obtained in the TEE based on the user privacy data stored in the blockchain.

Abstract: An integrated circuit (IC) chip includes a via contact plug extending inside a through hole passing through a substrate and a device layer, a via contact liner surrounding the via contact plug, a connection pad liner extending along a bottom surface of the substrate, a dummy bump structure integrally connected to the via contact plug, and a bump structure connected to the connection pad liner. A method of manufacturing an IC chip includes forming an under bump metallurgy (UBM) layer inside and outside the through hole and forming a first connection metal layer, a second connection metal layer, and a third connection metal layer. The first connection metal layer covers the UBM layer inside the through hole, the second connection metal layer is integrally connected to the first connection metal layer, and the third connection metal layer covers the UBM layer on the connection pad liner.

Abstract: An integrated circuit chip includes a circuit structure, a grounding structure, a bonding layer between the circuit structure and the grounding structure. The circuit structure includes a first substrate, an FEOL structure, and a BEOL structure. The grounding structure includes a second substrate and a grounding conductive layer. The integrated circuit chip includes a first penetrating electrode portion connected to the grounding conductive layer based on extending through the first substrate, the FEOL structure, the BEOL structure, and the bonding layer such that the first penetrating electrode portion is isolated from direct contact with the integrated circuit portion in a horizontal direction extending parallel to an active surface of the first substrate. An integrated circuit package and a display device each include the integrated circuit chip.