Abstract: The present invention provides a thermally curable resin sheet for sealing a semiconductor chip having excellent reliability and storability while being reduced in warpage deformation due to the volume shrinkage of the thermally curable resin sheet, and a method for manufacturing a semiconductor package. The present invention relates to a thermally curable resin sheet for sealing a semiconductor chip, wherein an activation energy (Ea) satisfies the following formula (1), a glass transition temperature of a product thermally cured at 150° C. for 1 hour is 125° C. or higher, and a thermal expansion coefficient ? [ppm/K] of the thermally cured product at the glass transition temperature or lower and a storage modulus E? [GPa] at 25° C. of the thermally cured product satisfy the following formula (2): 30?Ea?120 [kJ/mol]??(1); and 10,000??×E??300,000 [Pa/K]??(2).

Abstract: An intention estimated-weight determination processor 9 determines an intention estimated weight on the basis of an intention hierarchical graphic data 8 and an activated intention. A transfer node determination processor 10 determines an intention to be newly activated through transition, after correcting an intention estimation result according to the intention estimated weight. A dialog turn generator 13 generates a turn of dialog from the activated intention. A dialog management unit 2 controls, when a new input is provided due to the turn of dialog, at least one process among processes performed by an intention estimation processor 7, the intention estimated-weight determination processor 9, the transition node determination processor 10 and the dialog turn generator 13, followed by repeating that controlling, to thereby finally execute a setup command.

Abstract: A read wiring trace and a write wiring trace are formed on an insulating layer. Connection terminals made of conductor are connected to the read wiring trace and the write wiring trace, respectively. Each connection terminal has at least one corner with a radius of curvature of not larger than 35 ?m.

Abstract: A pickup device includes: a speed detector which is configured to detect speed of vibration of a soundboard of an acoustic musical instrument; and a signal generator which is configured to generate an audio signal from the speed detected by the speed detector and to output the audio signal.

Abstract: A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive pattern, and a second insulating layer. The first and second insulating layers include first and second openings which expose both surfaces of the conductive pattern. The conductive pattern has the surface on the other side thereof in a thickness direction which is exposed through the first opening and configured as a first terminal portion, and the surface on one side thereof in the thickness direction which is exposed through the second opening and configured as a second terminal portion. The metal supporting layer includes a third opening which exposes the first terminal portion and a covering portion of the first insulating layer which covers the conductive pattern continued to the first terminal portion, and a reinforcing portion located on a surface on the other side of the covering portion in the thickness direction.

Abstract: A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board. The terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction.

Abstract: Provided are a sealing sheet having excellent flexibility and capable of producing an electronic component package which is highly reliable even if an object to be sealed has a hollow structure, a method for manufacturing the sealing sheet, and a method for manufacturing the electronic component package. The present invention is a sealing sheet containing dispersed domains of an elastomer, the domains having a maximum diameter of 20 ?m or less.

Abstract: A sheet processing apparatus includes a sheet tray on which one or more sheets to be processed are placed, an adhesive applying unit having an end portion that faces the sheet tray and holds an adhesive material and configured to move towards the sheet tray up to a position at which the end portion is in contact with or proximate to a sheet on the sheet tray and apart from the sheet tray, a pressing member configured to move into and out of a moving path of the adhesive applying unit and a control unit. The control unit is configured to cause the pressing member to be in the moving path of the adhesive applying unit when the pressing member is moved towards the sheet tray, such that the pressing member is pressed against a sheet on the sheet tray by the adhesive applying unit.

Abstract: A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board. The terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction.

Abstract: A speech recognition device includes: a speech recognition unit 23a that performs speech recognition for input speech; a reading information conversion data base in which a reading information conversion rule L is registered; a reading information conversion unit 27a that converts reading information of the word among the languages based on the rule L; and a speech recognition control unit 24a that performs control such that, when a word in a different language that is different from a predetermined language is included in a recognition subject vocabulary in which a speech recognition unit 23a refers to recognition subject word information E, the unit 27a converts the reading information in the different language into reading information in the predetermined language, and that the unit 23a performs the speech recognition that makes reference to the recognition subject word information of the corresponding word, including the converted reading information in the predetermined language.

Abstract: A wired circuit board includes an insulating layer, and a conductive layer including a wire covered with the insulating layer and a terminal continued to the wire to electrically connect the wire to an electronic element. The insulating layer is formed with an insulating opening exposing the terminal, and the terminal is formed in a pattern which is indented in a thickness direction.

Abstract: A connector includes: a first connector terminal to which a first electric cable is to be connected; a second connector terminal to which a second electric cable is to be connected; a sidewall that surrounds the first connector terminal and the second connector terminal; a protection cover; and an interlock mechanism. The interlock mechanism includes an interlock connector and an interlock pin. The interlock connector is disposed between the first connector terminal and the second connector terminal, and the interlock pin is provided at the protection cover and is positioned such that the interlock pin is inserted into the interlock connector when the protection cover is attached to the sidewall.

Abstract: An acquirer (101) acquires, when a first product is dropped into an electronic cart, a second product similar to the first product, a first bonus provided on condition that an order for the first product is placed, and a second bonus provided on condition that an order for the second product is placed. A presenter (102) presents a form in which a first object related to the first product dropped into the electronic cart is arranged and a second object related to the acquired second product is further arranged, if the acquired second bonus is more advantageous than the acquired first bonus. An acceptor (103) accepts an order for the first product if the first object is operated. A cart manager (104) drops the second product in the electronic cart if the second object is operated.

Abstract: A suspension board with circuit for mounting a slider unit including an electron device, the electron device being mounted so as to form, when projected in the thickness direction with respect to the slider provided with a magnetic head, an overlapping portion that overlaps with the slider, and a protruding portion that protrudes from the slider. The suspension board with circuit is formed with a first opening penetrating in the thickness direction and accommodates the overlapping portion, and a second opening that communicates with the first opening and accommodates the protruding portion.

Abstract: A heating device includes first and second heating rollers and first and second pressing rollers. The first pressing roller and the second heating roller forms a first unit, and the second pressing roller and the first heating roller forms a second unit that is rotatable about a rotational axis relative to the first unit. The heating device also includes an eccentric shaft unit disposed on one of the first unit and the second unit and extending in a direction parallel to the rotational axis, a rotational position of an eccentric portion of the eccentric shaft unit being changeable, and an engaging unit disposed on the other one of the first unit and the second unit, and configured to engage with the eccentric shaft, a position of the second unit relative to the first unit being adjusted when the rotational position of the eccentric portion of the eccentric shaft unit is changed.

Abstract: An audio signal output from a tone generator 14 is fed into a coil 16 provided in a transducer for vibrating a sound board, so that a sound signal is generated by the vibration of the sound board. A microcomputer 30 obtains temperature values of the coil 16 measured by two different methods, and suspends supply of audio signals to the coil 16 or reduces the amount of audio signals supplied to the coil 16 if the difference between the two coil temperature values is outside a predetermined range. In a case as well where one of the two coil temperature values has risen excessively, the microcomputer 30 suspends supply of audio signals to the coil 16 or reduces the amount of audio signals supplied to the coil 16.

Abstract: A boost converter capable of reducing a common-mode current that flows to the outside of a casing. In the converter, a boost circuit includes first and second inductors and at least one switching element electrically connected therebetween. A controller turns on and off the at least one switching element to boost an input voltage of the boost circuit. A first floating capacitor is formed between a first electrical path, which is at the same potential as a junction between the at least one switching element and the first inductor, and a mounting member coupled to a reference potential member with an insulator therebetween. A second floating capacitor is formed between a second electrical path, which is at the same potential as a junction between the at least one switching element and the second inductor, and the mounting member.

Abstract: A heating device includes first and second heating rollers and first and second pressing rollers. The first pressing roller and the second heating roller forms a first unit, and the second pressing roller and the first heating roller forms a second unit that is rotatable about a rotational axis relative to the first unit. The heating device also includes an eccentric shaft unit disposed on one of the first unit and the second unit and extending in a direction parallel to the rotational axis, a rotational position of an eccentric portion of the eccentric shaft unit being changeable, and an engaging unit disposed on the other one of the first unit and the second unit, and configured to engage with the eccentric shaft, a position of the second unit relative to the first unit being adjusted when the rotational position of the eccentric portion of the eccentric shaft unit is changed.

Abstract: An audio signal that is output from a sound source circuit (14) is caused to flow through a coil (16) in a transducer for vibrating a soundboard, and the vibration of the soundboard generates an acoustic signal. A microcomputer (30) calculates a temperature of the coil (16) with high accuracy by inputting an ambient temperature (Ta) detected by an ambient temperature sensor (21) and a voltage (V) applied to the coil (16) and executing computation based on a thermal equivalent circuit of an acoustic signal converter using the ambient temperature and the voltage that are input thereto, the computation including calculation of an amount of electric power consumed in the coil (16) using the input voltage.

Abstract: An audio signal output from a tone generator is fed into a coil provided in a transducer for vibrating a sound board, so that a sound signal is generated by the vibration of the sound board. A predetermined DC voltage supplied by a constant voltage source circuit is superimposed on the audio signal by an adding circuit, so that the superimposed signal is fed into the coil. A current passing through the coil is sensed by a current sensing resistor, so that only a DC voltage component of a voltage signal on the both ends of the resistor is extracted by a low-pass filter circuit to be supplied to a microcomputer via an A/D converting circuit. The microcomputer figures out a resistance value and a temperature of the coil by use of the DC voltage component and the certain DC voltage value.