Abstract: A method includes depositing a plurality of layers on a substrate, patterning a first mask overlying the plurality of layers, and performing a first etching process on the plurality of layers using the first mask. The method also includes forming a polymer material along sidewalls of the first mask and sidewalls of the plurality of layers, and removing the polymer material. The method also includes performing a second etching process on the plurality of layers using the remaining first mask, where after the second etching process terminates a combined sidewall profile of the plurality of layers comprises a first portion and a second portion, and a first angle of the first portion and a second angle of the second portion are different to each other.

Abstract: A structure and a formation method of a semiconductor device are provided. The semiconductor device structure includes a semiconductor substrate and an interconnection structure over the semiconductor substrate. The semiconductor device structure also includes a first conductive pillar over the interconnection structure. The first conductive pillar has a first protruding portion extending towards the semiconductor substrate from a lower surface of the first conductive pillar. The semiconductor device structure further includes a second conductive pillar over the interconnection structure. The second conductive pillar has a second protruding portion extending towards the semiconductor substrate from a lower surface of the second conductive pillar. The first conductive pillar is closer to a center point of the semiconductor substrate than the second conductive pillar. A bottom of the second protruding portion is wider than a bottom of the first protruding portion.

Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.

Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes a first conductive line over the substrate. The chip structure includes an insulating layer over the substrate and the first conductive line. The chip structure includes a conductive pillar over the insulating layer. The conductive pillar is formed in one piece, the conductive pillar has a lower surface, a protruding connecting portion, and a protruding locking portion, the protruding connecting portion protrudes from the lower surface and passes through the insulating layer and is in direct contact with the first conductive line, the protruding locking portion protrudes from the lower surface and is embedded in the insulating layer. The chip structure includes a solder bump on the conductive pillar. The solder bump is in direct contact with the conductive pillar.

Abstract: An obstacle recognition method and apparatus, and a related device are provided. The method includes: obtaining an actual path loss value between a first AP and a second AP, path loss value pairs between a terminal and a plurality of AP pairs, and path loss values of the plurality of AP pairs; obtaining, based on the path loss value pairs between the terminal and the plurality of AP pairs, an AP pair similar to an AP pair formed by the first AP and the second AP; obtaining a second path loss value between the first AP and the second AP based on a path loss value of the similar AP pair; and comparing the second path loss value between the first AP and the second AP with the actual path loss value, to determine whether an obstacle exists between the first AP and the second AP.

Abstract: The invention provides a millimeter wave radar modeling-based method for object visibility determination, to solve the problem of object visibility determination based on virtual sensor modeling in intelligent vehicle simulation and testing, and improve the fidelity of sensor modeling while meeting simulation efficiency requirements. It includes the steps of target vehicle information detection to obtain target vehicle information; target vehicle reflection intensity simulation: for each target vehicle performing geometry culling on the target vehicle, discarding completely-invisible target vehicles, and calculating visible section information for each target vehicle that has a visible section, and reflection intensity calculation; target vehicle visibility determination: analyzing visibility of the target vehicle according to the target vehicle reflection intensity, and converting and outputting information of a visible object into an expression form of a real millimeter-wave radar sensing an object.

Abstract: An apparatus for forming a package structure is provided. The apparatus includes a processing chamber for bonding a first package component and a second package component. The apparatus also includes a bonding head disposed in the processing chamber. The bonding head includes a plurality of vacuum tubes communicating with a plurality of vacuum devices. The apparatus further includes a nozzle connected to the bonding head and configured to hold the second package component. The nozzle includes a plurality of first holes that overlap the vacuum tubes. The nozzle also includes a plurality of second holes offset from the first holes, wherein the second holes overlap at least two edges of the second package component. In addition, the apparatus includes a chuck table disposed in the processing chamber, and the chuck table is configured to hold and heat the first package component.

Abstract: A method includes attaching a die to a thermal compression bonding (TCB) head through vacuum suction, wherein the die comprises a plurality of conductive pillars, attaching a first substrate to a chuck through vacuum suction, wherein the first substrate comprises a plurality of solder bumps, contacting a first conductive pillar of the plurality of conductive pillars to a first solder bump of the plurality of solder bumps, wherein contacting the first conductive pillar to the first solder bump results in a first height between a topmost surface of the first conductive pillar and a bottommost surface of the first solder bump, and adhering the first solder bump to the first conductive pillar to form a first joint, wherein adhering the first solder bump to the first conductive pillar comprises heating the TCB head.

Abstract: An information handling system may include at least one processor; and a non-transitory memory coupled to the at least one processor; wherein the information handling system is configured to manage an information handling system cluster by providing a command line interface between a user and a daemon service configured to execute user commands; wherein the command line interface implements a proxy subcommand that is configured to accept other commands; and wherein, when an other command is received, the daemon service is configured to parse the other command and dispatch the parsed other command to a particular backend service.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate having a surface. The semiconductor device includes a conductive pad over a portion of the surface. The conductive pad has a curved top surface, and a width of the conductive pad increases toward the substrate. The semiconductor device includes a device over the conductive pad. The semiconductor device includes a solder layer between the device and the conductive pad. The solder layer covers the curved top surface of the conductive pad, and the conductive pad extends into the solder layer.

Abstract: An information handling system may include at least one processor; and a non-transitory memory coupled to the at least one processor; wherein the information handling system is configured to manage an information handling system cluster by providing a command line interface between a user and a daemon service configured to execute user commands; wherein the command line interface implements a proxy subcommand that is configured to accept other commands; and wherein, when an other command is received, the daemon service is configured to parse the other command and dispatch the parsed other command to a particular backend service.

Abstract: A micro-connection structure is provided. The micro-connection structure includes an under bump metallurgy (UBM) pad, a bump and an insulating ring. The UBM pad is electrically connected to at least one metallic contact of a substrate. The bump is disposed on the UBM pad and electrically connected with the UBM pad. The insulating ring surrounds the bump and the UBM pad. The bump is separate from the insulating ring with a distance and the bump is isolated by a gap between the insulating ring and the bump.

Abstract: A method includes depositing a plurality of layers on a substrate, patterning a first mask overlying the plurality of layers, and performing a first etching process on the plurality of layers using the first mask. The method also includes forming a polymer material along sidewalls of the first mask and sidewalls of the plurality of layers, and removing the polymer material. The method also includes performing a second etching process on the plurality of layers using the remaining first mask, where after the second etching process terminates a combined sidewall profile of the plurality of layers comprises a first portion and a second portion, and a first angle of the first portion and a second angle of the second portion are different to each other.

Abstract: A method for forming a semiconductor device is provided. The method includes providing a substrate. The method includes forming a mask layer over a surface of the substrate. The mask layer has an opening over a portion of the surface. The method includes depositing a conductive layer over the surface and the mask layer. The method includes removing the mask layer and the conductive layer over the mask layer. The conductive layer remaining after the removal of the mask layer and the conductive layer over the mask layer forms a conductive pad. The method includes bonding a device to the conductive pad through a solder layer. The conductive pad is embedded in the solder layer.

Abstract: A method includes depositing a plurality of layers on a substrate, patterning a first mask overlying the plurality of layers, and performing a first etching process on the plurality of layers using the first mask. The method also includes forming a polymer material along sidewalls of the first mask and sidewalls of the plurality of layers, and removing the polymer material. The method also includes performing a second etching process on the plurality of layers using the remaining first mask, where after the second etching process terminates a combined sidewall profile of the plurality of layers comprises a first portion and a second portion, and a first angle of the first portion and a second angle of the second portion are different to each other.

Abstract: The present application discloses a method and apparatus for annotating point cloud data. A specific implementation of the method includes: collecting data in a given scenario by using a laser radar and a non-laser radar sensor to respectively obtain point cloud data and sensor data; segmenting and tracking the point cloud data to obtain point cloud segmentation and tracking results; recognizing and tracking feature objects in the sensor data to obtain feature object recognition and tracking results; correcting the point cloud segmentation and tracking results by using the feature object recognition and tracking results, to obtain confidence levels of the point cloud recognition and tracking results; and determining a point cloud segmentation and tracking result whose confidence level is greater than a confidence level threshold as a point cloud annotation result. This implementation reduces the amount of manual work required for annotating point cloud data, thereby reducing the annotation costs.

Abstract: Embodiments of the present disclosure disclose a data authentication method, a data authentication apparatus, and a data authentication system. An embodiment of the data authentication method comprises: in response to receiving an authentication request submitted to authentication nodes in an authentication system for authenticating that a vehicle passes self-driving scene testing, verifying the authentication request, the authentication request containing simulation data regarding self-driving testing of the vehicle in a simulated driving scene and authentication award information; in the case of passing the verifying, generating an award record for an authentication node that completes verification first based on the authentication award information, and writing a verification result and the award record into a distributed data block chain corresponding to the authentication system.

Abstract: The present disclosure provides for managing a software function. The system determines that a service instance is to call the software function and, in response, initiates a call request for the software function to a management component The call request includes identification information and an operation parameter of the software function, with the software function shared by a service instance and at least one further service instance deployed and stored in a converged infrastructure architecture independently from the service instance and the at least one further service instance. The system receives a response to the call request from the management component, with the response including a result of execution of the software function based on the operation parameters. The system prevents the need to deploy copies of a common software function of service instances, conserving performance and storage space, and enabling more convenient maintenance, updates, and software function calls.

Abstract: Embodiments of the present disclosure disclose a data authentication method, a data authentication apparatus, and a data authentication system. An embodiment of the data authentication method comprises: in response to receiving an authentication request submitted to authentication nodes in an authentication system for authenticating that a vehicle passes self-driving scene testing, verifying the authentication request, the authentication request containing simulation data regarding self-driving testing of the vehicle in a simulated driving scene and authentication award information; in the case of passing the verifying, generating an award record for an authentication node that completes verification first based on the authentication award information, and writing a verification result and the award record into a distributed data block chain corresponding to the authentication system.

Abstract: The present disclosure provides for managing a software function. The system determines that a service instance is to call the software function and, in response, initiates a call request for the software function to a management component The call request includes identification information and an operation parameter of the software function, with the software function shared by a service instance and at least one further service instance deployed and stored in a converged infrastructure architecture independently from the service instance and the at least one further service instance. The system receives a response to the call request from the management component, with the response including a result of execution of the software function based on the operation parameters. The system prevents the need to deploy copies of a common software function of service instances, conserving performance and storage space, and enabling more convenient maintenance, updates, and software function calls.