Abstract: An electrical connector assembly includes a first connector and a second connector mateable with each other wherein each of the first connector and the second connector has an insulative housing essentially composed of a bottom wall, a side wall and a pair of end walls wherein all the bottom wall and the side wall are rectangular while the end walls are right triangular. The first connector and he second connector are coupled with each other in a complementary manner with the corresponding hypotenuses of the right triangles confronting each other. A sealing member of a frame structure is located at an interface between the coupled edges of the housings in an oblique manner.

Abstract: A semiconductor device and a fabrication method are provided. The fabrication method includes providing a gate structure on a substrate and a first protective layers on the gate structure; forming an initial sidewall spacer on a sidewall of each of the gate structure and the first protective layer; forming a first sidewall spacer on a sidewall of the initial sidewall spacer, the first and initial sidewall spacers being made of different materials; forming a second sidewall spacer by removing a portion of the initial sidewall spacer, leaving a trench formed above the second sidewall spacer and between the first sidewall spacer and the first protective layer; and forming a second protective layer in the trench, the second protective layer and the first sidewall spacer being made of a same material. The second sidewall spacer has a top surface higher than or level with a top surface of the gate structure.

Abstract: The subject matter described herein is directed to methods of treating, protecting against, and inducing an immune response against a human papillomavirus-associated tumor or cancer, comprising the step of administering to a subject a recombinant Listeria strain expressing a construct comprising at least one human papillomavirus antigen in combination with one or more other therapeutic agents to treat a tumor or metastatic cancer.

Abstract: The present disclosure provides a method and a device for detecting and evaluating a defect with electromagnetic multi-field coupling. The method includes magnetizing a pipeline with the electromagnetic multi-field coupling; detecting a defect of the pipeline along an axial direction of the pipeline at a constant speed; collecting signals at a position of the defect to obtain magnetic leakage signals in three dimensions and an electrical impedance signal; pre-processing the collected signals; decoupling the pre-processed signals, to obtain decoupled magnetic leakage signals and a decoupled electrical impedance signal; performing impedance analysis on the decoupled electrical impedance signal, and determining a type of the defect based on a phase angle of the decoupled electrical impedance signal; and performing quantification analysis on the decoupled magnetic leakage signals and performing quantification evaluation on a size of the defect using a neural network defect quantification method.

Abstract: This application provides a communication method and device. The method includes: determining, by a first device, a first synchronization signal, where the first synchronization signal is used by a second device for symbol timing alignment and frequency synchronization; and sending, by the first device, the first synchronization signal on each group of subcarriers of M groups of subcarriers, where M is a positive integer greater than or equal to 2. According to the communication method in this application, the first device sends the first synchronization signal on each group of subcarriers of a plurality of groups of subcarriers, so that the second device can select, based on a reception capability of the second device, an appropriate bandwidth to receive the first synchronization signal. In this way, a device with wideband reception performance and a device with narrowband reception performance can be supported.

Abstract: A high-precision imaging and detecting device for detecting a small defect of a pipeline by a helical magnetic matrix. The device includes: a helical excitation module including a helical excitation coil; a magnetic matrix detection module, disposed at an inner side of the helical excitation coil and including at least one magnetic sensor group arranged at intervals along an axial direction of the helical excitation coil, group including a plurality of magnetic sensors evenly spaced apart and arranged along a circumferential direction of the helical excitation coil, and the magnetic sensor being configured to detect an induction magnetic field of the pipeline; a signal processing module, connected with the magnetic matrix detection module, and configured to receive, process and output an induction magnetic field signal of the pipeline detected by the magnetic sensor.

Abstract: A connector assembly includes: an insulating body; multiple terminals disposed in the insulating body; a front shielding shell shielding the insulating body; a rear shielding shell covering a rear end of the front shielding shell, where an accommodating space is formed between the rear shielding shell and an outer surface of the front shielding shell; and an external insulator, molded outside the front shielding shell and the rear shielding shell and filled into the accommodating space. Compared with the related art, the accommodating space limits tension generated when the external insulator is molded, and after molten plastic is cooled, a part of the external insulator will be fastened within the accommodating space, such that the external insulator can be efficiently retained on the front shielding shell and the rear shielding shell, thereby preventing degumming and cracking phenomenons between the front shielding shell and the external insulator.

Abstract: A high-precision imaging and detecting device for detecting a small defect of a pipeline by a helical magnetic matrix. The device includes: a helical excitation module including a helical excitation coil; a magnetic matrix detection module, disposed at an inner side of the helical excitation coil and including at least one magnetic sensor group arranged at intervals along an axial direction of the helical excitation coil, group including a plurality of magnetic sensors evenly spaced apart and arranged along a circumferential direction of the helical excitation coil, and the magnetic sensor being configured to detect an induction magnetic field of the pipeline; a signal processing module, connected with the magnetic matrix detection module, and configured to receive, process and output an induction magnetic field signal of the pipeline detected by the magnetic sensor.

Abstract: A method is provided for fabricating a flash memory structure. The method includes providing a substrate; and forming a gate structure and a hard mask layer. The method also includes forming a sidewall structure on side walls of the gate structure and the hard mask layer; and forming an etching barrier layer covering the sidewall structure. In addition, the method includes forming a first dielectric layer; and removing the sidewall structure and the etching barrier layer higher than the first dielectric layer. Moreover, the method includes forming a sacrificial sidewall layer on the side wall of the hard mask layer and above the sidewall structure and the etching barrier layer; and forming a second dielectric layer on the first dielectric layer. Further, the method includes forming a contact hole penetrating through the second dielectric layer and the first dielectric layer; and forming a contact-hole plug in the contact hole.

Abstract: A semiconductor device and a fabrication method are provided. The fabrication method includes providing a gate structure on a substrate and a first protective layers on the gate structure; forming an initial sidewall spacer on a sidewall of each of the gate structure and the first protective layer; forming a first sidewall spacer on a sidewall of the initial sidewall spacer, the first and initial sidewall spacers being made of different materials; forming a second sidewall spacer by removing a portion of the initial sidewall spacer, leaving a trench formed above the second sidewall spacer and between the first sidewall spacer and the first protective layer; and forming a second protective layer in the trench, the second protective layer and the first sidewall spacer being made of a same material. The second sidewall spacer has a top surface higher than or level with a top surface of the gate structure.

Abstract: A connector assembly includes: an insulating body; multiple terminals disposed in the insulating body; a front shielding shell shielding the insulating body; a rear shielding shell covering a rear end of the front shielding shell, where an accommodating space is formed between the rear shielding shell and an outer surface of the front shielding shell; and an external insulator, molded outside the front shielding shell and the rear shielding shell and filled into the accommodating space. Compared with the related art, the accommodating space limits tension generated when the external insulator is molded, and after molten plastic is cooled, a part of the external insulator will be fastened within the accommodating space, such that the external insulator can be efficiently retained on the front shielding shell and the rear shielding shell, thereby preventing degumming and cracking phenomenons between the front shielding shell and the external insulator.

Abstract: A method is provided for fabricating a flash memory structure. The method includes providing a substrate; and forming a gate structure and a hard mask layer. The method also includes forming a sidewall structure on side walls of the gate structure and the hard mask layer; and forming an etching barrier layer covering the sidewall structure. In addition, the method includes forming a first dielectric layer; and removing the sidewall structure and the etching barrier layer higher than the first dielectric layer. Moreover, the method includes forming a sacrificial sidewall layer on the side wall of the hard mask layer and above the sidewall structure and the etching barrier layer; and forming a second dielectric layer on the first dielectric layer. Further, the method includes forming a contact hole penetrating through the second dielectric layer and the first dielectric layer; and forming a contact-hole plug in the contact hole.

Abstract: An offshore floating structure such as a wind turbine includes a number of improvements. The floating structure can include a chain engaging system configured to prevent any lengthwise movement of a mooring chain. The floating structure can also include a mooring fixture pivotally coupled to the hull to prevent shock loads from being transmitted directly from the mooring line to the hull. The floating structure can also include installation aid structures that provide additional water plane area and/or buoyancy to the structure. The floating structure can also have a hull that is optimized for use as an offshore wind turbine.

Abstract: A method is provided for fabricating a flash memory structure. The method includes providing a substrate; and forming a gate structure and a hard mask layer. The method also includes forming a sidewall structure on side walls of the gate structure and the hard mask layer; and forming an etching barrier layer covering the sidewall structure. In addition, the method includes forming a first dielectric layer; and removing the sidewall structure and the etching barrier layer higher than the first dielectric layer. Moreover, the method includes forming a sacrificial sidewall layer on the side wall of the hard mask layer and above the sidewall structure and the etching barrier layer; and forming a second dielectric layer on the first dielectric layer. Further, the method includes forming a contact hole penetrating through the second dielectric layer and the first dielectric layer; and forming a contact-hole plug in the contact hole.

Abstract: A method is provided for fabricating a flash memory structure. The method includes providing a substrate; and forming a gate structure and a hard mask layer. The method also includes forming a sidewall structure on side walls of the gate structure and the hard mask layer; and forming an etching barrier layer covering the sidewall structure. In addition, the method includes forming a first dielectric layer; and removing the sidewall structure and the etching barrier layer higher than the first dielectric layer. Moreover, the method includes forming a sacrificial sidewall layer on the side wall of the hard mask layer and above the sidewall structure and the etching barrier layer; and forming a second dielectric layer on the first dielectric layer. Further, the method includes forming a contact hole penetrating through the second dielectric layer and the first dielectric layer; and forming a contact-hole plug in the contact hole.

Abstract: A measurement machine includes an optical lens and a spectral confocal sensor. An electronic device adjusts a zoom ratio of the lens to be a maximum ratio, and calculates X, Y, Z coordinate differences between the lens center and the sensor center. The electronic device calibrates the X, Y coordinate differences at least twice, to obtain calibrated X, Y coordinate differences. The X, Y differences are replaced by the calibrated X, Y coordinate differences when the calibrated X, Y coordinate differences satisfy first predetermined requirements. The electronic device further calibrates the Z coordinate difference at least twice to obtain a calibrated Z coordinate difference. The Z coordinate difference is replaced by the calibrated Z coordinate difference when the calibrated Z coordinate difference satisfies second predetermined requirements.

Abstract: A computing device reads an entire image of an object. The entire image is spliced by a plurality of part images. A user selects an area on the entire image. The computing device determines a first number of first pixel points between a center point of the selected area and a center point of each covered image. The converted images are part images that the selected area covers. The coordinate values of the center point of the selected area are calculated according to the first number of pixel points and a size of each pixel point of the entire image. The computing device calculates coordinate values of each point of a selected area according to the size of each pixel point and the coordinate values of the center point of the selected area.

Abstract: In a method to measure widths of measured parts placed on a platform, a computing device connects to one or more charge coupled device (CCD) cameras. The method controls each of the CCD cameras to capture a digital image from a measured part that is placed near the CCD cameras, obtains the digital image of the measured part from each of the CCD cameras in a predefined order, and obtains a binary expression from the digital image of the measured part. When the measured part is placed in a correct position on the platform, the method further obtains three points from an upper boundary of the measured part in the binary expression and another three points from a lower boundary of the measured part in the binary expression, and calculates width of the measured part according to the obtained six points.

Abstract: Analyzation of image noise using an electronic device. The electronic device and method operating thereon can obtain an initial image captured by an image capturing device of an image measuring machine using an image capturing card of the electronic device when a lighting device of the image measuring machine is shut down, and magnifies an initial gray value of each pixel in the initial image to obtain an updated image. The electronic device and method operating thereon can further determine whether image noise in the updated image complies with a preset condition by analyzing an updated gray value of each pixel in the updated image, and displays the updated image and analysis results on a display device of the electronic device.

Abstract: In a method for processing a point cloud using a computing device, a straight line fitted by the point cloud comprising border points is determined as a benchmark line. An inflection point in the point cloud of the benchmark line is determined. If the vertical distance of the inflection point is not greater than the preset filtration value, needless border points in the point cloud are deleted and a remainder point cloud is obtained. If the vertical distance between the inflection point and the benchmark line is greater than a filtration value, the point cloud is divided into two sub-point clouds, and the one sub-point cloud having border points less than the preset number is deleted, and the other sub-point cloud is set as a remainder point cloud.