Abstract: Provided is a novel compound capable of improving the luminous efficiency, stability and life span of a device, an organic electric element using the same, and an electronic device thereof.

Abstract: Disclosed are novel compounds of Chemical Formula 1, optical isomers of the compounds, and pharmaceutically acceptable salts of the compounds or the optical isomers. The compounds, isomers, and salts exhibit excellent activity as GLP-1 receptor agonists. In particular, they, as GLP-1 receptor agonists, exhibit excellent glucose tolerance, thus having a great potential to be used as therapeutic agents for metabolic diseases. Moreover, they exhibit excellent pharmacological safety for cardiovascular systems.

Abstract: Discussed is a bolting device that effectively protects an internal configuration of a battery pack and increases manufacturing efficiency during a bolting operation. The bolting device for manufacturing a battery pack includes an electric screwdriver provided with a rotation motor; a driver bit connected to the rotation motor to enable a rotation movement and configured to rotate a bolt; a bit guide member provided with a hollow tube such that the driver bit is inserted into an inside of the hollow tube to be movable; and a guide jig provided with a main body configured to be mounted on an upper portion of a pack housing, the main body having a plate shape and having at least one through hole, and a fixing member inserted into the through hole and mounted therein, and having an insertion hole.

Abstract: An image encoding/decoding method is provided. An image decoding method of the present invention may comprise deriving an intra-prediction mode of a current luma block, deriving an intra-prediction mode of a current chroma block based on the intra-prediction mode of the current luma block, generating a prediction block of the current chroma block based on the intra-prediction mode of the current chroma block, and the deriving of an intra-prediction mode of a current chroma block may comprise determining whether or not CCLM (Cross-Component Linear Mode) can be performed for the current chroma block.

Abstract: Disclosed is a method and apparatus for detecting anomalies in a system log on the basis of self-supervised learning, using a language model. The method comprises performing preprocessing on the system log, generating a normal token sequence having a preset length by concatenating tokenized log lines of the system log, generating an abnormal token sequence using the normal token sequence, calculating an anomaly score for a determination target token sequence using a sentence classification model, and determining the token sequence as an abnormal system log when the calculated anomaly score is greater than a threshold value.

Abstract: The present invention discloses an image decoding method, the method including generating a candidate list including motion information derived from a spatial neighboring block and a temporal neighboring block adjacent to a current block; deriving motion information of the current block using the candidate list; generating a prediction block of the current block using the derived motion information; and updating the derived motion information in a motion information list, wherein the generating of the candidate list is performed in such a manner as to include at least one information of the motion information included in the updated motion information list in a block decoded before the current block.

Abstract: Proposed are counter-based selective row hammer refresh apparatus and method for row hammer prevention and, more particularly, proposed are an apparatus and a method for reducing energy consumption of dynamic random access memory (DRAM) by improving counter-based algorithms for solving a row hammer problem when applying a refresh management (RFM) command that is a new command applied to the latest DRAM standards, such as DDR5, LPDDR5, and the like.

Abstract: Disclosed is a method of decoding an image and a method of encoding an image. The method of decoding an image includes: obtaining motion-constrained tile set information; determining, on the basis of the motion-constrained tile set information, a first boundary region of a collocated tile set within a reference picture, which corresponds to a motion-constrained tile set; padding a second boundary region corresponding to the first boundary region; and performing inter prediction on the motion-constrained tile set by using a collocated tile set that includes the padded second boundary region.

Abstract: Provided is a duct docking device for a ventilation seat of a vehicle. The duct docking device enables air to be easily blown to a seatback and a seat cushion with a passenger in a seat using only one blower by enabling a seatback duct mounted at the seatback and a seat cushion duct mounted at the seat cushion to be hermetically docked through a connector duct, etc. at an unfolded position of the seatback in which a passenger can sit, and by enabling the seatback duct mounted at the seatback and the seat cushion duct mounted at the seat cushion to be separated from each other at a folded position of the seatback in consideration of that there is no passenger in the seat.

Abstract: A secondary battery comprises an electrode assembly, a can, and an insulator. The electrode assembly includes a first electrode, a separator, and a second electrode alternately stacked and wound. The can has an accommodation part accommodating the electrode assembly therein, and the can comprises a first can and a second can having cylindrical shapes open in a direction facing each other. The insulator insulates an overlapping portion between the first can and the second can. The first can is electrically connected to the first electrode, and the second can is electrically connected to the second electrode. The insulator has a short-circuit induction through-part defined by a through-hole or a cutoff line, such that a short circuit occurs between the first can and the second can through the short-circuit induction through-part when it is deformed in shape as heat or a pressure is applied to contract or expand the insulator.

Abstract: Disclosed is a semiconductor package comprising a redistribution substrate, and a semiconductor chip on a top surface of the redistribution substrate. The redistribution substrate includes an under-bump pattern, a lower dielectric layer that covers a sidewall of the under-bump pattern, and a first redistribution pattern on the lower dielectric layer. The first redistribution pattern includes a first line part. A width at a top surface of the under-bump pattern is greater than a width at a bottom surface of the under-bump pattern. A thickness of the under-bump pattern is greater than a thickness of the first line part.

Abstract: Disclosed is a semiconductor package comprising a redistribution substrate, and a semiconductor chip on a top surface of the redistribution substrate. The redistribution substrate includes an under-bump pattern, a lower dielectric layer that covers a sidewall of the under-bump pattern, and a first redistribution pattern on the lower dielectric layer. The first redistribution pattern includes a first line part. A width at a top surface of the under-bump pattern is greater than a width at a bottom surface of the under-bump pattern. A thickness of the under-bump pattern is greater than a thickness of the first line part.

Abstract: A display device includes a flexible display portion, a case which accommodates the display portion, and a blocking layer which is disposed between the display portion and the case. The blocking layer includes a plurality of nanolines.

Abstract: A method for fabricating a semiconductor package, the method including: forming a release layer on a first carrier substrate, wherein the release layer includes a first portion and a second portion, wherein the first portion has a first thickness, and the second portion has a second thickness thicker than the first thickness; forming a barrier layer on the release layer; forming a redistribution layer on the barrier layer, wherein the redistribution layer includes wirings and an insulating layer; mounting a semiconductor chip on the redistribution layer; forming a molding layer on the redistribution layer to at least partially surround the semiconductor chip; attaching a second carrier substrate onto the molding layer; removing the first carrier substrate and the release layer; removing the barrier layer; and attaching a solder ball onto the redistribution layer exposed by removal of the barrier layer and the second portion of the release layer.

Abstract: A motor-driven door ratchet includes a catch part configured to lock a vehicle door to a vehicle body by being caught by a striker mounted on the vehicle body. A door locking and release part includes a main motor and is configured to allow the catch part to be locked or released from the striker. An inside emergency operation lever is connected to an inside handle installed in the vehicle door and is configured to be rotated by receiving a manipulation force to allow the vehicle door to be opened by applying torque to the catch part. An outside emergency operation lever is connected to an outside handle installed in the vehicle door and is configured to be rotated by receiving a manipulation force to allow the vehicle door to be opened by applying torque to the catch part.

Abstract: A pH measuring device is disclosed. One aspect includes a body unit including a hollow portion and a through-portion formed in a first region so that the hollow portion communicates with the outside; an electrode unit including a reference electrode and a sensing electrode including different materials and configured to measure the pH in a living body by allowing a first end to be located in the hollow portion and a second end opposite to the first end to be exposed to the outside of the body unit through the through-portion; and a wireless communication unit configured to transmit a pH measurement value sensed by the electrode unit to the outside.

Abstract: Proposed is a rubber pad for a steel track. The rubber pad coupled to the steel track formed by connecting a plurality of links and provided with a bushing engaging with a sprocket to allow driving of equipment may include a rubber pad body coupled to an outside of the link and a bushing cover extending from an outer surface of the pad body toward the adjacent pad body to shield the bushing from the outside, wherein a foreign substance discharging groove having the bushing cover inside may be formed in the pad body.

Abstract: Disclosed are a method and device for managing a project by using a data pointer. A project is efficiently operated by dividing a project based on a minimum unit task and designing a plurality of child projects connected in sequential order such that a plurality of child projects proceed in order.

Abstract: A display device including a flexible module including a display panel; an adhesive film disposed on one surface of the flexible module; support plates disposed on the adhesive film; a first anti-adhesive film pattern disposed between each of the support plates and the adhesive film; and a second anti-adhesive film pattern disposed between each of the support plates and the adhesive film and spaced apart from the first anti-adhesive film pattern. Each of the first anti-adhesive film pattern and the second anti-adhesive film pattern includes a metal material, and each of the first anti-adhesive film pattern and the second anti-adhesive film pattern has a thickness in a range of 100 nm to 1000 nm.

Abstract: A method for fabricating a semiconductor package includes forming a release layer on a first carrier substrate. An etch stop layer is formed on the release layer. A first redistribution layer is formed on the etch stop layer and includes a plurality of first wires and a first insulation layer surrounding the plurality of first wires. A first semiconductor chip is formed on the first redistribution layer. A solder ball is formed between the first redistribution layer and the first semiconductor chip. A second carrier substrate is formed on the first semiconductor chip. The first carrier substrate, the release layer, and the etch stop layer are removed. The second carrier substrate is removed.