Abstract: A memory includes a plurality of memory blocks, a plurality of global bit lines, a common pre-charging circuit, and a selection circuit. Each memory block includes a pair of bit lines, and a plurality of memory cells coupled to the pair of bit lines. Each global bit line is coupled to at least one of the memory blocks. The pre-charging circuit is configured to pre-charge the global bit lines, one at a time, to a pre-charge voltage. The selection circuit is coupled between the pre-charging circuit and the global bit lines, and configured to couple the global bit lines, one at a time, to the pre-charging circuit.

Abstract: A pulsed dynamic LCV circuit for improving write operations for SRAM. The pulsed dynamic LCV circuit includes voltage adjustment circuitry having a plurality of selectable reduced supply voltages and timing adjustment circuitry having a plurality of selectable logical state transition timings for adjustably controlling the voltage and timing of a transition from a selected reduced supply voltage back to a nominal supply voltage. The voltage adjustment circuitry has a plurality of selectable transistors that when individually selected have a cumulative effect to pull the reduced supply voltage down further. The timing adjustment circuitry has a plurality of selectable multiplexers that when individually selected for a delayed voltage transition have a cumulative effect to delay return of voltage supplied to SRAM from a reduced supply voltage to a nominal supply voltage.

Abstract: A voltage providing circuit includes a first circuit, a second circuit coupled with the first circuit, and a third circuit coupled with the second circuit. The first circuit is configured to receive a first input signal and to generate a first output signal. The second circuit is configured to receive the first input signal and the first output signal as inputs and to generate a second output signal. The third circuit is configured to receive the second output signal and to generate an output voltage.

Abstract: A method comprises identifying a number of power domains in a device, connecting the power domains to each other by a number of control devices during a wake-up mode of the device, and disconnecting the power domains after the wake-up mode of the device.

Abstract: An apparatus includes a level shifter and a switching circuit. The level shifter includes an input, a first output, and second output having a logic value complementary to a logic value of the first output. The switching circuit includes a data input, a feedback input coupled to the second output of the level shifter, and an output coupled to the input of the level shifter. The switching circuit is configured to selectively latch, based on a select signal, a logic state of the level shifter at the second output.

Abstract: An integrated circuit that includes an array of memory cells and an array of write logic cells. The integrated circuit also includes a write address decoder comprising a plurality of write outputs. The array of write logic cells is electrically connected to the plurality of write outputs. The array of write logic cells is electrically connected to the array of memory cells. The array of write logic cells is configured to set an operating voltage of the memory cells.

Abstract: A wake up circuit includes a bias signal control block configured to receive a sleep signal and to generate a plurality of bias control signals. The wake up circuit further includes a bias supply block configured to receive each bias control signal of the plurality of bias control signals and to generate a header bias signal. The bias supply block includes a first bias stage configured to receive a first bias control signal of the plurality of bias control signals, and to control the header bias signal to be equal to a first voltage. The bias supply block further includes a second bias stage configured to receive a second bias control signal of the plurality of bias control signals, and to control the header bias signal to be equal to a second voltage different from the first voltage. The wake up circuit further includes a header configured to receive the header bias signal, and to selectively connect a supply voltage to a load based on the header bias signal.

Abstract: A circuit includes a tracking bit line, a tracking unit connected to the tracking bit line and a detection unit. The tracking unit is configured to receive a first control signal and configured to selectively charge or discharge a voltage on the tracking bit line in response to the first control signal. The detection unit is coupled to the tracking bit line and configured to generate a sense amplifier enable (SAE) signal in response to the voltage level on the tracking bit line.

Abstract: A memory includes a first bit line, a memory cell coupled to the first bit line, and a read assist device coupled to the first bit line. The read assist device is configured to pull a first voltage on the first bit line toward a predetermined voltage in response to a first datum being read out from the memory cell. The read assist device includes a first circuit configured to establish a first current path between the first bit line and a node of the predetermined voltage during a first stage. The read assist device further includes a second circuit configured to establish a second current path between the first bit line and the node of the predetermined voltage during a second, subsequent stage.

Abstract: A sensing amplifier for a memory device includes first and second nodes, an input device and an output device. The memory device includes first and second bit lines, and at least one memory cell coupled to the bit lines. The first and second nodes are coupled to the first and second bit lines, respectively. The input device is coupled to the first and second nodes and generates a first current pulling the first node toward a predetermined voltage in response to a first datum read out from the memory cell, and to generate a second current pulling the second node toward the predetermined voltage in response to a second datum read out from the memory cell. The output device is coupled to the first node to output the first or second datum read out from the memory cell. The first current is greater than the second current.

Abstract: A memory chip comprises a main memory array having a plurality of memory columns, a redundancy memory column associated with the main memory array, and a hit logic circuitry configured to generate a plurality of hit logic signals by a plurality of hit logic units in the hit logic circuitry to enable dynamic replacement of a defective memory cell in one of the memory columns for dynamic replacement by the redundancy memory column when the memory array is in operation.

Abstract: A method comprises identifying a number of power domains in a device, connecting the power domains to each other by a number of control devices during a wake-up mode of the device, and disconnecting the power domains after the wake-up mode of the device.

Abstract: A pulsed dynamic LCV circuit for improving write operations for SRAM. The pulsed dynamic LCV circuit includes voltage adjustment circuitry having a plurality of selectable reduced supply voltages and timing adjustment circuitry having a plurality of selectable logical state transition timings for adjustably controlling the voltage and timing of a transition from a selected reduced supply voltage back to a nominal supply voltage. The voltage adjustment circuitry has a plurality of selectable transistors that when individually selected have a cumulative effect to pull the reduced supply voltage down further. The timing adjustment circuitry has a plurality of selectable multiplexers that when individually selected for a delayed voltage transition have a cumulative effect to delay return of voltage supplied to SRAM from a reduced supply voltage to a nominal supply voltage.

Abstract: A sensing amplifier for a memory device includes first and second nodes, an input device and an output device. The memory device includes first and second bit lines, and at least one memory cell coupled to the bit lines. The first and second nodes are coupled to the first and second bit lines, respectively. The input device is coupled to the first and second nodes and generates a first current pulling the first node toward a predetermined voltage in response to a first datum read out from the memory cell, and to generate a second current pulling the second node toward the predetermined voltage in response to a second datum read out from the memory cell. The output device is coupled to the first node to output the first or second datum read out from the memory cell. The first current is greater than the second current.

Abstract: A circuit includes a failure address register configured to store a first row address, a row address modifier coupled to the failure address register, wherein the row address modifier is configured to modify the first row address received from the failure address register to generate a second row address. A first comparator is configured to receive and compare the first row address and a third row address. A second comparator is configured to receive and compare the second row address and the third row address. The first and the second row addresses are failed row addresses in a memory.

Abstract: A memory includes a plurality of bit cells. Each bit cell includes a bit line and a storage cell coupled to the bit line. A header PMOS transistor is coupled to the storage cell in each bit cell. The header PMOS transistor is at least partially turned off during a write operation by a header control signal.

Abstract: In a digital memory with an array of bit cells coupled to word lines and bit lines, each bit cell having cross coupled inverters isolated from bit lines by passing gate transistors until addressed, some or all of the bit cells are switchable between a sleep mode and a standby mode in response to a control signal. A bit line bias circuit controls the voltage at which the bit lines are caused to float when in the sleep mode. A pull-up transistor for each bit line BL or BLB in a complementary pair has a conductive channel coupled to a positive supply voltage and a gate coupled to the other bit line in the pair, BLB or BL, respectively. A connecting transistor also can be coupled between the bit lines of the complementary pair, bringing the floating bit lines to the supply voltage less a difference voltage ?V.

Abstract: A device includes an active region formed of a semiconductor material, a gate dielectric at a surface of the active region, and a gate electrode over the gate dielectric. A first source/drain region and a second source/drain region are on opposite sides of the gate electrode. A Contact Etch Stop Layer (CESL) is over the first and the second source/drain regions. An Inter-Layer Dielectric (ILD) includes a top surface substantially level with a top surface of the gate electrode. A first contact plug is over and electrically connected to the first source/drain region. A second contact plug is over and aligned to the second source/drain region. The second contact plug and the second source/drain region are spaced apart from each other by a portion of the first CESL to form a capacitor.

Abstract: A memory includes a first bit line, a memory cell coupled to the first bit line, and a read assist device coupled to the first bit line. The read assist device is configured to pull a first voltage on the first bit line toward a predetermined voltage in response to a first datum being read out from the memory cell. The read assist device includes a first circuit configured to establish a first current path between the first bit line and a node of the predetermined voltage during a first stage. The read assist device further includes a second circuit configured to establish a second current path between the first bit line and the node of the predetermined voltage during a second, subsequent stage.

Abstract: A memory includes a plurality of memory blocks, a plurality of global bit lines, a common pre-charging circuit, and a selection circuit. Each memory block includes a pair of bit lines, and a plurality of memory cells coupled to the pair of bit lines. Each global bit line is coupled to at least one of the memory blocks. The pre-charging circuit is configured to pre-charge the global bit lines, one at a time, to a pre-charge voltage. The selection circuit is coupled between the pre-charging circuit and the global bit lines, and configured to couple the global bit lines, one at a time, to the pre-charging circuit.