Patents by Inventor Jung Soo Park

Jung Soo Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230178241
    Abstract: A method of predicting fetal or neonatal disease based on the stage of maternal periodontitis is presented to predict fetal or neonatal disease, specifically, any one or more of small for gestational age, neonatal general health, neonatal respiratory disease, retinopathy of prematurity, and patent ductus arteriosus requiring treatment, before birth by determining the stage of maternal periodontitis in a noninvasive and clear manner.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 8, 2023
    Inventors: Ki Hoon AHN, Ju Sun HEO, Jung Soo PARK
  • Publication number: 20230120610
    Abstract: Point of sale devices are disclosed. A register point-of-sale system may include: a register base; a customer screen that is removeable received by the register base; a merchant screen adjustably mounted on the register base; and a card reader integrated into the customer screen. A mobile payment terminal system may include: a mobile payment terminal comprising a wireless card reader, magnetic stripe reader, slot that receives a chip card, a screen, and an integrated receipt printer; and a dock that removably receives the mobile payment terminal. A mobile card reader system may include a cylindrical mobile card reader comprising a screen, a wireless card reader, a magnetic stripe reader, a slot that receives a chip card, and a plurality of base slots that receive a plurality of base latches; and a cylindrical base with an angled end and latches.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 20, 2023
    Inventors: Patrick GUINDON, John FRERICHS, Inna LOBEL, Francois D NGUYEN, Jung Soo PARK, Kebei LI, Adam Christopher WRIGLEY
  • Publication number: 20230103298
    Abstract: A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the CSDS via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the CSDS via the second bond pad. The semiconductor package may further include a metal post electrically coupled to the first surface of the CSDS, and a first encapsulant material encapsulating side surfaces and a surface opposite the first die surface of the first semiconductor die, the metal post, and a portion of the first surface of the CSDS.
    Type: Application
    Filed: October 13, 2022
    Publication date: April 6, 2023
    Inventors: Do Hyung Kim, Jung Soo Park, Seung Chul Han
  • Patent number: 11584251
    Abstract: A method for displaying charge and gain energy by a vehicle solar roof system is provided. The method includes determining whether the vehicle is in a parking or driving mode based on whether the vehicle key is turned on or off when the solar roof system installed in the vehicle operates. A corresponding consumed energy is calculated by determining whether the solar roof system charges the auxiliary battery or the main battery. The consumed energy is displayed in the cluster of the vehicle and booting is performed when the key is turned on in the parking mode and displayed when the key is turned off in the driving mode. The consumed energy is calculated based on efficiency of a charge amount of the auxiliary battery or the main battery and a gain fuel amount is changed based on the charge amount and calculated due to the saved energy.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: February 21, 2023
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Jung-Soo Park, Seung-Wan Son, Kyu-Jin Lee, Dong-Jun Shin
  • Publication number: 20230009663
    Abstract: Provided is a method for delegating a device ownership based on a blockchain. The blockchain-based device ownership delegating method may include: transferring a device ownership request of a first user to a blockchain; providing a smart contract based ownership request event generated by the blockchain to a second user; transferring a device ownership change request of the second user to the blockchain; providing a smart contract based ownership change event generated by the blockchain to a device decentralized application (DApp); changing a device ownership; and recording a change history of the device ownership in the blockchain.
    Type: Application
    Filed: July 7, 2022
    Publication date: January 12, 2023
    Inventors: Yun Chul CHOI, Jung Soo PARK, Euihyun JUNG
  • Publication number: 20220358969
    Abstract: An electronic apparatus includes a circuit board, a memory chip mounted on the circuit board, a memory controller to control an operation of the memory chip, a conductive pattern including a first control line to connect from a first terminal of the memory chip to a first terminal of the memory chip and a second control line to connect from a second terminal of the memory controller to a second terminal of the memory chip, and a capacitive element to provide a termination voltage. The first control line is connected to the capacitive element and the second control line is not connected to the capacitive element.
    Type: Application
    Filed: October 15, 2020
    Publication date: November 10, 2022
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventor: Jung Soo PARK
  • Patent number: 11476233
    Abstract: A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the CSDS via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the CSDS via the second bond pad. The semiconductor package may further include a metal post electrically coupled to the first surface of the CSDS, and a first encapsulant material encapsulating side surfaces and a surface opposite the first die surface of the first semiconductor die, the metal post, and a portion of the first surface of the CSDS.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: October 18, 2022
    Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.
    Inventors: Do Hyung Kim, Jung Soo Park, Seung Chul Han
  • Patent number: 11422955
    Abstract: An electronic device is disclosed. The electronic device comprises a circuit board, a memory part comprising a plurality of first memory chips mounted on the circuit board, a socket part comprising a plurality of terminals electrically connected to a memory module which comprises a plurality of second memory chips, a memory controller for controlling the operation of the plurality of first memory chips and, when the memory module is connected to the socket part, controlling the operation of the plurality of first memory chips and the plurality of second memory chips, a conductive pattern comprising a control line which sequentially connects, from the memory controller, one or more of the plurality of terminals on the socket part and the plurality of first memory chips, and a capacitive element connected to the control line at a preset position between the one or more terminals on the socket part and the memory controller.
    Type: Grant
    Filed: June 16, 2017
    Date of Patent: August 23, 2022
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Seung-hun Park, Seob Cho, Keon-young Seo, Nam-jin Kim, Kwang-Rae Jo, Jung-Soo Park, Youn-Jae Kim, Jeong-Nam Cheon
  • Publication number: 20220153551
    Abstract: A method for controlling an elevator by interworking with external devices in an apparatus for controlling an elevator is provided. The method for controlling an elevator includes generating token information for an external device to which a write command is to be performed and transmitting the token information to the external device, receiving a control message including a write command together with the token information from the external device, verifying the token information, and processing the control message when the token information is verified.
    Type: Application
    Filed: November 15, 2021
    Publication date: May 19, 2022
    Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, M2M Tech Co.,Ltd.
    Inventors: Yun Chul CHOI, JinKee KIM, Jung Soo PARK
  • Publication number: 20220141256
    Abstract: A method of performing a security management automation in an Interface to Network Security Functions (I2NSF) system is disclosed. The method comprises receiving a high-level security policy via a consumer-facing interface; translating the high-level security policy into a low-level security policy based on an automatic mapping model; transmitting the low-level security policy to a network security function (NSF) via an NSF-facing interface, wherein the low-level security policy is applied to a system of the NSF; receiving monitoring data for a network security from the NSF; reconfiguring a security policy based on the monitoring data; and transmitting the reconfigured security policy to the NSF via the NSF-facing interface. The reconfigured security policy is updated to a system of the NSF.
    Type: Application
    Filed: November 2, 2021
    Publication date: May 5, 2022
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Jae Hoon JEONG, Patrick LINGGA, Jung Soo PARK, Yun Chul CHOI
  • Patent number: 11183868
    Abstract: A charge capacity variable control apparatus using an external energy source for a vehicle, may include an external energy source for generating an external charge power, a main battery for receiving the external charge power to be charged, and a controller for generating a change target charge capacity by changing an existing target charge capacity based on an external charge capacity of the external energy source and a battery charge capacity of the main battery depending upon the driving state of the vehicle, and performing a variable control using the change target charge capacity.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: November 23, 2021
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Jung-Soo Park, Seung-Jae Yum, Seung-Wan Son, Won-Young Jeong
  • Publication number: 20210313300
    Abstract: An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing an adhesive layer to attach an upper electronic package to a lower die and/or utilizing metal pillars for electrically connecting the upper electronic package to a lower substrate, wherein the metal pillars have a smaller height above the lower substrate than the lower die.
    Type: Application
    Filed: May 14, 2021
    Publication date: October 7, 2021
    Inventors: Joon Young Park, Jung Soo Park, Ji Hye Yoon
  • Publication number: 20210217732
    Abstract: A semiconductor package using a coreless signal distribution structure (CSDS) is disclosed and may include a CSDS comprising at least one dielectric layer, at least one conductive layer, a first surface, and a second surface opposite to the first surface. The semiconductor package may also include a first semiconductor die having a first bond pad on a first die surface, where the first semiconductor die is bonded to the first surface of the CSDS via the first bond pad, and a second semiconductor die having a second bond pad on a second die surface, where the second semiconductor die is bonded to the second surface of the CSDS via the second bond pad. The semiconductor package may further include a metal post electrically coupled to the first surface of the CSDS, and a first encapsulant material encapsulating side surfaces and a surface opposite the first die surface of the first semiconductor die, the metal post, and a portion of the first surface of the CSDS.
    Type: Application
    Filed: January 25, 2021
    Publication date: July 15, 2021
    Inventors: Do Hyung Kim, Jung Soo Park, Seung Chul Han
  • Publication number: 20210202047
    Abstract: The present disclosure provides a new drug candidate material output apparatus, including: a communication module; a memory in which a new drug candidate material output program is stored; and a processor executing the new drug candidate material output program. The new drug candidate material output program provides a drug learning model in which an embedding vector for a chemical structure of a chemical compound and an embedding vector for change information on an amount of a transcriptome induced by each chemical compound are located in a same vector space, outputs a result of the change information on the amount of the transcriptome that matches the embedding vector for the chemical structure of the new material input to the drug learning model, or outputs information on one or more drugs that match the change information on the amount of the transcriptome that is a target input to the drug learning model.
    Type: Application
    Filed: December 31, 2020
    Publication date: July 1, 2021
    Applicant: Korea University Research and Business Foundation
    Inventors: Jaewoo KANG, Min Ji JEON, Bu Ru CHANG, Jung Soo PARK, Sung Joon PARK, Sun Kyu KIM
  • Patent number: 11011497
    Abstract: An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of manufacturing electronic devices, and electronic devices manufactured thereby, that comprise utilizing an adhesive layer to attach an upper electronic package to a lower die and/or utilizing metal pillars for electrically connecting the upper electronic package to a lower substrate, wherein the metal pillars have a smaller height above the lower substrate than the lower die.
    Type: Grant
    Filed: May 21, 2019
    Date of Patent: May 18, 2021
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Joon Young Park, Jung Soo Park, Ji Hye Yoon
  • Patent number: 10993904
    Abstract: The present disclosure relates to a transplantation implant that includes stem cells having an ability of secreting a cytokine that having a hair-growing function.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: May 4, 2021
    Assignee: Inscobee Inc.
    Inventors: Seung-Kwon Noh, Jung-Soo Park, In-Soo You
  • Patent number: D939156
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: December 21, 2021
    Assignee: Heatworks Technologies, Inc.
    Inventors: Jeremiah M. Callahan, Adam C. Wrigley, Christopher B. Crowley, Alexander C. Calkins, Inna Lobel, Jung Soo Park, Reid A. Schlegel
  • Patent number: D956712
    Type: Grant
    Filed: July 13, 2020
    Date of Patent: July 5, 2022
    Assignee: Frog Design Inc.
    Inventors: Francois Nguyen, Inna Lobel, Adam Christopher Wrigley, Kebei Li, Jung Soo Park
  • Patent number: D964670
    Type: Grant
    Filed: March 31, 2021
    Date of Patent: September 20, 2022
    Assignee: Heatworks Technologies, Inc.
    Inventors: Jeremiah M. Callahan, Adam C. Wrigley, Inna Lobel, Jung Soo Park, Alexander C. Calkins, Christopher B. Crowley, Reid A. Schlegel
  • Patent number: D979313
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: February 28, 2023
    Assignee: OhmIQ, LLC
    Inventors: Jeremiah M. Callahan, Adam C. Wrigley, Jung Soo Park, Inna Lobel, Kebei Li, Francois Nguyen