Patents by Inventor Jung Woo Choi

Jung Woo Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240155505
    Abstract: A method of a first user equipment (UE) may comprise: receiving a downlink (DL) reference signal transmitted by a base station using a beam included in a beam candidate group to be used for sidelink (SL) communication with a second UE; measuring a DL reference signal received power (RSRP) of the DL reference signal; determining a transmit power of a beam included in the beam candidate group based on the measured DL RSRP; and transmitting SL data to the second UE with the determined transmit power.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 9, 2024
    Inventors: Jun Hyeong KIM, Go San NOH, Seon Ae KIM, Il Gyu KIM, Hee Sang CHUNG, Dae Soon CHO, Sung Woo CHOI, Seung Nam CHOI, Jung Pil CHOI
  • Publication number: 20240155929
    Abstract: An apparatus for manufacturing a display device includes a plurality of working tables, a plurality of arm modules, and a rotator. The plurality of working tables are spaced apart from each other in a first direction and are configured to support a target board. The plurality of arm modules are arranged in the first direction and spaced apart from the plurality of working tables in a second direction intersecting the first direction. The rotator is connected to the plurality of arm modules and configured to rotate about a rotation axis extending in the first direction.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 9, 2024
    Inventors: Myung Gil CHOI, Jung Min LEE, Dong Woo KIM, Sang Moo LEE
  • Publication number: 20240151440
    Abstract: An embodiment multi-way coolant valve includes an outer housing including first to third outer inlets, first to third outer outlets, and a pump mount portion coupled to one of the outer outlets, an inner housing rotatably provided within the outer housing and including penetration holes corresponding to the outer inlets and outlets, a coolant line defined by a selective connection of the penetration holes such that the outer inlets and outlets are selectively connected, pads interposed between an interior circumference of the outer housing and an exterior circumference of the inner housing at locations of the outer inlets and outlets, respectively, and a driving device connected to a rotation center of the inner housing to selectively rotate the inner housing within the outer housing, wherein the inner housing is configured to rotate by a preset interval according to a selected vehicle mode.
    Type: Application
    Filed: May 10, 2023
    Publication date: May 9, 2024
    Inventors: Wan Je Cho, Namho Park, Seong-Bin Jeong, Yeonho Kim, Tae Hee Kim, Jae-Eun Jeong, Man Hee Park, Jae Yeon Kim, Hyunjae Lee, Seong Woo Jeong, Jung Bum Choi, Ho Sung Kang, Jeong Wan Han
  • Patent number: 11979227
    Abstract: An operation method of a relay node may include: receiving, from a first communication node, first data composed of n bits; receiving, from a second communication node, second data composed of m bits; in response to determining that n is greater than m, generating first T-data of m bits excluding (n-m) bits from the n-bits of the first data and first R-data of (n-m) bits; generating third data by performing a network coding operation on the first T-data and the second data; transmitting the third data to the first communication node; and transmitting the third data and the first R-data to the second communication node.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: May 7, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jun Hyeong Kim, Gyu Il Kim, Go San Noh, Hee Sang Chung, Dae Soon Cho, Sung Woo Choi, Seung Nam Choi, Jung Pil Choi
  • Patent number: 11970613
    Abstract: Embodiments relate to a polymer film. The polymer film comprises a polymer resin selected from the group consisting of a polyamide-based resin and a polyimide-based resin and has a haze (HZ0) before autoclave treatment of 3% or less and a ?HZ24 represented by Equation 1a of 500% or less.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: April 30, 2024
    Assignee: SK MICROWORKS CO., LTD.
    Inventors: Jung Hee Ki, Sunhwan Kim, Sang Hun Choi, Dae Seong Oh, Han Jun Kim, Jin Woo Lee, Dong Jin Lim
  • Patent number: 11969917
    Abstract: A silicon carbide wafer manufacturing method includes: a bending measuring step of measuring a first edge having the greatest degree of a bending at one surface of a silicon carbide ingot having one surface; a cutting start step of starting a cutting at a second edge having a distance of r×a along an edge of the one surface from the first edge in a direction parallel to or with a predetermined off angle with respect to the one surface through the wire saw, a cutting speed being decreased to a first cutting speed in the cutting start step; a cutting proceeding step in which the first cutting speed is substantially constant within a variation of about ±5% of the first cutting speed; and a finish step in which the cutting speed is increased from the first cutting speed and the cutting of the silicon carbide ingot is completed.
    Type: Grant
    Filed: January 14, 2022
    Date of Patent: April 30, 2024
    Assignee: SENIC Inc.
    Inventors: Jung-Gyu Kim, Kap-Ryeol Ku, Jung Doo Seo, Jung Woo Choi, Jong Hwi Park
  • Publication number: 20240116882
    Abstract: The present invention relates to a novel benzotriazole derivative compound, a tautomer thereof, a pharmaceutically acceptable salt thereof, a hydrate thereof, or a stereoisomer thereof, which are related to a compound for inhibiting ENPP1, a composition for inhibiting ENPP1, and a method for inhibiting ENPP1.
    Type: Application
    Filed: January 28, 2022
    Publication date: April 11, 2024
    Applicant: TXINNO BIOSCIENCE INC.
    Inventors: Chan Sun Park, Sung Joon Kim, Ali Imran, Yoo Jin Na, So Ra Paik, Jung Hwan Choi, Sun Woo Lee, Yong Yea Park, Ah Ran Yu, Sun Young Park
  • Patent number: 11951130
    Abstract: The present invention relates to an antigen-binding molecule comprising a heavy chain variable region comprising a heavy-chain complementarity-determining region 1 (HCDR1) comprising an amino acid sequence represented by Sequence No. 1, an HCDR2 comprising an amino acid sequence represented by Sequence No. 2, and an HCDR3 comprising an amino acid sequence represented by Sequence No. 3; a light-chain variable region comprising a light-chain complementarity-determining region 1 (LCDR1) comprising an amino acid sequence represented by Sequence No. 4, an LCDR2 comprising an amino acid sequence represented by Sequence No. 5, and an LCDR3 comprising an amino acid sequence represented by Sequence No. 6; wherein the antigen-binding molecule is a T cell receptor (TCR); and to a cell line expressing the same.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: April 9, 2024
    Assignee: Eutilex Co., Ltd.
    Inventors: Byoung S. Kwon, Young Ho Kim, Kwang Hee Kim, Ji Won Chung, Young Gyoon Chang, Bo Rim Yi, Jung Yun Lee, Seung Hyun Lee, Sun Woo Im, Jin Kyung Choi, Hyun Tae Son, Eun Hye Yoo
  • Patent number: 11942635
    Abstract: The present invention relates to a positive electrode active material and a lithium secondary battery using a positive electrode containing the positive electrode active material. More particularly, the present invention relates to a positive electrode active material that is able to solve a problem of increased resistance according to an increase in Ni content by forming a charge transport channel in a lithium composite oxide and a lithium secondary battery using a positive electrode containing the positive electrode active material.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: March 26, 2024
    Assignee: ECOPRO BM CO., LTD.
    Inventors: Moon Ho Choi, Jun Won Suh, Jin Kyeong Yun, Jung Han Lee, Mi Hye Yun, Seung Woo Choi, Gwang Seok Choe, Ye Ri Jang, Joong Ho Bae
  • Patent number: 11939698
    Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: March 26, 2024
    Assignee: SENIC INC.
    Inventors: Jong Hwi Park, Jung-Gyu Kim, Eun Su Yang, Byung Kyu Jang, Jung Woo Choi, Yeon Sik Lee, Sang Ki Ko, Kap-Ryeol Ku
  • Publication number: 20240098311
    Abstract: The present invention relates to an image encoding/decoding method and apparatus. An image encoding method according to the present invention may comprise generating a transform block by performing at least one of transform and quantization; grouping at least one coefficient included in the transform block into at least one coefficient group (CG); scanning at least one coefficient included in the coefficient group; and encoding the at least one coefficient.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 21, 2024
    Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, INDUSTRY ACADEMY COOPERATION FOUNDATION OF SEJONG UNIVERSITY
    Inventors: Sung Chang LIM, Jung Won KANG, Hyun Suk KO, Jin Ho LEE, Dong San JUN, Ha Hyun LEE, Seung Hyun CHO, Hui Yong KIM, Jin Soo CHOI, Yung Lyul LEE, Jun Woo CHOI
  • Patent number: 11935926
    Abstract: A method for fabricating a semiconductor device includes forming a stack structure including a horizontal recess over a substrate, forming a blocking layer lining the horizontal recess, forming an interface control layer including a dielectric barrier element and a conductive barrier element over the blocking layer, and forming a conductive layer over the interface control layer to fill the horizontal recess.
    Type: Grant
    Filed: January 18, 2023
    Date of Patent: March 19, 2024
    Assignee: SK hynix Inc.
    Inventors: Hyeng-Woo Eom, Jung-Myoung Shim, Young-Ho Yang, Kwang-Wook Lee, Won-Joon Choi
  • Patent number: 11935703
    Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: March 19, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Jung Min Kim, Bon Seok Koo, Chang Hak Choi, Il Ro Lee, Byung Woo Kang, San Kyeong, Hae Sol Kang
  • Patent number: 11937490
    Abstract: An apparatus for manufacturing a display device includes a plurality of working tables, a plurality of arm modules, and a rotator. The plurality of working tables are spaced apart from each other in a first direction and are configured to support a target board. The plurality of arm modules are arranged in the first direction and spaced apart from the plurality of working tables in a second direction intersecting the first direction. The rotator is connected to the plurality of arm modules and configured to rotate about a rotation axis extending in the first direction.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: March 19, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Myung Gil Choi, Jung Min Lee, Dong Woo Kim, Sang Moo Lee
  • Publication number: 20240080320
    Abstract: A server according to an embodiment includes a processor configured to receive a friend add request for a target account from a user terminal accessed with a user account; based on one of the user account and the target account being a protected account, transmit an approval request for the friend add request to a protector account connected to the protected account; and based on receiving a reply to the approval request from the protector terminal, add the target account to a friend list of the user account.
    Type: Application
    Filed: April 27, 2023
    Publication date: March 7, 2024
    Inventors: You Jin KIM, Jung Woo CHOI, Jenog Ryeol CHOI, Joong Seon KIM, Hong Chan YUN, Ju Ho CHUNG, Do Hyun YOUN, Hyung Min KIM, Hyun Ok CHOI, Chun Ho KIM, Soo Beom KIM, Min Jeong KIM, Chang Oh HEO, Eun Soo HEO
  • Publication number: 20240076799
    Abstract: A wafer manufacturing method, an epitaxial wafer manufacturing method, and a wafer and epitaxial wafer manufactured thereby, are provided. The wafer manufacturing method enables the manufacture of a wafer with a low density of micropipe defects and minimum numbers of particles and scratches. The epitaxial wafer manufacturing method enables the manufacture of an epitaxial wafer that has low densities of defects such as downfall, triangular, and carrot defects, exhibits excellent device characteristics, and improves the yield of devices.
    Type: Application
    Filed: November 1, 2023
    Publication date: March 7, 2024
    Applicant: SENIC INC.
    Inventors: Jong Hwi PARK, Jung-Gyu KIM, Eun Su YANG, Byung Kyu JANG, Jung Woo CHOI, Yeon Sik LEE, Sang Ki KO, Kap-Ryeol KU
  • Patent number: 11925118
    Abstract: A method of inactivating harmful microorganisms of a filtration medium including pathogenic bacteria and viruses is disclosed which includes placing a predetermined quantity of a hybridized fluorescent silk on to a filtration medium, applying light for a predetermined amount of time to the placed quantity of the hybridized fluorescent silk, and passing a fluid through the medium, wherein the fluid is one of substantially air or substantially water, wherein the hybridized fluorescent silk is one of KillerRed, SuperNova, KillerOrange, Dronpa, TurboGFP, mCherry, or any combination thereof.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: March 5, 2024
    Assignee: Purdue Research Foundation
    Inventors: Jung Woo Leem, Seung Ho Choi, Young L. Kim
  • Patent number: 11919375
    Abstract: The present disclosure relates to a vehicle door coupling device, and more specifically, to a vehicle door coupling device for mechanically coupling together a first member having a first hole and a second member having a second hole at a position corresponding to the first hole.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: March 5, 2024
    Assignee: KWANGJIN CO., LTD.
    Inventors: Jung Woo Choi, Kwan Yong Lee
  • Patent number: 11925117
    Abstract: A method of disinfection of a surface of a subject of harmful microorganisms including pathogenic bacteria and viruses upon visible light irradiation using a hybridized fluorescent silk is provided. The method includes placing a predetermined quantity of the hybridized fluorescent silk i) directly on to a skin surface of a subject; or ii) on a medium and then placing the medium on the skin surface of the subject. The method further includes applying light in the visible spectrum for a predetermined amount of time to the placed quantity of hybridized fluorescent silk, wherein the hybridized fluorescent silk is one of KillerRed, SuperNova, KillerOrange, Dronpa, TurboGFP, mCherry, or any combination thereof.
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: March 5, 2024
    Assignee: Purdue Research Foundation
    Inventors: Jung Woo Leem, Seung Ho Choi, Young L. Kim
  • Patent number: 11862685
    Abstract: The wafer having a retardation distribution measured with a light having a wavelength of 520 nm, wherein an average value of the retardation is 38 nm or less, wherein the wafer comprises a micropipe, and wherein a density of the micropipe is 1.5/cm2 or less, is disclosed.
    Type: Grant
    Filed: February 4, 2022
    Date of Patent: January 2, 2024
    Assignee: SENIC INC.
    Inventors: Jong Hwi Park, Kap-Ryeol Ku, Jung-Gyu Kim, Jung Woo Choi, Myung-Ok Kyun