Abstract: A system and method for providing a vapor are described. In one variation, liquid is placed in a containment vessel, and a pressure in the containment vessel is reduced below atmospheric pressure. The pressure in the vessel is monitored and the liquid is heated in response to the sensed pressure falling below a desired level. When needed, the vapor is delivered from the liquid containment vessel to the external system.

Abstract: A system and method for preventing formation of a plasma-inhibiting substance within a plasma chamber is provided. In one embodiment, an apparatus that includes a barrier component configured to be disposed within a plasma chamber. The barrier component includes a wall that defines a plasma formation region where a chemically-reducing species is formed from a fluid. A portion of the wall is formed of a substance that is substantially inert to the chemically-reducing species. The wall prevents the chemically-reducing species from interacting with an inner surface of the plasma chamber to form a conductive substance. The barrier component also includes an opening in fluid communication with the plasma formation region. The fluid is introduced into the plasma formation region via the opening.

Abstract: A system and method for providing a vapor are described. In one variation, liquid is placed in a containment vessel, and a pressure in the containment vessel is reduced below atmospheric pressure. The pressure in the vessel is monitored and the liquid is heated in response to the sensed pressure falling below a desired level. When needed, the vapor is delivered from the liquid containment vessel to the external system.

Abstract: A plasma discharge device is provided having features for enhanced thermal management and protection of dielectric materials in the device. The invention generally comprises a plasma confinement chamber constructed at least in part of dielectric materials, with a cooling instrument disposed in contact with the outer dielectric surfaces of the chamber for substantially uniform heat extraction. The cooling instrument may be embedded within an encapsulating material that enhances the uniformity of heat extraction from a dielectric plasma chamber. By improving the uniformity of heat extraction from the dielectric chamber of a plasma discharge device, the invention permits reliable operation of a plasma discharge device at significantly improved power levels.

Abstract: A method and apparatus are described for making a coldplate. A first component of, for example copper, is explosion welded to a second component of, for example aluminum. The first metal component has a top surface opposite the second metal component and at least one channel proximate the top surface adapted to carry a cooling fluid. The coldplate can be used as an interior wall for a plasma chamber.

Abstract: In one aspect of the invention is a method to construct plasma chambers with improved wall resistance to deterioration. In one embodiment of the invention, a chamber is made of an aluminum alloy having low concentrations of elements that form non-soluble, intermetallic particles to address coating/substrate issues, has swaged-in cooling tubes to reduce thermal stress by improving thermal resistance, and has a plurality of dielectric gaps to decrease ion bombardment.

Abstract: A plasma generation device has a plasma containment vessel comprising integral cast cooling elements. A casting mold is placed over a foundation, leaving at least one surface of the foundation exposed. At least one cooling tube is then placed over the foundation, and a casting material is then poured into the casting mold over the foundation and the cooling tubes. The foundation portion of the assembly is machined and anodized to become an interior and vacuum surface of a plasma chamber with integral cooling elements.

Abstract: A method and apparatus are described for making a coldplate. A first component of, for example copper, is explosion welded to a second component of, for example aluminum. The first metal component has a top surface opposite the second metal component and at least one channel proximate the top surface adapted to carry a cooling fluid. The coldplate can be used as an interior wall for a plasma chamber.

Abstract: A method and apparatus are described for inserting a cooling tube into a metal component to remove heat generated at the surface by flowing fluid through the tube, thereby cooling the metal component. A cooling tube is placed into a groove of a metal component having first and second surfaces, where the width of the groove at the surfaces is approximately equal to the outer diameter of the cooling tube. The metal component also has two ridges: a first ridge on one end of the groove at the first surface of the metal component, and a second ridge on the other end of the groove at the second surface of the metal component. After the cooling tube is placed in the groove of the metal component, the cooling tube is swaged into the groove of the metal component by applying pressure to the first and second ridges until the first ridge, second ridge, and cooling tube are flush with the top surface.

Abstract: In a first aspect, a valve/sensor assembly is provided that includes a door assembly. The door assembly has (1) a first position adapted to seal an opening of a chamber; (2) a second position adapted to allow at least a blade of a substrate handler to extend through the opening of the chamber; and (3) a mounting mechanism adapted to couple the door assembly to the chamber. The valve/sensor assembly also includes a sensor system having a transmitter and a receiver adapted to detect a presence of a substrate and to communicate through at least a portion of the door assembly. Systems, methods and computer program products are provided in accordance with this and other aspects.

Abstract: In a first aspect, a valve/sensor assembly is provided that includes a door assembly. The door assembly has (1) a first position adapted to seal an opening of a chamber; (2) a second position adapted to allow at least a blade of a substrate handler to extend through the opening of the chamber; and (3) a mounting mechanism adapted to couple the door assembly to the chamber. The valve/sensor assembly also includes a sensor system having a transmitter and a receiver adapted to detect a presence of a substrate and to communicate through at least a portion of the door assembly. Systems, methods and computer program products are provided in accordance with this and other aspects.

Abstract: In a first aspect, a valve/sensor assembly is provided that includes a door assembly. The door assembly has (1) a first position adapted to seal an opening of a chamber; (2) a second position adapted to allow at least a blade of a substrate handler to extend through the opening of the chamber; and (3) a mounting mechanism adapted to couple the door assembly to the chamber. The valve/sensor assembly also includes a sensor system having a transmitter and a receiver adapted to detect a presence of a substrate and to communicate through at least a portion of the door assembly. Systems, methods and computer program products are provided in accordance with this and other aspects.

Abstract: In a first aspect, a valve/sensor assembly is provided that includes a door assembly. The door assembly has (1) a first position adapted to seal an opening of a chamber; (2) a second position adapted to allow at least a blade of a substrate handler to extend through the opening of the chamber; and (3) a mounting mechanism adapted to couple the door assembly to the chamber. The valve/sensor assembly also includes a sensor system having a transmitter and a receiver adapted to detect a presence of a substrate and to communicate through at least a portion of the door assembly. Systems, methods and computer program products are provided in accordance with this and other aspects.