Patents by Inventor Kai Huang

Kai Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240154021
    Abstract: A p-GaN high-electron-mobility transistor (HEMT) includes a buffer layer stacked on a substrate, a channel layer stacked on the buffer layer, a supply layer stacked on the channel layer, a doped layer stacked on the supply layer, and a hydrogen barrier layer covering the supply layer and the doped layer. A source and a drain are electrically connected to the channel layer and the supply layer, respectively. A gate is located on the doped layer. The hydrogen barrier layer is doped with fluorine.
    Type: Application
    Filed: December 29, 2022
    Publication date: May 9, 2024
    Inventors: TING-CHANG CHANG, Wei-Chen Huang, Shih-Kai Lin, Yong-Ci Zhang, Sheng-Yao Chou, Chung-Wei Wu, Po-Hsun Chen
  • Publication number: 20240155029
    Abstract: A method for optimizing data access performance, which is applied to an intermediate device, is described. The intermediate device is a network device between a client and a server side, there are one or more clients and one or more server sides. The method includes the intermediate device parsing a received first packet to obtain a feature of the first packet, where the first packet is from a terminal on which one of the clients is located, the first packet is used to request data from one of the server sides, the feature indicates the data requested by using the first packet, and the feature is carried in a part that is of the first packet and that corresponds to application layer data. The method may also include, when the intermediate device stores the data requested by using the first packet, sending the data requested by using the first packet to the terminal.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 9, 2024
    Inventors: Yan XU, Wanhong MENG, Haiyan CHEN, Kai DU, Jun HUANG
  • Patent number: 11980072
    Abstract: A display device, including a flexible substrate, multiple lighting units, and multiple signal lines, is provided. The lighting units and the signal lines are located on the flexible substrate, and the signal lines are respectively electrically connected to the lighting units. Each signal line includes multiple first conductive patterns, at least one second conductive pattern, and at least one third conductive pattern. The first conductive patterns are located on the flexible substrate. The second conductive pattern is located on the first conductive patterns, and two ends of each second conductive pattern are respectively connected to two first conductive patterns. In a stretched state, the two first conductive patterns twist the commonly connected second conductive pattern. The third conductive pattern is superimposed on the second conductive pattern.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: May 7, 2024
    Assignee: Au Optronics Corporation
    Inventors: Zih-Shuo Huang, Tsung-Ying Ke, Shang-Kai Shen
  • Patent number: 11979925
    Abstract: For example, an apparatus may be configured to generate, transmit, receive and/or process a frame including a multiple Basic Service Set Identifier (BSSID) element corresponding to a multiple BSSID set including a reporting AP, the BSSID element including one or more non-transmitted BSSID profile elements corresponding to one or more other APs belonging to the multiple BSSID set, wherein a non-transmitted BSSID profile element corresponding to an other AP includes one or more elements of information corresponding to the other AP, and a multi-link element, the multi-link element including one or more profile subelements for one or more reported APs of an other MLD including the other AP, respectively, wherein a profile subelement corresponding to a reported AP includes one or more elements of information corresponding to the reported AP.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: May 7, 2024
    Assignee: INTEL CORPORATION
    Inventors: Laurent Cariou, Po-Kai Huang
  • Patent number: 11976825
    Abstract: Air conditioning system and a method for controlling same. The air conditioning system is configured to carry out air conditioning in indoor space, and includes an indoor unit body. The indoor unit body includes a cavity and a heat exchanger arranged inside the cavity. The air conditioning system further includes at least one return air inlet connecting the indoor space to the cavity. The at least one return air inlet includes a first return air inlet, and the first return air inlet is located at a lower portion of the indoor space.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: May 7, 2024
    Assignee: Gree Electric Appliances, Inc. of Zhuhai
    Inventors: Haiwei Huang, Kai Wang, Fengqiang Huang
  • Publication number: 20240145520
    Abstract: The present disclosure provides a method for fabricating an image sensor. The method includes the following operations. A cavity is formed at a first surface of a substrate. A germanium layer is formed in the cavity. A first heavily doped region is formed in the germanium layer by an implantation operation. A second heavily doped region is formed at a position proximal to a top surface of the germanium layer, wherein the second heavily doped region is laterally surrounded by the first heavily doped region from a top view perspective. An interconnect structure is formed over the germanium layer.
    Type: Application
    Filed: January 4, 2024
    Publication date: May 2, 2024
    Inventors: JHY-JYI SZE, SIN-YI JIANG, YI-SHIN CHU, YIN-KAI LIAO, HSIANG-LIN CHEN, KUAN-CHIEH HUANG, JUNG-I LIN
  • Publication number: 20240145292
    Abstract: A single wafer spin cleaning apparatus with soaking, cleaning, and etching functions in accordance with the present invention includes a spin driver device, a wafer spin chuck, and a wafer support disk. The wafer spin chuck is driven by the spin driver device to spin. The wafer support disk is annular and surrounds the wafer spin chuck, can act relative to the wafer spin chuck to a wafer support position or a wafer disengagement position, and includes a soaking trough. The wafer support disk at the wafer support position can support a wafer such that the wafer is soaked in processing liquid injected in the soaking trough for implementing a high efficient cleaning or etching process.
    Type: Application
    Filed: February 2, 2023
    Publication date: May 2, 2024
    Inventors: Li-tso HUANG, Hsiu-kai CHANG, Chin-yuan WU, Ming-che HSU
  • Publication number: 20240141205
    Abstract: This disclosure relates to a composition that includes at least one first ruthenium removal rate enhancer; at least one copper removal rate inhibitor; at least one low-k removal rate inhibitor; and an aqueous solvent.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 2, 2024
    Inventors: Ting-Kai Huang, Bin Hu, Yannan Liang, Hong Piao
  • Publication number: 20240139944
    Abstract: The robotic arm operating system includes a control device, a plurality of joint devices and a brake release monitoring device. The control device is used to generate an operation instruction. The joint device is coupled to the control device. Each joint device includes a motor and a driver. The drivers of the joint devices receive the operation instruction to generate corresponding multiple unlocking signals. The unlocking signals are used to release a braking state of the motors of the corresponding joint devices. The brake release monitoring device is coupled to the control device and the joint devices, and includes a plurality of monitoring circuits. When one of the plurality of monitoring circuits does not receive the corresponding unlocking signal, the brake release monitoring device notifies the control device that the operation instruction is not allowed.
    Type: Application
    Filed: October 27, 2022
    Publication date: May 2, 2024
    Inventors: Hsin-Fu WANG, Shun-Kai CHANG, Yen-Shun HUANG
  • Publication number: 20240147230
    Abstract: This disclosure describes systems, methods, and devices related to coexistence network integration. A device may transmit a beacon frame or a probe response frame containing a security element that is not a robust security network element (RSNE) element to indicate opportunistic wireless encryption (OWE) support. The device may identify a first association request frame received from a first station device (STA) comprising an RSNE element with OWE Authentication Key Management (AKM) indicating a compatibility of the first STA with OWE. The device may identify a second association request frame from a second station device (STA) indicating no compatibility with OWE. The device may generate one or more encryption keys for securing data transmission with OWE-compatible STAs. The device may transmit encrypted and unencrypted versions of groupcast data frames to the first STA and the second STA.
    Type: Application
    Filed: December 26, 2023
    Publication date: May 2, 2024
    Applicant: Intel Corporation
    Inventors: Ido OUZIELI, Po-Kai HUANG, Ehud RESHEF
  • Patent number: 11972789
    Abstract: The present disclosure provides a counter circuit and a memory. The counter circuit includes: a counting circuit configured to output a count value when the count value exceeds a predetermined threshold; a decoding circuit coupled to the counting circuit, and configured to decode the count value to obtain decoding information corresponding to the count value, where the decoding information represents a numerical interval in which the count value is located; and a comparison circuit coupled to the decoding circuit, and configured to compare the decoding information with historical maximum decoding information and latch and output current maximum decoding information.
    Type: Grant
    Filed: August 4, 2023
    Date of Patent: April 30, 2024
    Assignee: Changxin Memory Technologies, Inc.
    Inventors: Zequn Huang, Kai Sun
  • Patent number: 11974227
    Abstract: This disclosure describes systems, methods, and devices related to wake up receiver (WUR) frequency division multiple access (FDMA) transmission. A device may cause to send a wake up receiver (WUR) beacon frame on a WUR beacon operating channel to one or more station devices. The device may determine a first wake-up frame to be sent on a first WUR operating channel, wherein the first WUR operating channel is associated with one or more frequency division multiple access (FDMA) channels used for transmitting one or more wake-up frames to the one or more station devices. The device may determine to apply padding to the first wake-up frame based on a field included in a header of the first wake-up frame. The device may cause to send the first wake-up frame to a first station device of the one or more station devices.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Po-Kai Huang, Shahrnaz Azizi, Daniel F. Bravo, Thomas J. Kenney, Vinod Kristem, Noam Ginsburg
  • Patent number: 11969677
    Abstract: A method for eliminating bubbles from a liquid dispensing system includes flowing a liquid containing bubbles into a liquid inlet of a tank from a filter to substantially fill the tank, wherein substantially all bubbles accumulate in an upper portion of the tank having a lateral dimension greater than a lateral dimension of a lower portion of the tank, and flowing the liquid into the tank comprises flowing the liquid through an inlet pipe extending at an acute angle relative to a horizontally-oriented axis of the tank. The method further includes flowing a liquid substantially free of bubbles out of the tank via a liquid outlet at the lower portion of the tank for dispensing to a substrate.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: April 30, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Y. L. Huang, Chin-Kun Fang, Li-Jen Wu, Yu Kai Chen
  • Patent number: 11971319
    Abstract: A surface electromyography signal-torque matching method based on multi-segmentation parallel CNN model (MSP-CNN model), step 1: collecting torque signals and surface electromyography (sEMG) signals when tightening a bolt; step 2: dividing a range of a transducer by at least two granularities, generating a plurality of torque sub-ranges corresponding to the at least two granularities and labeling the plurality of torque sub-ranges with torque labels; step 3: generating sEMG graphs of the sEMG signals in each time window; step 4: determining the torque labels of each time window under each of the at least two granularities according to the torque sub-ranges that average values of torques fall in; step 5: establishing a sample set; step 6: building a MSP-CNN model, and training parallel independent CNN models with sample datasets; and step 7: inputting the sEMG signals of the operator during assembly into trained MSP-CNN model and identifying assembly torques.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: April 30, 2024
    Assignees: QINGDAO UNIVERSITY OF TECHNOLOGY, XI'AN JIAOTONG UNIVERSITY
    Inventors: Cheng Jun Chen, Kai Huang, Dong Nian Li, Shuai Zheng, Jun Hong
  • Patent number: 11973679
    Abstract: This disclosure describes systems, methods, and devices related to enhanced frame exchange. A device may generate a first subset of a plurality of fields, wherein the first subset is mandatory in a probe request frame. The device may generate a second subset of the plurality of fields, wherein the second subset is optional in the probe request frame regardless of capability information of the device. The device may generate the probe request frame comprising the first subset and the second subset. The device may cause to send the probe request frame to an access point (AP) device.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Po-Kai Huang, Robert Stacey, Daniel Bravo, Ido Ouzieli, Danny Alexander, Ofer Hareuveni
  • Publication number: 20240135503
    Abstract: Disclosed here are various techniques for improving the testing and training of datasets comprising sequences of skeletal representations performing various actions. The dataset can be denoised by applying various techniques to determine noisy frames within each sequence and eliminating the sequences from the dataset when the number of noisy frames in the sequence is too large. In addition, the dataset may be augmented by various data augmentation techniques to manipulate the skeletal representations, after denoising.
    Type: Application
    Filed: October 19, 2023
    Publication date: April 25, 2024
    Applicants: CARNEGIE MELLON UNIVERSITY, AnyVision Interactive Technologies, Ltd.
    Inventors: Marios Savvides, Yu Kai Huang, Eddie Yu
  • Publication number: 20240138006
    Abstract: This disclosure describes systems, methods, and devices related to adding or removing communication access points (APs) affiliated with an associated AP multi-link device (AP-MLD). A non-AP-MLD may identify a communication link between the non-AP-MLD and an AP-MLD, the communication link previously used by the non-AP-MLD; encode a request frame comprising a multi-link reconfiguration element indicative of a request to add or remove the communication link; cause the non-AP-MLD to transmit the request frame to the AP-MLD; and identify a response frame received from the AP-MLD, the response frame comprising the multi-link reconfiguration element and indicating whether the communication link was accepted or rejected to be added or removed.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Po-Kai Huang, Ido Ouzieli, Danny Alexander, Daniel Bravo, Laurent Cariou
  • Publication number: 20240136401
    Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having a first semiconductor material. A second semiconductor material is disposed on the first semiconductor material and a passivation layer is disposed on the second semiconductor material. A first doped region and a second doped region extend through the passivation layer and into the second semiconductor material. A silicide is arranged within the passivation layer and along tops of the first doped region and the second doped region.
    Type: Application
    Filed: January 5, 2024
    Publication date: April 25, 2024
    Inventors: Yin-Kai Liao, Sin-Yi Jiang, Hsiang-Lin Chen, Yi-Shin Chu, Po-Chun Liu, Kuan-Chieh Huang, Jyh-Ming Hung, Jen-Cheng Liu
  • Publication number: 20240137971
    Abstract: An extremely high throughput (EHT) station (STA) configured for trigger based (TB) transmission may decode an trigger frame (TF) received from an access point (AP). The TF may include an assignment of resources comprising one or more 20 MHz channels. The EHT STA may determine which of the one or more assigned channels are available for transmission and which of the allocated channels are unavailable when the EHT STA is assigned more than one 20 MHz channel. The EHT STA may encode a EHT TB PPDU in response to the trigger frame. The EHT TB PPDU may be encoded to include an EHT preamble followed by a data field. The EHT preamble may be encoded to indicate channel availability. The EHT STA may generate signalling to cause the EHT STA to transmit the encoded EHT TB PPDU only on the assigned channels that have been determined to be available.
    Type: Application
    Filed: August 29, 2023
    Publication date: April 25, 2024
    Inventors: Xiaogang Chen, Qinghua Li, Feng Jiang, Ziv Avital, Po-Kai Huang
  • Publication number: 20240136263
    Abstract: An electronic package is provided, in which a first electronic module and a second electronic module are stacked via a plurality of first conductive structures and a plurality of second conductive structures, and the amount of solder of the first conductive structures is greater than the amount of solder of the second conductive structures, such that the electronic package can be configured with the first conductive structures and the second conductive structures according to the degree of warpage of the electronic package, so as to effectively disperse the stress to avoid the problem of warpage.
    Type: Application
    Filed: December 12, 2022
    Publication date: April 25, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Hung-Kai WANG, Yih-Jenn JIANG, Don-Son JIANG, Yu-Lung HUANG, Men-Yeh CHIANG