Patents by Inventor Kai Lu

Kai Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136428
    Abstract: Improved inner spacers for semiconductor devices and methods of forming the same are disclosed.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Inventors: Wen-Kai Lin, Che-Hao Chang, Chi On Chui, Yung-Cheng Lu
  • Publication number: 20240128739
    Abstract: The photovoltaic system includes an inverter, a fan, and a controller. A photovoltaic string and a direct current bus capacitor are connected between a positive input end and negative input end of the inverter. The controller receives a fast shutdown instruction and sends a drive signal to a switching transistor in the inverter, so that the switching transistor performs a switching action under the action of the drive signal, and the switching transistor consumes electric energy during the switching action; or the controller turns on the fan after receiving the fast shutdown instruction to consume electric energy by using the fan; or the controller may send the drive signal to the switching transistor and also control the fan to be turned on, so that both the switching transistor and the fan consume electric energy.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: Huawei Digital Power Technologies Co., Ltd.
    Inventors: Li LU, Kai XIN, Xinyu YU, Boping YANG
  • Patent number: 11959829
    Abstract: A startup stage protection device used in Electric Multiple Unit (EMU) train coupler experiment is provided between two test cars. The startup stage protection device is arranged between and tightly abuts two test cars at the starting stage of the experiment to receive a compressing force in place of the coupler. The startup stage protection device separates from the two test cars after the end of the starting stage.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: April 16, 2024
    Assignee: CENTRAL SOUTH UNIVERSITY
    Inventors: Ping Xu, Shuguang Yao, Bowen Tan, Yong Peng, Zhaijun Lu, Chengming Sun, Kai Xu, Qi Huang
  • Publication number: 20240120207
    Abstract: A semiconductor package includes a die having a plurality of devices over a first substrate, where the first substrate includes a dopant at a first concentration and the first substrate has a first width along a horizontal direction. The semiconductor package further includes a second substrate fused with the first substrate, where the second substrate includes the dopant at a second concentration greater than the first concentration.
    Type: Application
    Filed: February 15, 2023
    Publication date: April 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Lung-Kai Mao, Wen-Hsiung Lu, Pei-Wei Lee, Szu-Hsien Lee, Chieh-Ning Feng
  • Publication number: 20240109809
    Abstract: The present application provides a precise ion implantation type modified geopolymer and an efficient preparation method thereof, wherein the precise ion implantation type modified geopolymer comprise: a geopolymer source material with a specific size, which implanted by Si and Al ions with a designated dose by an ion implanter. The geopolymer source material consists of a mixture of solid waste, alkali activator, and water.
    Type: Application
    Filed: April 5, 2023
    Publication date: April 4, 2024
    Inventors: Haifeng LU, Kai ZHANG, Dong He, Xiaoxuan KONG, Xiangheng XIAO, Hang XU
  • Publication number: 20240099490
    Abstract: A locker opening control method, including: sending, based on a triggering operation by a user, a login request carrying a user authorization credential to a first server, so that the first server requests user information from a second server based on the user authorization credential; receiving pickup information corresponding to the user information sent by the first server; displaying, based on the pickup information, a pickup detail page including a locker opening function button; and in response to a triggering operation on the locker opening function button on the pickup detail page by the user, sending a locker opening request to the first server.
    Type: Application
    Filed: February 8, 2022
    Publication date: March 28, 2024
    Inventors: Xu LIU, Yining LU, Kai CHEN, Wei ZHOU
  • Publication number: 20240097345
    Abstract: A lens for a horn antenna and a horn antenna including the lens. The lens includes a generally flared plate assembly extending generally along an axis from a first side to a second side opposite the first side. The generally flared plate assembly defines a plurality of non-linear channels that are operable to manipulate an electromagnetic wave received at the first side to provide a manipulated electromagnetic wave at the second side.
    Type: Application
    Filed: September 13, 2022
    Publication date: March 21, 2024
    Inventors: Kwok Wa Leung, Zhiyi Zhang, Kai Lu
  • Publication number: 20240096647
    Abstract: A method includes forming a first package component, which formation process includes forming a first plurality of openings in a first dielectric layer, depositing a first metallic material into the first plurality of openings, performing a planarization process on the first metallic material and the first dielectric layer to form a plurality of metal pads in the first dielectric layer, and selectively depositing a second metallic material on the plurality of metal pads to form a plurality of bond pads. The first plurality of bond pads comprise the plurality of metal pads and corresponding parts of the second metallic material. The first package component is bonded to a second package component.
    Type: Application
    Filed: November 28, 2023
    Publication date: March 21, 2024
    Inventors: Mirng-Ji Lii, Chen-Shien Chen, Lung-Kai Mao, Ming-Da Cheng, Wen-Hsiung Lu
  • Patent number: 11934581
    Abstract: The present disclosure provides a terminal vibration evaluation method performed by an electronic device. The method includes: acquiring an actual vibration curve of a target terminal when a target game scenario is displayed; acquiring a predefined vibration description file associated with the target game scenario, and determining a predefined vibration curve according to the predefined vibration description file; determining target deviation data between the actual vibration curve and the predefined vibration curve; and determining, according to the target deviation data, whether vibration of the target terminal matches the target game scenario. The present disclosure provides a measurement solution used for determining whether terminal vibration matches a game scenario (for example, a game sound and a game picture), which helps improve a matching degree between terminal vibration and the game scenario, thereby improving a sense of substitution of the game and a sense of immersion of a player.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: March 19, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Yanhui Lu, Kai Hong, Shili Xu, Haiyang Wu, Qitian Zhang, Jingjing Chen, Zhuan Liu
  • Publication number: 20240088187
    Abstract: Trenches in which to form a back side isolation structure for an array of CMOS image sensors are formed by a cyclic process that allows the trenches to be kept narrow. Each cycle of the process includes etching to add a depth segment to the trenches and coating the depth segment with an etch-resistant coating. The following etch step will break through the etch-resistant coating at the bottom of the trench but the etch-resistant coating will remain in the upper part of the trench to limit lateral etching and substrate damage. The resulting trenches have a series of vertically spaced nodes. The process may result in a 10% increase in photodiode area and a 30-40% increase in full well capacity.
    Type: Application
    Filed: January 3, 2023
    Publication date: March 14, 2024
    Inventors: Chih Cheng Shih, Tsun-Kai Tsao, Jiech-Fun Lu, Hung-Wen Hsu, Bing Cheng You, Wen-Chang Kuo
  • Patent number: 11929274
    Abstract: A poling apparatus for poling a polymer thin film formed on a workpiece carried by a workpiece carrier. The workpiece has grounding electrodes and grounding pads located at edges, and a thin film covering the grounding electrodes but exposing the grounding pads. The workpiece carrier has carrier electrodes located around the workpiece and inside grounding ports at the bottom. The poling apparatus includes, in a poling chamber, a poling source generating a plasma, a Z-elevator to raise the workpiece carrier toward the poling source using the grounding ports, and grounding mechanisms including downwardly biased electrical contacts which, when the workpiece carrier is raised by the Z-elevator, connect the grounding pads of the workpiece with the carrier electrodes, to ground the workpiece. The poling apparatus additionally includes preparation platform and transfer platform with conveyer systems with rollers and Z-elevators to move the workpiece carrier in and out of the poling chamber.
    Type: Grant
    Filed: July 9, 2023
    Date of Patent: March 12, 2024
    Assignee: Creesense Microsystems Inc.
    Inventors: Hongwei Lu, Daliang Wang, Albert Ting, Efrain Velazquez, Xiaoyan Zhang, Kai-An Wang
  • Patent number: 11923432
    Abstract: A method of manufacturing a semiconductor device includes forming a multi-layer stack of alternating first layers of a first semiconductor material and second layers of a second semiconductor material on a semiconductor substrate, forming a first recess through the multi-layer stack, and laterally recessing sidewalls of the second layers of the multi-layer stack. The sidewalls are adjacent to the first recess. The method further includes forming inner spacers with respective seams adjacent to the recessed second layers of the multi-layer stack and performing an anneal treatment on the inner spacers to close the respective seams.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yoh-Rong Liu, Wen-Kai Lin, Che-Hao Chang, Chi On Chui, Yung-Cheng Lu, Li-Chi Yu, Sen-Hong Syue
  • Publication number: 20240071102
    Abstract: Provided are a lane line recognition method, an electronic device and a storage medium, relating to a technical field of artificial intelligence, in particular to technical fields of intelligent transportation, automatic driving and deep learning. The lane line recognition method includes: extracting a basic feature of an original image; recognizing at least one lane line node in the original image by using the basic feature of the original image; extracting a local feature from the basic feature of the original image by using the at least one lane line node; fusing the basic feature and the local feature; and recognizing a lane line in the original image based on a fused result.
    Type: Application
    Filed: January 3, 2023
    Publication date: February 29, 2024
    Inventors: Bin WU, Kai ZHONG, Tongbin ZHANG, Jianzhong YANG, Zhen LU, Deguo XIA, Jizhou HUANG
  • Publication number: 20240055760
    Abstract: An antenna for a phased array antenna. The antenna includes a substrate, a radiation element arranged on the substrate, and a radiation pattern shaping mechanism operable to reduce central radiation provided by the radiation element during operation.
    Type: Application
    Filed: August 11, 2022
    Publication date: February 15, 2024
    Inventors: Kwok Wa Leung, Zhili Su, Kai Lu
  • Patent number: 11901624
    Abstract: An omnidirectional biconical antenna, which includes a first funnel-shaped plate having a wide end and a narrow end; a second funnel-shaped plate having a wide end and a narrow end; and an annular metal lens delimited by the second funnel-shaped plate and the first funnel-shaped plate. The second funnel-shaped plate is inversely positioned relative to the first funnel-shaped plate, such that the narrow ends of the second funnel-shaped plate and the first funnel-shaped plate point to each other.
    Type: Grant
    Filed: October 6, 2022
    Date of Patent: February 13, 2024
    Assignee: City University of Hong Kong
    Inventors: Kwok Wa Leung, Zhiyi Zhang, Kai Lu
  • Publication number: 20230387587
    Abstract: An antenna includes a plurality of antenna elements each respectively operable as a radiator of electromagnetic waves, and a decoupler arrangement operably coupled with the plurality of antenna elements. The decoupler arrangement is configured to prevent, reduce, or substantially eliminate mutual coupling of at least two of the plurality of antenna elements when at least one of the plurality of antenna elements is operated as radiator.
    Type: Application
    Filed: April 24, 2023
    Publication date: November 30, 2023
    Inventors: Kwok Wa Leung, Chen Yang, Kai Lu
  • Publication number: 20230380217
    Abstract: A display panel is provided. The display panel includes a shielding metal disposed on at least one of a first active pattern arranged between a first gate and a second gate and a second active pattern arranged between a third gate and a fourth gate, so that the shielding metal can shield a coupling effect of other signals on the first active pattern and the second active pattern, increase a parasitic capacitance of the first active pattern and the second active pattern, reduce a potential change, and improve a problem of display flicker.
    Type: Application
    Filed: May 18, 2022
    Publication date: November 23, 2023
    Inventor: Kai LU
  • Patent number: 11809303
    Abstract: A high-performance computing-oriented method for automatically deploying an execution environment along with a job, including: presetting isolated execution environments at nodes of a high-performance computing system; logging in an isolated execution environment of a login node; carrying out development and debugging on the job and configuration on a job execution environment at the login node, and issuing a job running request to a job management system; assigning compute nodes from the nodes of the high-performance computing system to the job of the user by the job management system, automatically deploying an file system of the user synchronously to the assigned compute nodes along with the job when the job is loaded, and running the job of the user by the corresponding compute nodes; and feeding results back to the login node of the user after running the job is completed, then clearing file systems.
    Type: Grant
    Filed: November 26, 2021
    Date of Patent: November 7, 2023
    Assignee: NATIONAL UNIVERSITY OF DEFENSE TECHNOLOGY
    Inventors: Kai Lu, Wenzhe Zhang, Ruibo Wang, Wanqing Chi, Yong Dong, Wei Zhang, Huijun Wu, Mingtian Shao
  • Publication number: 20230317467
    Abstract: The present application provides a method of preparing a semiconductor structure. The method includes providing a conductive film; disposing a barrier layer over the conductive film; disposing a first dielectric layer over the barrier layer; disposing a patterned hard mask over the first dielectric layer; and removing a portion of the first dielectric layer exposed through the patterned hard mask, wherein the removal of the portion of the first dielectric layer includes providing a nitrogen plasma to collide with the portion of the first dielectric layer.
    Type: Application
    Filed: March 29, 2022
    Publication date: October 5, 2023
    Inventor: YU-KAI LU
  • Publication number: 20230320059
    Abstract: The present application provides a method of preparing a semiconductor structure. The method includes providing a conductive film; disposing a barrier layer over the conductive film; disposing a first dielectric layer over the barrier layer; disposing a patterned hard mask over the first dielectric layer; and removing a portion of the first dielectric layer exposed through the patterned hard mask, wherein the removal of the portion of the first dielectric layer includes providing a nitrogen plasma to collide with the portion of the first dielectric layer.
    Type: Application
    Filed: March 29, 2022
    Publication date: October 5, 2023
    Inventor: Yu-Kai LU