Abstract: A circuit board including a substrate, a patterned conductive layer, a patterned insulating layer, a conductive terminal, and a dummy terminal is provided. The patterned conductive layer is disposed on the substrate. The patterned insulating layer is disposed on the substrate and at least covers a portion of the patterned conductive layer. The conductive terminal is disposed on the patterned conductive layer and has a first top surface. The dummy terminal is disposed on the patterned conductive layer and has a second top surface. A first height between the first top surface and the substrate is greater than a second height between the second top surface and the substrate.

Abstract: A package structure includes a first substrate, a second substrate, a plurality of conductive pillars and an adhesive layer. The first substrate includes a plurality of vias and a plurality of pads. The pads are disposed on the first substrate, and fill the vias. The second substrate is disposed opposite to the first substrate. Each conductive pillar electrically connects each pad and the second substrate, and the adhesive layer fills the gaps between the conductive pillars. A bonding method of the package structure is also provided.

Abstract: A package substrate structure includes a first substrate, a second substrate, a plurality of conductive pillars and an adhesive layer. The first substrate includes a plurality of vias and a plurality of pads. The vias and the pads are disposed on the first substrate, and fills the vias. The second substrate is disposed opposite to the first substrate. Each conductive pillar is disposed between the first substrate and the second substrate, where each conductive pillar electrically connects each pad and the second substrate, and the adhesive layer fills the gaps between the conductive pillars. A bonding method of the package substrate structure is also provided.

Abstract: A circuit substrate includes a substrate, a wire build-up layer structure, and an insulating layer. The substrate has a first surface and a second surface opposites to the first surface. The substrate includes a plurality of patterned pads. The patterned pads are disposed on the first surface of the substrate, and having contact openings. The wire build-up layer structure is disposed on the first surface of the substrate. The wire build-up layer structure includes an interconnect build-up layer and a plurality of conductive pillars. The conductive pillars electrically connect to the interconnect build-up layer and the patterned pads. The insulating layer is disposed between the substrate and the wire build-up layer structure.

Abstract: A stacked structure includes a circuit board, an electronic component, metallic cores, and insulating cladding layers. The circuit board includes first bonding pads. The electronic component includes second bonding pads that are opposite to the first bonding pads. Each metallic core is connected to a corresponding first bonding pad and a corresponding second bonding pad. The metallic cores have a curved surface interposed between the corresponding first bonding pad and the corresponding second bonding pad. The insulating cladding layers are separated from each other and cover the curved surfaces of the metallic cores.

Abstract: A package structure, includes a metal layer, an insulating composite layer disposed thereon, a sealant bonded on the insulating composite layer, a chip embedded in the sealant, a circuit layer structure disposed on the sealant and the chip, and a protecting layer. The chip has a plurality of electrode pads exposed from the sealant. The circuit layer structure includes at least one dielectric layer and at least one circuit layer. The dielectric layer has a plurality of conductive blind vias. The dielectric layer and the sealant are made of the same material. The circuit layer is disposed on the dielectric layer and extends into the conductive blind vias, and the bottommost circuit layer is electrically connected to the electrode pads through the conductive blind vias. The protecting layer is formed on the circuit layer structure and has a plurality of openings exposing a portion of the circuit layer structure.

Abstract: A package structure includes a first substrate, a second substrate, a plurality of conductive pillars and an adhesive layer. The first substrate includes a plurality of vias and a plurality of pads. The pads are disposed on the first substrate, and fill in the vias. The second substrate is disposed opposite to the first substrate. Each conductive pillar electrically connects each pad and the second substrate, and the adhesive layer fills in the gaps between the conductive pillars. A bonding method of the package structure is also provided.

Abstract: A package substrate structure includes a first substrate, a second substrate, a plurality of conductive pillars and an adhesive layer. The first substrate includes a plurality of vias and a plurality of pads. The vias and the pads are disposed on the first substrate, and fills in the vias. The second substrate is disposed opposite to the first substrate. Each conductive pillar is disposed between the first substrate and the second substrate, where each conductive pillar electrically connects each pad and the second substrate, and the adhesive layer fills in the gaps between the conductive pillars. A bonding method of the package substrate structure is also provided.

Abstract: A stacked structure includes a circuit board, an electronic component, metallic cores, and insulating cladding layers. The circuit board includes first bonding pads. The electronic component includes second bonding pads that are opposite to the first bonding pads. Each metallic core is connected to a corresponding first bonding pad and a corresponding second bonding pad. The metallic cores have a curved surface interposed between the corresponding first bonding pad and the corresponding second bonding pad. The insulating cladding layers are separated from each other and cover the curved surfaces of the metallic cores.

Abstract: A circuit board including an interconnect substrate and a multilayer structure is provided. The interconnect substrate includes a core layer and a conductive structure disposed on the core layer. The multilayer structure is disposed on the conductive structure. The multilayer structure includes a plurality of dielectric layers and a plurality of circuit structures. The circuit structures are disposed in the dielectric layers. A topmost layer in the circuit structures is exposed to the dielectric layers to be in contact with the conductive structure. A pattern of the topmost layer in the circuit structures and a pattern of a top surface of the conductive structure are engaged with each other.

Abstract: A package structure is disclosed herein. The package structure includes an insulating composite layer, a sealant disposed on the insulating composite layer, a first chip embedded in the sealant and having a plurality of first conductive pads exposed through the sealant, a circuit layer module having a plurality of circuit layers and a plurality of dielectric layers having a plurality of conductive vias, a second chip embedded in the circuit layer module and has a plurality of second conductive pads electrically connected to the circuit layers through the conductive vias, and a protecting layer having a plurality of openings disposed on the circuit layer module, in which the openings expose a portion of the circuit layer module.

Abstract: A method for forming a circuit board includes forming a first dielectric layer, a first circuit layer in the first dielectric layer, a second circuit layer on the first dielectric layer, and a plurality of conductive vias in the first dielectric layer and connecting the first circuit layer to the second circuit layer; forming a second dielectric layer on the first dielectric layer and the second circuit layer; forming a plurality of openings in the second dielectric layer to expose a plurality of parts of the second circuit layer; forming a seed layer on the exposed parts of the second circuit layer and sidewalls of the openings; and forming a plurality of bonding layers on the seed layer, wherein the bonding layers and the seed layer are made of copper, and the bonding layers are porous.

Abstract: A circuit board includes a first dielectric layer, a first circuit layer, a second circuit layer, a plurality of conductive vias, a second dielectric layer, a patterned seed layer, and a plurality of bonding layers. The first circuit layer is disposed in the first dielectric layer. The second circuit layer is disposed on the first dielectric layer. The conductive vias are disposed in the first dielectric layer and connect the first circuit layer to the second circuit layer. The second dielectric layer is disposed on the first dielectric layer and the second circuit layer and has a plurality of openings to expose a plurality of parts of the second circuit layer. The patterned seed layer is disposed on the exposed parts of second circuit layer and sidewalls of the openings. The bonding layers are respectively disposed on the patterned seed layer and made of porous copper.

Abstract: A circuit board includes a first dielectric layer, a first circuit layer, a second circuit layer, a plurality of conductive vias, a second dielectric layer, a patterned seed layer, and a plurality of bonding layers. The first circuit layer is disposed in the first dielectric layer. The second circuit layer is disposed on the first dielectric layer. The conductive vias are disposed in the first dielectric layer and connect the first circuit layer to the second circuit layer. The second dielectric layer is disposed on the first dielectric layer and the second circuit layer and has a plurality of openings to expose a plurality of parts of the second circuit layer. The patterned seed layer is disposed on the exposed parts of second circuit layer and sidewalls of the openings. The bonding layers are respectively disposed on the patterned seed layer and made of porous copper.

Abstract: An electronic device includes a first camera module photographing according to a first frame rate, a second camera module photographing according to a second frame rate and a multimedia processor coupled to the first camera module and the second camera module. The multimedia processor instructs the first camera module and the second camera module to alternately photograph to obtain a sequence of pictures recorded at a third frame rate. The third frame rate is higher than the first frame rate and the second frame rate.

Abstract: A package structure includes a metal layer, a composite layer of a non-conductor inorganic material and an organic material, a sealant, a chip, a circuit layer structure, and an insulating protective layer. The composite layer of the non-conductor inorganic material and the organic material is disposed on the metal layer. The sealant is bonded on the composite layer of the non-conductor inorganic material and the organic material. The chip is embedded in the sealant, and the chip has electrode pads. The circuit layer structure is formed on the sealant and the chip. The circuit layer structure includes at least one dielectric layer and at least one circuit layer. The dielectric layer has conductive blind holes. The insulating protective layer is formed on the circuit layer structure. The insulating protective layer has openings, so as to expose parts of the surface of the circuit layer structure in the openings.

Abstract: A circuit board includes a composite layer of a non-conductor inorganic material and an organic material, a plurality of conductive structures, a first built-up structure, and a second built-up structure. The composite layer of the non-conductor inorganic material and the organic material has a first surface and a second surface opposite to each other and a plurality of openings. The conductive structures are respectively disposed in the openings of the composite layer of the non-conductor inorganic material and the organic material. The first built-up structure is disposed on the first surface of the composite layer of the non-conductor inorganic material and the organic material and electrically connected to the conductive structures. The second built-up structure is disposed on the second surface of the composite layer of the non-conductor inorganic material and the organic material and electrically connected to the conductive structures.

Abstract: An electronic device includes a first camera module photographing according to a first frame rate, a second camera module photographing according to a second frame rate and a multimedia processor coupled to the first camera module and the second camera module. The multimedia processor instructs the first camera module and the second camera module to alternately photograph to obtain a sequence of pictures recorded at a third frame rate. The third frame rate is higher than the first frame rate and the second frame rate.

Abstract: An LED headlight cooling system includes a vehicle air conditioner, a thermal conducting device and an LED headlight. The vehicle air conditioner has a cooling device. The thermal conducting device is thermally connected to the cooling device of the vehicle air conditioner. The LED headlight is thermally connected to the thermal conducting device.

Abstract: An LED headlight cooling system includes a vehicle air conditioner, a thermal conducting device and an LED headlight. The vehicle air conditioner has a cooling device. The thermal conducting device is thermally connected to the cooling device of the vehicle air conditioner. The LED headlight is thermally connected to the thermal conducting device.