Abstract: The present application provides a display panel, a. manufacturing method, a detection method, and a display device. The display panel includes a display area and a non-display area surrounding the display area. The non-display area includes: a crack detection line surrounding the display area; a screen control line; a plurality of switch signal lines; and a plurality of detection switches electrically connected at different positions to the crack detection line. Each detection switch is also connected to the screen control line and a respective switch signal line, and allows conduction between the crack detection line and the screen control line based on the switch signal input by the switch signal line, such that the screen control line drives the display panel to display according to the test signal input by the crack detection line.

Abstract: In some examples, an apparatus can include an arm and a cover connected to the arm, where the cover conceals an inner portion of the apparatus when the arm is in a vertical orientation relative to a base of the apparatus, and the cover is concealed in the inner portion of the apparatus when the arm is in a horizontal orientation relative to the base of the apparatus.

Abstract: In some examples, an apparatus can include an arm, a cam connected to the arm, a first spring located around a first strut, where the first spring is oriented at a first angle relative to a base of the apparatus and the first strut is connected to the cam, a second spring located around a second strut, where the second spring is oriented at a second angle relative to the base of the apparatus and the second strut is connected to the cam, where the first spring and the second spring linearly compress in response to rotation of the arm from a vertical orientation to a horizontal orientation relative to the base of the apparatus.

Abstract: A semiconductor structure includes a die, a molding surrounding the die, a first dielectric layer disposed over the die and the molding, and a second dielectric layer disposed between the first dielectric layer and the die, and between the first dielectric layer and the molding. A material content ratio in the first dielectric layer is substantially greater than that in the second dielectric layer. In some embodiments, the material content ratio substantially inversely affects a mechanical strength of the first dielectric layer and the second dielectric layer.

Abstract: Disclosed herein are a method of manufacturing a heterogeneous coating solution bonded coating layer, and a coating layer and a cover window produced thereby. More particularly, there are provided a method of manufacturing a heterogeneous coating solution bonded coating layer, in which a step difference at the boundary between different types of coating solutions is controllable by controlling a difference in capillary number during discharge of the different types of coating solutions using a slot die coater, and a coating layer and a cover window produced thereby. Therefore, the method of manufacturing a heterogeneous coating solution bonded coating layer can produce a cover window that is excellent in all the properties including durability, optical characteristics, and flexibility.

Abstract: An oxygen supplying apparatus includes: an oxygen enriching module including a plurality of oxygen enriching units; a pressure boosting module which receives the oxygen-enriched gas from the oxygen enriching module and boosts pressure of the oxygen-enriched gas; and a controller controlling operations of the oxygen enriching module and the pressure boosting module. The pressure boosting module includes: a low-pressure tank which receives and stores the oxygen-enriched gas from the oxygen enriching module; a pressure booster which boosts pressure of the oxygen-enriched gas discharged from the low-pressure tank; a high-pressure tank stores the oxygen-enriched gas pressure-boosted by the pressure booster; and at least one bypass valve which is provided to a bypass passage for bypassing a portion of the pressure-boosted oxygen-enriched gas stored in the high-pressure tank to the low-pressure tank to regulate bypassing of the oxygen-enriched gas from the high-pressure tank to the low-pressure tank.

Abstract: The present invention discloses a hydraulic valve mechanism with variable valve opening times and an internal combustion engine, which can effectively implement a single-opening working mode, a two-opening working mode or a multi-opening working mode of a valve in the same working cycle, and can implement a rapid and stable switchover among various working modes according to working condition requirements of the internal combustion engine. A main structure thereof includes a housing, a valve cam including a main protrusion and at least one auxiliary protrusion, a hydraulic rotary valve having a hydraulic switch valve function, a hydraulic drive component, a valve drive component, and the like. Oil passages of the hydraulic drive component, the hydraulic rotary valve, and the valve drive component are in communication.

Abstract: The present invention discloses a hydraulic valve mechanism with variable valve opening times and an internal combustion engine, which can effectively implement a single-opening working mode, a two-opening working mode or a multi-opening working mode of a valve in the same working cycle, and can implement a rapid and stable switchover among various working modes according to working condition requirements of the internal combustion engine. A main structure thereof includes a housing, a valve cam including a main protrusion and at least one auxiliary protrusion, a hydraulic rotary valve having a hydraulic switch valve function, a hydraulic drive component, a valve drive component, and the like. Oil passages of the hydraulic drive component, the hydraulic rotary valve, and the valve drive component are in communication.

Abstract: A semiconductor structure includes a die, a molding surrounding the die, a first dielectric layer disposed over the die and the molding, and a second dielectric layer disposed between the first dielectric layer and the die, and between the first dielectric layer and the molding. A material content ratio in the first dielectric layer is substantially greater than that in the second dielectric layer. In some embodiments, the material content ratio substantially inversely affects a mechanical strength of the first dielectric layer and the second dielectric layer.

Abstract: A method includes forming a first polymer layer to cover a metal pad of a wafer, and patterning the first polymer layer to form a first opening. A first sidewall of the first polymer layer exposed to the first opening has a first tilt angle where the first sidewall is in contact with the metal pad. The method further includes forming a metal pillar in the first opening, sawing the wafer to generate a device die, encapsulating the device die in an encapsulating material, performing a planarization to reveal the metal pillar, forming a second polymer layer over the encapsulating material and the device die, and patterning the second polymer layer to form a second opening. The metal pillar is exposed through the second opening. A second sidewall of the second polymer layer exposed to the second opening has a second tilt angle greater than the first tilt angle.

Abstract: An embodiment is a structure including a first package including a first die, and a molding compound at least laterally encapsulating the first die, a second package bonded to the first package with a first set of conductive connectors, the second package comprising a second die, and an underfill between the first package and the second package and surrounding the first set of conductive connectors, the underfill having a first portion extending up along a sidewall of the second package, the first portion having a first sidewall, the first sidewall having a curved portion and a planar portion.

Abstract: A method includes forming a first polymer layer to cover a metal pad of a wafer, and patterning the first polymer layer to form a first opening. A first sidewall of the first polymer layer exposed to the first opening has a first tilt angle where the first sidewall is in contact with the metal pad. The method further includes forming a metal pillar in the first opening, sawing the wafer to generate a device die, encapsulating the device die in an encapsulating material, performing a planarization to reveal the metal pillar, forming a second polymer layer over the encapsulating material and the device die, and patterning the second polymer layer to form a second opening. The metal pillar is exposed through the second opening. A second sidewall of the second polymer layer exposed to the second opening has a second tilt angle greater than the first tilt angle.

Abstract: An oxygen supplying apparatus includes: an oxygen enriching module including a plurality of oxygen enriching units; a pressure boosting module which receives the oxygen-enriched gas from the oxygen enriching module and boosts pressure of the oxygen-enriched gas; and a controller controlling operations of the oxygen enriching module and the pressure boosting module. The pressure boosting module includes: a low-pressure tank which receives and stores the oxygen-enriched gas from the oxygen enriching module; a pressure booster which boosts pressure of the oxygen-enriched gas discharged from the low-pressure tank; a high-pressure tank stores the oxygen-enriched gas pressure-boosted by the pressure booster; and at least one bypass valve which is provided to a bypass passage for bypassing a portion of the pressure-boosted oxygen-enriched gas stored in the high-pressure tank to the low-pressure tank to regulate bypassing of the oxygen-enriched gas from the high-pressure tank to the low-pressure tank.

Abstract: An embodiment is a structure including a first package including a first die, and a molding compound at least laterally encapsulating the first die, a second package bonded to the first package with a first set of conductive connectors, the second package comprising a second die, and an underfill between the first package and the second package and surrounding the first set of conductive connectors, the underfill having a first portion extending up along a sidewall of the second package, the first portion having a first sidewall, the first sidewall having a curved portion and a planar portion.

Abstract: A semiconductor structure includes a die, a molding surrounding the die, a first dielectric layer disposed over the die and the molding, and a second dielectric layer disposed between the first dielectric layer and the die, and between the first dielectric layer and the molding. A material content ratio in the first dielectric layer is substantially greater than that in the second dielectric layer. In some embodiments, the material content ratio substantially inversely affects a mechanical strength of the first dielectric layer and the second dielectric layer.

Abstract: A method for peer-to-peer multimedia data sharing suitable for an electronic device is provided. The method includes the following step: scanning at least one sink device having Peer-to-Peer connectivity; determining a candidate device from the at least one sink device according a distance between the electronic device and the at least one sink device; deriving a beacon from the candidate device; establishing a Peer-to-Peer connection with the candidate device according to the beacon; and transmitting multimedia data to the candidate device.

Abstract: A method of manufacturing a semiconductor structure is provided. The method includes providing a substrate, disposing a die over the substrate, forming a molding over the substrate and around the die, disposing a first dielectric layer over the die and the molding, curing the first dielectric layer under a first curing condition, disposing a second dielectric layer over the first dielectric layer, and curing the first dielectric layer and the second dielectric layer under the first curing condition.

Abstract: Disclosed herein are a method of manufacturing a heterogeneous coating solution bonded coating layer, and a coating layer and a cover window produced thereby. More particularly, there are provided a method of manufacturing a heterogeneous coating solution bonded coating layer, in which a step difference at the boundary between different types of coating solutions is controllable by controlling a difference in capillary number during discharge of the different types of coating solutions using a slot die coater, and a coating layer and a cover window produced thereby. Therefore, the method of manufacturing a heterogeneous coating solution bonded coating layer can produce a cover window that is excellent in all the properties including durability, optical characteristics, and flexibility.

Abstract: An embodiment is a structure including a first package including a first die, and a molding compound at least laterally encapsulating the first die, a second package bonded to the first package with a first set of conductive connectors, the second package comprising a second die, and an underfill between the first package and the second package and surrounding the first set of conductive connectors, the underfill having a first portion extending up along a sidewall of the second package, the first portion having a first sidewall, the first sidewall having a curved portion and a planar portion.

Abstract: A method includes forming a first polymer layer to cover a metal pad of a wafer, and patterning the first polymer layer to form a first opening. A first sidewall of the first polymer layer exposed to the first opening has a first tilt angle where the first sidewall is in contact with the metal pad. The method further includes forming a metal pillar in the first opening, sawing the wafer to generate a device die, encapsulating the device die in an encapsulating material, performing a planarization to reveal the metal pillar, forming a second polymer layer over the encapsulating material and the device die, and patterning the second polymer layer to form a second opening. The metal pillar is exposed through the second opening. A second sidewall of the second polymer layer exposed to the second opening has a second tilt angle greater than the first tilt angle.