Abstract: Processes for making and using compounds of formula (I): wherein R1, R2, R3, R4a, R4b, R5 and R6 are defined herein, as well as other indene derivatives are disclosed herein. These compounds are disclosed as being useful in treating inflammatory conditions or diseases.

Abstract: A video generating system includes: a plurality of image sensors, arranged to generate a plurality of images and a plurality of synchronization signals corresponding to the images; a combining circuit, coupled to the image sensors, arranged to generate a plurality of output images according to the images, and generate a plurality of output synchronization signals corresponding to the output images according to the synchronization signals; and a bus, coupled between the image sensors and the combining circuit, arranged to perform signal transmission. The image sensors comprise a first image sensor and a second image sensor; and when the combining circuit receives image data of at least a first image generated by the first image sensor, the combining circuit does not receive image data of at least a second image generated by the second image sensor at the same time.

Abstract: The present invention relates to a damping hinge device, including a first core shaft, a first ring, a core shaft sleeve and a second ring; one end section of the first core shaft is formed as a connection part and installed a damping contact part; the first ring is sleeved on the first core shaft and positioned between the connection part and the damping contact part; one end section of the core shaft sleeve is concavely formed with an accommodation slot for accommodating the damping contact part, the viscous damping layer and the first ring; the second ring is sleeved on the first core shaft and combined with the core shaft sleeve, the second ring is served to cover the first ring for sealing the viscous damping layer thereby allowing the viscous damping layer to generate a viscous resistance to the damping contact part being in a rotating status.

Abstract: A semiconductor device includes a semiconductor substrate, a pad region on the semiconductor substrate, a passivation layer over the semiconductor substrate and at least a portion of the pad region, and a bump structure overlying the pad region. The passivation layer has an opening defined therein to expose at least another portion of the pad region. The bump structure is electrically connected to the pad region via the opening. The bump structure includes a copper layer and a SnAg layer overlying the copper layer. The SnAg layer has a melting temperature higher than the eutectic temperature of Sn and Ag.

Abstract: Processes for making and using compounds of formula (I): wherein R1, R2, R3, R4a, R4b, R5 and R6 are defined herein, as well as other indene derivatives are disclosed herein. These compounds are disclosed as being useful in treating inflammatory conditions or diseases.

Abstract: The present invention relates to a damping hinge device, including a first core shaft, a first ring, a core shaft sleeve and a second ring; one end section of the first core shaft is formed as a connection part and installed a damping contact part; the first ring is sleeved on the first core shaft and positioned between the connection part and the damping contact part; one end section of the core shaft sleeve is concavely formed with an accommodation slot for accommodating the damping contact part, the viscous damping layer and the first ring; the second ring is sleeved on the first core shaft and combined with the core shaft sleeve, the second ring is served to cover the first ring for sealing the viscous damping layer thereby allowing the viscous damping layer to generate a viscous resistance to the damping contact part being in a rotating status.

Abstract: A video generating system and a video generating method, which combine images generated by a plurality of different image sensors to generate output images, are provided. In the inventive video generating system and method, the image sensors share a signal transmission interface to transmit image data and synchronization signals in a time-shared manner to reduce the complexity of the signal transmission interface.

Abstract: Compounds of formula (Ia): wherein R1, R2, R3, R4a, R4b, R5, and R6 are defined herein, as well as other indene derivatives are disclosed herein. Pharmaceutical compositions containing the compounds and methods of using the compounds are also disclosed.

Abstract: A semiconductor device includes a semiconductor substrate, a pad region on the semiconductor substrate, a passivation layer over the semiconductor substrate and at least a portion of the pad region, and a bump structure overlying the pad region. The passivation layer has an opening defined therein to expose at least another portion of the pad region. The bump structure is electrically connected to the pad region via the opening. The bump structure includes a copper layer and a SnAg layer overlying the copper layer. The SnAg layer has a melting temperature higher than the eutectic temperature of Sn and Ag.

Abstract: A semiconductor device includes a bump structure over a pad region. The bump structure includes a copper layer and a lead-free solder layer over the copper layer. The lead-free solder layer is a SnAg layer, and the Ag content in the SnAg layer is less than 1.6 weight percent.

Abstract: The present invention relates to a cosmetic composition containing cypress essential oil as a first essential oil and one or more second essential oils selected from the group consisting of pine needle essential oil, lavender essential oil, rosemary essential oil, red thyme essential oil, and bergamot essential oil. The composition has the effects of enhancing memory and reducing cognitive dysfunction by means of the fragrance thereof instead of via oral administration.

Abstract: The present invention discloses an anti-pinching structure for supporting frame, in which a slidable or rotatable positioning block is disposed on the hinge portion of the connection base and the supporting framework and a hinge unit is disposed on the hinge portion of the connection base and the supporting framework, such that the torsion spring of the hinge units may form a supporting torsion against the supporting framework and the positioning block may prevent the supporting framework from springing back.

Abstract: Compounds of formula (Ia): wherein R1, R2, R3, R4a, R4b, R5, and R6 are defined herein, as well as other indene derivatives are disclosed herein. Pharmaceutical compositions containing the compounds and methods of using the compounds are also disclosed.

Abstract: Compounds of formula (Ia): wherein R1, R2, R3, R4a, R4b, R5 and R6 are defined herein, as well as other indene derivatives are disclosed herein. Pharmaceutical compositions containing the compounds and methods of using the compounds are also disclosed.

Abstract: The present invention discloses an anti-pinching structure for supporting frame, in which a slidable or rotatable positioning block is disposed on the hinge portion of the connection base and the supporting framework and a hinge unit is disposed on the hinge portion of the connection base and the supporting framework, such that the torsion spring of the hinge units may form a supporting torsion against the supporting framework and the positioning block may prevent the supporting framework from springing back.

Abstract: Compounds of formula (Ia): wherein R1, R2, R3, R4a, R4b, R5 and R6 are defined herein, as well as other indene derivatives are disclosed herein. Pharmaceutical compositions containing the compounds and methods of using the compounds are also disclosed.

Abstract: The present invention discloses an anti-pinching structure for supporting frame, in which a slidable or rotatable positioning block is disposed on the hinge portion of the connection base and the supporting framework and a hinge unit is disposed on the hinge portion of the connection base and the supporting framework, such that the torsion spring of the hinge units may form a supporting torsion against the supporting framework and the positioning block may prevent the supporting framework from springing back.

Abstract: A semiconductor device includes a bump structure over a pad region. The bump structure includes a copper layer and a lead-free solder layer over the copper layer. The lead-free solder layer is a SnAg layer, and the Ag content in the SnAg layer is less than 1.6 weight percent.

Abstract: Compounds of formula (Ia): wherein R1, R2, R3, R4a, R4b, R5 and R6 are defined herein, as well as other indene derivatives are disclosed herein. Pharmaceutical compositions containing the compounds and methods of using the compounds are also disclosed.

Abstract: Compounds of formula (Ia): wherein R1, R2, R3, R4a, R4b, R5, and R6 are defined herein, as well as other indene derivatives are disclosed herein. Pharmaceutical compositions containing the compounds and methods of using the compounds are also disclosed.