Patents by Inventor Karl H. Mauritz

Karl H. Mauritz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7673073
    Abstract: A multiphase encoded protocol has sufficient density of commands to allow a rich language to be realized on a bus. When ten field bits are dedicated to commands, it is possible to have more than six million words to choose from per clock. Architecture to implement the multiphase encoded protocol and synchronize the bus includes an extracted clock, a command element, and a data element. One-bit multipliers are used as correlation elements to provide feedback into slaved delay-locked loop (DLL) devices, which provides precise phase alignment for successful data extraction of several channels.
    Type: Grant
    Filed: November 8, 2005
    Date of Patent: March 2, 2010
    Assignee: Intel Corporation
    Inventors: Paul S. Levy, Karl H. Mauritz
  • Patent number: 7379511
    Abstract: A feedback signal generated as a function of a peak amplitude detected in an input signal provides bias to reduce DC offset. A peak in the input signal is compared with a selected signal level to align an output signal relative to a reference signal level. The output signal is generated by comparing the reference signal level and the biased input signal. Single ended signals are compared with a reference level and differential input signals are compared with each other to reduce jitter.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: May 27, 2008
    Assignee: Intel Corporation
    Inventors: Karl H. Mauritz, Linhbao T Nguyen
  • Patent number: 7366423
    Abstract: A system includes multiple agents coupled to an optical bus for transmission of high speed signals and to an electrical bus for transmission of low speed signals. The agents can be memory modules, such as DIMMs. An optical connector housing for coupling the agent to the optical bus can include a reflective device such a mirror, a semi reflective mirror, a pellicle beamsplitter, or the like. The low speed signals can be, for example, power, ground, and supervisory signals. The high speed signals can be, for example, data, address, control, and clock signals.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: April 29, 2008
    Assignee: Intel Corporation
    Inventors: Paul S. Levy, Karl H. Mauritz
  • Patent number: 7346099
    Abstract: A network fabric physical layer includes a driver coupled to a receiver via a bus, which implements a multiphase encoded protocol. A multiphase sequencer sequences (data or command/control) words for the driver. The driver outputs the sequenced words onto the bus as a differential multiphase encoded waveform. The receiver receives the differential multiphase encoded waveform and performs statistical analysis to determine data integrity checking. The bus is a concurrent differential bi-directional bus and each transmitting driver includes impedance compensation circuitry on both ends of a transmission line so that each drives its signal value with the impedance characteristics of the transmission line. The receiver also includes jitter immunity.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: March 18, 2008
    Assignee: Intel Corporation
    Inventors: Karl H. Mauritz, Todd C. Langley
  • Patent number: 7039265
    Abstract: Various embodiments of apparatus and various embodiments of methods to communicate between a first circuit board and a second circuit board using one or more open air communication channels are provided. A plurality of light transmitters and light receivers are attached to a first circuit board; and a corresponding plurality of light receivers and light transmitters are attached to a second circuit board. The light receivers on both circuit boards are disposed to receive data transmitted by the corresponding light transmitters on each circuit board. In one embodiment, where the light transmitters are laser diodes, different colors may be used to increase adjacent signal rejection. In another embodiment, the light transmitters may be laser, radio, microwave, digital, ultraviolet, or infrared light transmitters. The light transmitters may transmit data across open spaces between circuit boards, including through apertures in boards placed between the light transmitter and light receiver.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: May 2, 2006
    Assignee: Intel Corporation
    Inventors: Paul S. Levy, Karl H. Mauritz
  • Patent number: 7038920
    Abstract: According to some embodiments, a system includes a holder to hold an electrical module, the module having an electrical circuit and a conductive module pad electrically coupled to the electrical circuit. A system may also include a flexible circuit coupled to the holder and having a conductive pad to contact the conductive module pad.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: May 2, 2006
    Assignee: Intel Corporation
    Inventors: Christopher J. Banyai, Karl H. Mauritz, Edward Butler, Mark D. Summers
  • Patent number: 7010629
    Abstract: Briefly, in accordance with one embodiment of the invention, a system includes two boards coupled by a bus. The bus having a dual-terminated transmission line that communicatively couples a memory control hub with a memory repeater hub that each have a Rambus ASIC Cell (RAC). Briefly, in accordance with another embodiment of the invention, a connector has two metal traces that are of different lengths. The parasitic capacitance of the longer metal trace is increased so that the impedance of the two metal traces is substantially equal.
    Type: Grant
    Filed: December 22, 1999
    Date of Patent: March 7, 2006
    Assignee: Intel Corporation
    Inventors: David W. Frame, Christopher J. Banyai, Karl H. Mauritz, Albert R. Nelson, Quing-Lun Chen, Hany M. Fahmy
  • Patent number: 6996632
    Abstract: A multiphase encoded protocol has sufficient density of commands to allow a rich language to be realized on a bus. When ten field bits are dedicated to commands, it is possible to have more than six million words to choose from per clock. Architecture to implement the multiphase encoded protocol and synchronize the bus includes an extracted clock, a command element, and a data element. One-bit multipliers are used as correlation elements to provide feedback into slaved delay-locked loop (DLL) devices, which provides precise phase alignment for successful data extraction of several channels.
    Type: Grant
    Filed: June 19, 2001
    Date of Patent: February 7, 2006
    Assignee: Intel Corporation
    Inventors: Paul S. Levy, Karl H. Mauritz
  • Publication number: 20040264256
    Abstract: According to one embodiment of the present invention, a circuit is disclosed. The circuit includes: a plurality of memory modules; a memory controller coupled to the plurality of memory modules; a plurality of bus splitters coupled between the plurality of memory modules and the memory controller to split signals communicated between the plurality of memory modules and the memory controller; and a plurality of terminators to reduce signal reflections corresponding to the split signals.
    Type: Application
    Filed: June 26, 2003
    Publication date: December 30, 2004
    Inventors: Karl H. Mauritz, David W. Frame
  • Publication number: 20040264582
    Abstract: A feedback signal generated as a function of a peak amplitude detected in an input signal provides bias to reduce DC offset. A peak in the input signal is compared with a selected signal level to align an output signal relative to a reference signal level. The output signal is generated by comparing the reference signal level and the biased input signal. Single ended signals are compared with a reference level and differential input signals are compared with each other to reduce jitter.
    Type: Application
    Filed: June 30, 2003
    Publication date: December 30, 2004
    Applicant: Intel Corporation
    Inventors: Karl H. Mauritz, Linhbao T. Nguyen
  • Publication number: 20040243769
    Abstract: A memory architecture with a tree based topology. Memory devices are paired with intelligent memory hubs that service memory access requests and manage data in the network of memory devices. Memory hubs can reconfigure the network topology dynamically to compensate for failed devices or the addition or removal of devices. The memory architecture can also support input output devices and be shared between multiple systems.
    Type: Application
    Filed: May 30, 2003
    Publication date: December 2, 2004
    Inventors: David W. Frame, Karl H. Mauritz
  • Publication number: 20040234232
    Abstract: Various embodiments of apparatus and various embodiments of methods to communicate between a first circuit board and a second circuit board using one or more open air communication channels are provided. A plurality of light transmitters and light receivers are attached to a first circuit board; and a corresponding plurality of light receivers and light transmitters are attached to a second circuit board. The light receivers on both circuit boards are disposed to receive data transmitted by the corresponding light transmitters on each circuit board. In one embodiment, where the light transmitters are laser diodes, different colors may be used to increase adjacent signal rejection. In another embodiment, the light transmitters may be laser, radio, microwave, digital, ultraviolet, or infrared light transmitters. The light transmitters may transmit data across open spaces between circuit boards, including through apertures in boards placed between the light transmitter and light receiver.
    Type: Application
    Filed: June 24, 2004
    Publication date: November 25, 2004
    Inventors: Paul S. Levy, Karl H. Mauritz
  • Patent number: 6793408
    Abstract: A module comprises an electrical device having at least one memory device. A plurality of electrical contacts provide electrical signals to the electrical device. The memory apparatus also includes an optical interface, and an optical-to-electrical signal converter is coupled to receive optical signals from the optical interface and provide electrical signals to the electrical device.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: September 21, 2004
    Assignee: Intel Corporation
    Inventors: Paul S. Levy, Karl H. Mauritz
  • Patent number: 6771845
    Abstract: Various embodiments of apparatus and various embodiments of methods to communicate between a first circuit board and a second circuit board using one or more open air communication channels are provided. A plurality of light transmitters and light receivers are attached to a first circuit board; and a corresponding plurality of light receivers and light transmitters are attached to a second circuit board. The light receivers on both circuit boards are disposed to receive data transmitted by the corresponding light transmitters on each circuit board. In one embodiment, where the light transmitters are laser diodes, different colors may be used to increase adjacent signal rejection. In another embodiment, the light transmitters may be laser, radio, microwave, digital, ultraviolet, or infrared light transmitters. The light transmitters may transmit data across open spaces between circuit boards, including through apertures in boards placed between the light transmitter and light receiver.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: August 3, 2004
    Assignee: Intel Corporation
    Inventors: Paul S. Levy, Karl H. Mauritz
  • Patent number: 6765797
    Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: July 20, 2004
    Assignee: Intel Corporation
    Inventors: Mark D. Summers, Karl H. Mauritz, Amber S. Bedi, William Handley, Carol Miller, Javier Leija, Daniel Dragoon
  • Publication number: 20040126065
    Abstract: A module comprises an electrical device having at least one memory device. A plurality of electrical contacts provide electrical signals to the electrical device. The memory apparatus also includes an optical interface, and an optical-to-electrical signal converter is coupled to receive optical signals from the optical interface and provide electrical signals to the electrical device.
    Type: Application
    Filed: December 31, 2002
    Publication date: July 1, 2004
    Inventors: Paul S. Levy, Karl H. Mauritz
  • Publication number: 20040126115
    Abstract: A system includes multiple agents coupled to an optical bus for transmission of high speed signals and to an electrical bus for transmission of low speed signals. The agents can be memory modules, such as DIMMs. An optical connector housing for coupling the agent to the optical bus can include a reflective device such a mirror, a semi reflective mirror, a pellicle beamsplitter, or the like. The low speed signals can be, for example, power, ground, and supervisory signals. The high speed signals can be, for example, data, address, control, and clock signals.
    Type: Application
    Filed: December 31, 2002
    Publication date: July 1, 2004
    Inventors: Paul S. Levy, Karl H. Mauritz
  • Publication number: 20030217301
    Abstract: In a source synchronous interface between two devices, the transmitting device inserts side-band data into a clock signal and transmits to the other device the clock signal and one or more additional signals including data. The side-band data corresponds to the data. The receiving device extracts the side-band data from the received clock signal.
    Type: Application
    Filed: May 16, 2002
    Publication date: November 20, 2003
    Inventors: Paul S. Levy, Karl H. Mauritz
  • Publication number: 20030185499
    Abstract: High-speed optical interconnects are formed between I/O ports on an electromagnetic device and at least one optical communication channel via a vertical cavity surface emitting laser (VCSEL) array. The VCSEL array of the interconnect is separated into at least two segments, each segment comprising at least one optical communication channel coupled to a respective I/O port.
    Type: Application
    Filed: April 2, 2002
    Publication date: October 2, 2003
    Inventors: Edward Butler, Karl H. Mauritz
  • Patent number: 6624718
    Abstract: A signal transmission unit includes a first transmission line, a second transmission line, and a tapered transmission line coupling the first transmission line to the second transmission line. The tapered transmission line has a width and a length and the width changes along the length according to one or more functions. The one or more functions include but are not limited to linear functions, non-linear functions, hyperbolic functions, and exponential functions.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: September 23, 2003
    Assignee: Intel Corporation
    Inventors: Karl H. Mauritz, David W. Frame