Abstract: A network fabric physical layer includes a driver coupled to a receiver via a bus, which implements a multiphase encoded protocol. A multiphase sequencer sequences (data or command/control) words for the driver. The driver outputs the sequenced words onto the bus as a differential multiphase encoded waveform. The receiver receives the differential multiphase encoded waveform and performs statistical analysis to determine data integrity checking. The bus is a concurrent differential bi-directional bus and each transmitting driver includes impedance compensation circuitry on both ends of a transmission line so that each drives its signal value with the impedance characteristics of the transmission line. The receiver also includes jitter immunity.

Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.

Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.

Abstract: A multiphase encoded protocol has sufficient density of commands to allow a rich language to be realized on a bus. When ten field bits are dedicated to commands, it is possible to have more than six million words to choose from per clock. Architecture to implement the multiphase encoded protocol and synchronize the bus includes an extracted clock, a command element, and a data element. One-bit multipliers are used as correlation elements to provide feedback into slaved delay-locked loop (DLL) devices, which provides precise phase alignment for successful data extraction of several channels.

Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.

Abstract: A wireless pointing device may have a motion circuit to indicate when the wireless pointing device is in motion, and a transmitter to transmit a unique signal indicative of the wireless pointing device's motion is described. A wireless receiver may have a control circuit to generate control signals based on a classification of signals received from the wireless pointing device, and an analysis circuit to determine a characteristic of the received signals is also described. Signal classification may include determination of whether the received signal indicate motion of the wireless pointing device and/or whether a wireless pointing device control (a button or switch, for example) has been activated. Signal characteristics may include motion and/or the speed of motion of the wireless pointing device.

Abstract: A tracking system for tracking one or more wireless input devices includes a receiver to receive wireless signals from the input devices and a tracking circuit to detect movements of the wireless input devices. The input devices may be either infrared (IR) or radio-frequency (RF) input devices.

Abstract: Various embodiments of apparatus and various embodiments of methods to communicate between a first circuit board and a second circuit board using one or more open air communication channels are provided. A plurality of light transmitters and light receivers are attached to a first circuit board; and a corresponding plurality of light receivers and light transmitters are attached to a second circuit board. The light receivers on both circuit boards are disposed to receive data transmitted by the corresponding light transmitters on each circuit board. In one embodiment, where the light transmitters are laser diodes, different colors may be used to increase adjacent signal rejection. In another embodiment, the light transmitters may be laser, radio, microwave, digital, ultraviolet, or infrared light transmitters. The light transmitters may transmit data across open spaces between circuit boards, including through apertures in boards placed between the light transmitter and light receiver.

Abstract: A circuit to provide one clock signal from a plurality of possible clock signals includes a register to receive indication of a data sampling frequency, a selection circuit operatively coupled to the register, the indicated data sampling frequency selecting one of a plurality of signals provided to the selection circuit, and a modification circuit to modify the selected signal based at least in part on the indicated sampling frequency. A method to automatically and dynamically provide one clock signal from a plurality of possible clock signals includes receiving a signal indicating a data sampling frequency, selecting one clock signal from a plurality of input clock signals based on the received data sampling frequency indication, and modifying the selected clock signal, based on the indicated sampling frequency, to generate an output clock signal.

Abstract: A signal transmission unit includes a first transmission line, a second transmission line, and a tapered transmission line coupling the first transmission line to the second transmission line. The tapered transmission line has a width and a length and the width changes along the length according to one or more functions. The one or more functions include but are not limited to linear functions, non-linear functions, hyperbolic functions, and exponential functions.

Abstract: A method to combine diversely encoded data streams includes receiving a first data stream in a first encoded format, decoding the first data stream into a decoded format, obtaining a second data stream in the decoded format, and combining the decoded first data stream with the second data stream. The first encoded format may, for example, be associated with a video data stream, an audio data stream, or a multimedia data stream. The decoded format may be any format which allows two data streams to be combined in a substantially direct manner such as, for example, a linear pulse code modulated (LPCM) data format.

Abstract: A tracking system for tracking one or more wireless input devices includes a receiver to receive wireless signals from the input devices and a tracking circuit to detect movements of the wireless input devices. The input devices may be either infrared (IR) or radio-frequency (RF) input devices.

Abstract: An apparatus for integrating wafer scale semiconductor integrated circuits and interfacing them with other systems. A wafer, partial wafer, die or plurality of same are mated to a printed circuit board (PCB) which electrically contacts the pads on each die using small conductive pillars. The PCB in turn is connected easily to other electronic systems. The entire apparatus is incorporated into other systems which utilize the dice in the apparatus. The apparatus may be fitted with heating elements and cooling channels to generate the necessary die temperatures for burn-in, testing, and operation. The apparatus is easily adaptable to include more dice in a stacked configuration.

Abstract: A method of forming electrically conductive pillars on a printed circuit board by providing a printed circuit board having a plurality of electrical traces and forming a plurality of elongate, electrically conductive pillars of superimposed layers of solder and conductive polymer on the printed circuit board. The elongate, electrically conductive pillars are connected by a first end to the electrical traces of the printed circuit board and extend substantially perpendicularly from the printed circuit board such that a second end of each of the plurality of elongate, electrically conductive pillars lies in substantially a common plane which is substantially perpendicular to and above said printed circuit board.

Abstract: An apparatus for wafer scale burn-in and testing of semiconductor integrated circuits and a method for its utilization is disclosed. A wafer is mated to a printed circuit board which electrically contacts the pads on each die using small conductive pillars. Single precise alignment of entire wafer within apparatus allows for testing all the dice on the wafer in parallel, eliminating need to probe each die individually. The apparatus is fitted with heating elements and cooling channels to generate the necessary wafer temperatures for burn-in and testing. The method of utilization eliminates processing of defective dice beyond burn-in and test, thereby increasing throughput.

Abstract: An apparatus for integrating wafer scale semiconductor integrated circuits and interfacing them with other systems. A wafer, partial wafer, die or plurality of same are mated to a printed circuit board (PCB) which electrically contacts the pads on each die using small conductive pillars. The PCB in turn is connected easily to other electronic systems. The entire apparatus is incorporated into other systems which utilize the dice in the apparatus. The apparatus may be fitted with heating elements and cooling channels to generate the necessary dice temperatures for burn-in, testing, and operation. The apparatus is easily adaptable to include more dice in a stacked configuration.

Abstract: An apparatus for integrating wafer scale semiconductor integrated circuits and interfacing them with other systems. A wafer, partial wafer, die or plurality of same are mated to a printed circuit board (PCB) which electrically contacts the pads on each die using small conductive pillars. The PCB in turn is connected easily to other electronic systems. The entire apparatus is incorporated into other systems which utilize the dice in the apparatus. The apparatus may be fitted with heating elements and cooling channels to generate the necessary dice temperatures for burn-in, testing, and operation. The apparatus is easily adaptable to include more dice in a stacked configuration.

Abstract: An apparatus for wafer scale burn-in and testing of semiconductor integrated circuits and a method for its utilization. A wafer is mated to a printed circuit board which electrically contacts the pads on each die using small conductive pillars. Single precise alignment of entire wafer within apparatus allows for testing all the dice on the wafer in parallel, eliminating need to probe each die individually. The apparatus is fitted with heating elements and cooling channels to generate the necessary wafer temperatures for burn-in and testing. The method of utilization eliminates processing of defective dice beyond burn-in and test, thereby increasing throughput.

Abstract: A spare memory arrangement in which a defective chip in a memory array can be electronically replaced with a spare chip of identical construction. A defective memory chip is first detected and located by a suitable means, such as an error correction code (ECC), check sum, or parity check. A sparer chip is constructed to be actuated upon a read to the defective memory chip to replace the defective chip with a memory spare chip. The sparer chip includes a cross-point memory (CPM) cell having an address register for receiving data from a central processing unit (CPU) and routing the data to and from the spare memory chip. The cross-point memory (CPM) cell is actuated by control input from the (CPU).

Abstract: A circuit that controls, calibrates and monitors critical timing parameters in a computer system or network to prevent loss of, or inaccurate data, when transferring this data.