Patents by Inventor Karl Robinson

Karl Robinson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Devices having improved capacitance and methods of their fabrication
    Publication number: 20050037592
    Abstract: A capacitor formed by a process using only two deposition steps and a dielectric formed by oxidizing a metal layer in an electrolytic solution. The capacitor has first and second conductive plates and a dielectric is formed from the first conductive plate.
    Type: Application
    Filed: September 22, 2004
    Publication date: February 17, 2005
    Inventor: Karl Robinson
  • Metal trim mirror for optimized thin film resistor laser trimming
    Publication number: 20050030632
    Abstract: A device and a method of forming the device are disclosed. The device includes a reflector, a first dielectric layer disposed on the reflector, and a thin film resistor disposed on the reflector. The reflector acts as a barrier between the thin film resistor and an underlying dielectric layer which may have a non-uniform thickness. Thus, the thickness control and uniformity of the dielectric layer underlying the reflector does not affect the laser trimming of the thin film resistor. In addition to serving as a barrier, the reflector reflects the trimming laser energy back towards the thin film resistor, thereby improving the efficiency of the laser trimming of the thin film resistor. Furthermore, the thickness of the first dielectric layer situated below the thin film resistor and above the reflector can be easily controlled to substantially optimize the laser trimming efficiency of the thin film resistor.
    Type: Application
    Filed: August 4, 2003
    Publication date: February 10, 2005
    Inventors: Ralph Wall, Karl Robinson
  • Copper electroless deposition on a titanium-containing surface
    Patent number: 6326303
    Abstract: A method for depositing copper on a titanium-containing surface of a substrate is provided. The method includes forming a patterned catalyst material on the substrate, such that the titanium-containing surface is exposed in selected regions. The catalyst material has an oxidation half-reaction potential having a magnitude that is greater than a magnitude of a reduction half-reaction potential of titanium dioxide. Copper is then deposited from an electroless solution onto the exposed regions of the titanium-containing surface.
    Type: Grant
    Filed: February 11, 2000
    Date of Patent: December 4, 2001
    Assignee: Micron Technology, Inc.
    Inventors: Karl Robinson, Ted Taylor
  • Copper electroless deposition on a titanium-containing surface
    Patent number: 6126989
    Abstract: A method for depositing copper on a titanium-containing surface of a substrate is provided. The method includes forming a patterned catalyst material on the substrate, such that the titanium-containing surface is exposed in selected regions. The catalyst material has an oxidation half-reaction potential having a magnitude that is greater than a magnitude of a reduction half-reaction potential of titanium dioxide. Copper is then deposited from an electroless solution onto the exposed regions of the titanium-containing surface.
    Type: Grant
    Filed: August 26, 1998
    Date of Patent: October 3, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Karl Robinson, Ted Taylor
  • Copper electroless deposition on a titanium-containing surface
    Patent number: 6054173
    Abstract: A method for depositing copper on a titanium-containing surface of a substrate is provided. The method includes forming a patterned catalyst material on the substrate, such that the titanium-containing surface is exposed in selected regions. The catalyst material has an oxidation half-reaction potential having a magnitude that is greater than a magnitude of a reduction half-reaction potential of titanium dioxide. Copper is then deposited from an electroless solution onto the exposed regions of the titanium-containing surface.
    Type: Grant
    Filed: August 22, 1997
    Date of Patent: April 25, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Karl Robinson, Ted Taylor
  • Copper electroless deposition on a titanium-containing surface
    Patent number: 6054172
    Abstract: A method for depositing copper on a titanium-containing surface of a substrate is provided. The method includes forming a patterned catalyst material on the substrate, such that the titanium-containing surface is exposed in selected regions. The catalyst material has an oxidation half-reaction potential having a magnitude that is greater than a magnitude of a reduction half-reaction potential of titanium dioxide. Copper is then deposited from an electroless solution onto the exposed regions of the titanium-containing surface.
    Type: Grant
    Filed: February 25, 1999
    Date of Patent: April 25, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Karl Robinson, Ted Taylor