Patents by Inventor Karthik Ranganathan
Karthik Ranganathan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11742055Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack; and (c) an array of POP memory devices, wherein each POP memory device is disposed adjacent to a respective DUT in the array of DUTs. Further, the testing apparatus comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.Type: GrantFiled: November 9, 2022Date of Patent: August 29, 2023Assignee: Advantest Test Solutions, Inc.Inventors: Karthik Ranganathan, Gregory Cruzan, Samer Kabbani, Gilberto Oseguera, Ira Leventhal
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Publication number: 20230236241Abstract: Embodiments of the present invention provide testing systems with liquid cooled thermal arrays that can pivot freely in three dimensions allowing surfaces to be brought into even, level, and secure contact, thereby preventing air gaps between surfaces and improving thermal performance. In this way, more DUTs can be tested in parallel within a small test space, overall costs of the test system are reduced, and greater cooling capacity can be provided for testing high-powered devices. Gimbaled mounts are disposed on a bottom surface of individual thermal interface boards (TIBs) of a test system, and/or on top of individual thermal heads of a thermal array (TA) having a common cold plate (or having multiple cold plates).Type: ApplicationFiled: January 26, 2022Publication date: July 27, 2023Inventors: Gregory Cruzan, Karthik Ranganathan, Gilberto Oseguera, Joe Koeth, Paul Ferrari, James Hastings, Chee Wah Ho
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Patent number: 11710145Abstract: In some examples, a server may determine that a case, created to address an issue of a computing device, is closed and perform an analysis of steps in a process used to close the case. The analysis may determine a length of time of each step and determine that a time to close the case or complete a particular step was at least a predetermined amount faster than average. The server may use machine learning to create a survey question to determine a technique used to close the case or complete the particular step faster than average and to determine one or more incentives to provide a technician that closed the case. An answer from the technician to the survey question may include the technique used to close the case or complete the particular step faster than average. The technique may be shared with other technicians.Type: GrantFiled: August 28, 2020Date of Patent: July 25, 2023Assignee: Dell Products L.P.Inventors: Karthik Ranganathan, Sathish Kumar Bikumala
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Publication number: 20230228812Abstract: An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.Type: ApplicationFiled: January 9, 2023Publication date: July 20, 2023Inventors: Samer Kabbani, Kazuyuki Yamashita, Hiroki Ikeda, Ira Leventhal, Mohammad Ghazvini, Paul Ferrari, Karthik Ranganathan, Gregory Cruzan, Gilberto Oseguera
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Publication number: 20230197185Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack; and (c) an array of POP memory devices, wherein each POP memory device is disposed adjacent to a respective DUT in the array of DUTs. Further, the testing apparatus comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.Type: ApplicationFiled: February 19, 2023Publication date: June 22, 2023Inventors: Karthik Ranganathan, Gregory Cruzan, Samer Kabbani, Gilberto Oseguera, Ira Leventhal
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Patent number: 11674999Abstract: A system for testing circuits of an integrated circuit semiconductor wafer includes a tester system for generating signals for input to the circuits and for processing output signals from the circuits for testing the wafer and a test stack coupled to the tester system. The test stack includes a wafer probe for contacting a first surface of the wafer and for probing individual circuits of the circuits of the wafer, a wafer thermal interposer (TI) layer operable to contact a second surface of the wafer and operable to selectively heat areas of the wafer, and a cold plate disposed under the wafer TI layer and operable to cool the wafer. The system further includes a thermal controller for selectively heating and maintaining temperatures of the areas of the wafer by controlling cooling of the cold plate and by controlling selective heating of the wafer TI layer.Type: GrantFiled: April 20, 2022Date of Patent: June 13, 2023Assignee: Advantest Test Solutions, Inc.Inventors: Samer Kabbani, Paul Ferrari, Ikeda Hiroki, Kiyokawa Toshiyuki, Gregory Cruzan, Karthik Ranganathan
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Patent number: 11656273Abstract: Embodiments of the present invention provide systems and methods for performing automated device testing at high power using ATI-based thermal management that substantially mitigates or prevents the pads and pins thereof from being burned or damaged. In this way, the lifespan of the testing equipment is improved and the expected downtime of testing equipment is substantially reduced, while also reducing cost of operation.Type: GrantFiled: November 5, 2021Date of Patent: May 23, 2023Assignee: Advantest Test Solutions, Inc.Inventors: Gregory Cruzan, Karthik Ranganathan, Mohammad Ghazvini, Paul Ferrari, Samer Kabbani, Todd Berk
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Publication number: 20230143240Abstract: Embodiments of the present invention provide systems and methods for performing automated device testing at high power using ATI-based thermal management that substantially mitigates or prevents the pads and pins thereof from being burned or damaged. In this way, the lifespan of the testing equipment is improved and the expected downtime of testing equipment is substantially reduced, while also reducing cost of operation.Type: ApplicationFiled: November 5, 2021Publication date: May 11, 2023Inventors: Gregory Cruzan, Karthik Ranganathan, Mohammad Ghazvini, Paul Ferrari, Samer Kabbani, Todd Berk, Thomas Jones
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Patent number: 11640573Abstract: Systems and methods for assessing the skills of a customer support agent using one or more Artificial Intelligence/Machine Learning (AI/ML) models are disclosed. In at least one embodiment, one or more benchmarks against which the performance of the customer support agent is to be measured are established. The one or more benchmarks may be derived through direct and/or indirect analysis of historical customer service data by an AI/ML benchmark model. In at least one embodiment, data relating to performance of the customer support agent during a customer call is monitored. In at least one embodiment, the AI/ML benchmark model is used to determine one or more benchmark scores identifying whether the customer support agent is meeting the one or more benchmarks.Type: GrantFiled: July 29, 2020Date of Patent: May 2, 2023Assignee: Dell Products L.P.Inventors: Karthik Ranganathan, Sathish Kumar Bikumala, David Thomas Kirkpatrick, Tejas Naren Tennur Narayanan, Shalu Singh, Amit Sawhney
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Publication number: 20230129112Abstract: A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.Type: ApplicationFiled: June 15, 2022Publication date: April 27, 2023Inventors: Samer Kabbani, Paul Ferrari, Ikeda Hiroki, Kiyokawa Toshiyuki, Gregory Cruzan, Karthik Ranganathan, Todd Berk, Ian Williams, Mohammad Ghazvini, Tom Jones
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Publication number: 20230103082Abstract: Disposing a DUT between a cold plate and an active thermal interposer device of the thermal management head. The DUT includes a plurality of modules and the active thermal interposer device includes a plurality of zones, each zone of the plurality of zones corresponding to a respective module of the plurality of modules and operable to be selectively heated. Receiving a respective set of inputs corresponding to each zone of the plurality of zones. Performing thermal management of the plurality of modules of the DUT by separately controlling temperature of each zone of the plurality of zones by controlling a supply of coolant to a cold plate, and individually controlling heating of each zone of the plurality of zones.Type: ApplicationFiled: December 6, 2022Publication date: March 30, 2023Inventors: Karthik Ranganathan, Gregory Cruzan, Paul Ferrari, Samer Kabbani, Martin Fischer
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Patent number: 11609266Abstract: A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.Type: GrantFiled: November 19, 2021Date of Patent: March 21, 2023Assignee: Advantest Test Solutions, Inc.Inventors: Samer Kabbani, Paul Ferrari, Ikeda Hiroki, Kiyokawa Toshiyuki, Gregory Cruzan, Karthik Ranganathan, Todd Berk, Ian Williams, Mohammad Ghazvini, Thomas Jones
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Publication number: 20230083634Abstract: An automated test equipment (ATE) includes a test interface board assembly. The test interface board includes a socket configured to provide electrical couplings from the test interface board to a device under test (DUT). The socket is further configured to accept an active thermal interposer (ATI) device while the DUT is disposed in the socket. The socket includes a plurality of spring-loaded roller retention devices configured to retain one or more devices in the socket. The ATE further includes a Z-axis interface plate configured to open the plurality of spring-loaded roller retention devices to enable insertion of the DUT into the socket and an ATI placement plate configured to open the plurality of spring-loaded roller retention devices to enable insertion of the ATI device into the socket.Type: ApplicationFiled: July 29, 2022Publication date: March 16, 2023Inventors: KARTHIK RANGANATHAN, GILBERTO OSEGUERA, GREGORY CRUZAN, JOE KOETH, IKEDA HIROKI, KIYOKAWA TOSHIYUKI
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Publication number: 20230062440Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack; and (c) an array of POP memory devices, wherein each POP memory device is disposed adjacent to a respective DUT in the array of DUTs. Further, the testing apparatus comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.Type: ApplicationFiled: November 9, 2022Publication date: March 2, 2023Inventors: Karthik Ranganathan, Gregory Cruzan, Samer Kabbani, Gilberto Oseguera, Ira Leventhal
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Patent number: 11587640Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack; and (c) an array of POP memory devices, wherein each POP memory device is disposed adjacent to a respective DUT in the array of DUTs. Further, the testing apparatus comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.Type: GrantFiled: November 19, 2021Date of Patent: February 21, 2023Assignee: Advantest Test Solutions, Inc.Inventors: Karthik Ranganathan, Gregory Cruzan, Samer Kabbani, Gilberto Oseguera, Ira Leventhal
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Patent number: 11573262Abstract: Disposing a DUT between a cold plate and an active thermal interposer device of the thermal management head. The DUT includes a plurality of modules and the active thermal interposer device includes a plurality of zones, each zone of the plurality of zones corresponding to a respective module of the plurality of modules and operable to be selectively heated. Receiving a respective set of inputs corresponding to each zone of the plurality of zones. Performing thermal management of the plurality of modules of the DUT by separately controlling temperature of each zone of the plurality zones by controlling a supply of coolant to a cold plate, and individually controlling heating of each zone of the plurality zones.Type: GrantFiled: November 19, 2021Date of Patent: February 7, 2023Assignee: Advantest Test Solutions, Inc.Inventors: Karthik Ranganathan, Gregory Cruzan, Paul Ferrari, Samer Kabbani, Martin Fischer
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Patent number: 11567119Abstract: A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.Type: GrantFiled: November 19, 2021Date of Patent: January 31, 2023Assignee: Advantest Test Solutions, Inc.Inventors: Samer Kabbani, Paul Ferrari, Ikeda Hiroki, Kiyokawa Toshiyuki, Gregory Cruzan, Karthik Ranganathan, Todd Berk, Ian Williams, Mohammad Ghazvini, Thomas Jones
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Patent number: 11562121Abstract: A machine learning (ML) module that analyzes multiple language-influencing factors to correct textual content in a more meaningful and efficient manner. In the context of product support, the ML module considers the factors such as a customer's persona that shapes the words a customer chooses while speaking/writing to a customer support agent, current social trends that create new words in the social media/social platforms related to the customer's support issue, and the device used by the customer to input the textual content because different words may be input by the customer when using a smart phone versus a desktop/laptop personal computer with a traditional keyboard. The ML module also may analyze the agent's persona to modify agent's response to the customer because the agent's persona can influence the content of the agent's text. The ML module automatically corrects textual content in real-time before it is sent to the relevant recipient.Type: GrantFiled: July 29, 2020Date of Patent: January 24, 2023Assignee: Dell Products L.P.Inventors: Sathish Kumar Bikumala, Karthik Ranganathan, Tejas Naren Tennur Narayanan
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Patent number: 11549981Abstract: An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.Type: GrantFiled: September 20, 2021Date of Patent: January 10, 2023Assignee: Advantest Test Solutions, Inc.Inventors: Samer Kabbani, Kazuyuki Yamashita, Hiroki Ikeda, Ira Leventhal, Mohammad Ghazvini, Paul Ferrari, Karthik Ranganathan, Gregory Cruzan, Gilberto Oseguera
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Patent number: 11509713Abstract: An aspect of the present disclosure facilitates selection of leader nodes in distributed data services. In one embodiment, a distributed data service is provided operative based on multiple nodes. Upon receiving from a user a selection of a set of nodes that are preferred as leader nodes, a node contained in the set of nodes is set as a leader node in the distributed data service in view of the selection by the user. Accordingly, a user is provided control over the selection of leader nodes in the distributed data service.Type: GrantFiled: July 6, 2020Date of Patent: November 22, 2022Assignee: YugaByte IncInventors: Bogdan-Alexandru Matican, Rahul Desirazu, Karthik Ranganathan, Kannan Muthukkaruppan, Bharat Chandra Baddepudi, Ramkumar Vaidyanathan Sri, Choudhury Sidharth