Abstract: A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.

Abstract: A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

Abstract: In some examples, a server may determine that a case, created to address an issue of a computing device, is closed and perform an analysis of a communication session between a user and a technician and the steps taken by the technician to resolve the issue. Machine learning may be used on results of the analysis to predict potential pain points. For example, steps that take longer than average and during which particular words spoken by the user increase in pitch and/or volume may be predicted to be potential pain points. The machine learning may create questions for inclusion in a custom survey based on the potential pain points. The custom survey may be presented to the user. The answers may be correlated with the potential pain points to determine actual pain points in the steps taken to resolve the issue.

Abstract: A testing apparatus comprises a test interface board comprising a plurality of socket interface boards, wherein each socket interface board comprises: a) an open socket to hold a DUT; b) a discrete active thermal interposer comprising thermal properties and operable to make thermal contact with the DUT; c) a superstructure operable to contain the discrete active thermal interposer; and d) an actuation mechanism operable to provide a contact force to bring the discrete active thermal interposer in contact with the DUT.

Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack; and (c) an array of POP memory devices, wherein each POP memory device is disposed adjacent to a respective DUT in the array of DUTs. Further, the testing apparatus comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.

Abstract: A system for testing circuits of an integrated circuit semiconductor wafer includes a tester system for generating signals for input to the circuits and for processing output signals from the circuits for testing the wafer and a test stack coupled to the tester system. The test stack includes a wafer probe for contacting a first surface of the wafer and for probing individual circuits of the circuits of the wafer, a wafer thermal interposer (TI) layer operable to contact a second surface of the wafer and operable to selectively heat areas of the wafer, and a cold plate disposed under the wafer TI layer and operable to cool the wafer. The system further includes a thermal controller for selectively heating and maintaining temperatures of the areas of the wafer by controlling cooling of the cold plate and by controlling selective heating of the wafer TI layer.

Abstract: A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

Abstract: Disposing a DUT between a cold plate and an active thermal interposer device of the thermal management head. The DUT includes a plurality of modules and the active thermal interposer device includes a plurality of zones, each zone of the plurality of zones corresponding to a respective module of the plurality of modules and operable to be selectively heated. Receiving a respective set of inputs corresponding to each zone of the plurality of zones. Performing thermal management of the plurality of modules of the DUT by separately controlling temperature of each zone of the plurality zones by controlling a supply of coolant to a cold plate, and individually controlling heating of each zone of the plurality zones.

Abstract: An aspect of the present disclosure facilitates consumption of data services provisioned in cloud infrastructures. In one embodiment, a name server maintains a node-map data reflecting the corresponding set of nodes (in cloud infrastructures) currently hosting each of multiple data services. A consumer system (e.g. an end user system or another node in the cloud infrastructure) seeking to access a desired data service, sends to the name server a resolution request containing an identifier of the desired data service. The consumer system receives from the name server, identifiers of a set of nodes currently hosting the desired data service and then accesses the desired data service through at least one of the set of nodes.

Abstract: A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

Abstract: A stand-alone active thermal interposer device for use in testing a system-in-package device under test (DUT), the active thermal interposer device includes a body layer having a first surface and a second surface, wherein the first surface is operable to be disposed adjacent to a cold plate, and a plurality of heating zones defined across a second surface of the body layer, the plurality of heating zones operable to be controlled by a thermal controller to selectively heat and maintain respective temperatures thereof, the plurality of heating zones operable to heat a plurality of areas of the DUT when the second surface of the body layer is disposed adjacent to an interface surface of the DUT during testing of the DUT.

Abstract: A system for testing circuits of an integrated circuit semiconductor wafer includes a tester system for generating signals for input to the circuits and for processing output signals from the circuits for testing the wafer and a test stack coupled to the tester system. The test stack includes a wafer probe for contacting a first surface of the wafer and for probing individual circuits of the circuits of the wafer, a wafer thermal interposer (TI) layer operable to contact a second surface of the wafer and operable to selectively heat areas of the wafer, and a cold plate disposed under the wafer TI layer and operable to cool the wafer. The system further includes a thermal controller for selectively heating and maintaining temperatures of the areas of the wafer by controlling cooling of the cold plate and by controlling selective heating of the wafer TI layer.

Abstract: A testing apparatus comprises a tester comprising a plurality of racks, wherein each rack comprises a plurality of slots, wherein each slot comprises: (a) an interface board affixed in a slot of a rack, wherein the interface board comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT); and (b) a carrier comprising an array of DUTs, wherein the carrier is operable to displace into the slot of the rack, and wherein each DUT in the array of DUTs aligns with a respective socket of the plurality of sockets on the interface board. The testing apparatus further comprises a pick-and-place mechanism for loading the array of DUTs into the carrier and an elevator for transporting the carrier to the slot of the rack.

Abstract: A test apparatus comprising a tester interface board (TIB) affixed in a slot of a tester rack, wherein the TIB comprises test circuitry and a plurality of sockets, each socket operable to receive a device under test (DUT). The test apparatus further comprises a carrier comprising an array of DUTs, wherein the carrier is operable to slide into the slot of the tester rack, and wherein each DUT in the array of DUTs aligns with a respective socket on the TIB. Further, the test apparatus comprises a plurality of socket covers, wherein each socket cover of the plurality of socket covers is operable to actuate a top portion of each DUT of the array of DUTs in the carrier.

Abstract: An apparatus for thermal control of a device under test (DUT) includes a cooling structure operable to provide cooling, the cooling structure operable to inlet cooling material via an inlet port thereof and operable to outlet. cooling material via an outlet port thereof, a variable thermal conductance material (VTCM) layer disposed on a surface of the cooling structure, and a heater layer operable to generate heat based on an electronic control, and wherein the VTCM layer is operable to transfer cooling from the cooling structure to the heater layer. A thermal interface material layer is disposed on the heater layer. The thermal interface material layer is operable to provide thermal coupling and mechanical compliance with respect to the DUT. The apparatus includes a compression a a mechanism for providing compression to the VTCM layer to vary a thermal conductance of the VTCM layer. The compression mechanism is also for decoupling the VTCM layer from the heater layer.

Abstract: An electronic device (such as an access point or an eNodeB) that selectively provides prioritized communication is described. During operation, the electronic device may receive one or more packets or frames from a second electronic device using a communication protocol. Then, the electronic device may determine device-specific information based at least in part on a device profile associated with the communication protocol and/or a communication history of the second electronic device. Next, based on the determined device-specific information, the electronic device may assign additional data traffic associated with the second electronic device to a queue in a set of queues, where queues in the set of queues have different priorities, and where the queue provides a predefined latency of communication with the second electronic device corresponding to a priority of the queue.

Abstract: In some examples, a server may determine that a case, created to address an issue of a computing device, is closed and perform an analysis of steps in a process used to close the case. The analysis may determine a length of time of each step and determine that a time to close the case or complete a particular step was at least a predetermined amount faster than average. The server may use machine learning to create a survey question to determine a technique used to close the case or complete the particular step faster than average and to determine one or more incentives to provide a technician that closed the case. An answer from the technician to the survey question may include the technique used to close the case or complete the particular step faster than average. The technique may be shared with other technicians.

Abstract: A system to intelligently guide a customer along a service engagement path is disclosed. In certain embodiments, a customer persona for the customer is determined as well as the current location of the customer in a process interaction along the service engagement path. The customer persona of the customer and current location of the customer along the service engagement path may be provided to an Artificial Intelligence/Machine Learning (AI/ML) path guidance model. Intelligent guidance data is received from the AI/ML path guidance model, where the intelligent guidance data corresponds to a suggested location along the service engagement path based on the customer persona and current location of the customer along the service engagement path. The customer is directed to the suggested location in the service engagement path.

Abstract: A machine learning (ML) module that analyzes multiple language-influencing factors to correct textual content in a more meaningful and efficient manner. In the context of product support, the ML module considers the factors such as a customer's persona that shapes the words a customer chooses while speaking/writing to a customer support agent, current social trends that create new words in the social media/social platforms related to the customer's support issue, and the device used by the customer to input the textual content because different words may be input by the customer when using a smart phone versus a desktop/laptop personal computer with a traditional keyboard. The ML module also may analyze the agent's persona to modify agent's response to the customer because the agent's persona can influence the content of the agent's text. The ML module automatically corrects textual content in real-time before it is sent to the relevant recipient.

Abstract: Systems and methods for assessing the skills of a customer support agent using one or more Artificial Intelligence/Machine Learning (AI/ML) models are disclosed. In at least one embodiment, one or more benchmarks against which the performance of the customer support agent is to be measured are established. The one or more benchmarks may be derived through direct and/or indirect analysis of historical customer service data by an AI/ML benchmark model. In at least one embodiment, data relating to performance of the customer support agent during a customer call is monitored. In at least one embodiment, the AI/ML benchmark model is used to determine one or more benchmark scores identifying whether the customer support agent is meeting the one or more benchmarks.