Patents by Inventor Kazuki Kosai
Kazuki Kosai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11862486Abstract: A substrate processing apparatus includes a substrate holding unit 31 configured to hold a substrate W; an outer nozzle 45 configured to discharge a processing liquid toward a surface of the substrate from a position at an outside of an outer edge of the substrate held by the substrate holding unit such that at least a central portion of the surface of the substrate is covered with a liquid film of the discharged processing liquid; and an actuator 46 (90) configured to change a height position or a discharge angle of the outer nozzle.Type: GrantFiled: August 5, 2020Date of Patent: January 2, 2024Assignee: TOKYO ELECTRON LIMITEDInventors: Kazuki Kosai, Yoshihiro Kai, Gentaro Goshi, Hiroshi Komiya, Seiya Fujimoto, Takahisa Otsuka
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Patent number: 11798819Abstract: A liquid processing apparatus includes a storage tank, a circulation line, a supply line, a return line and at least one filter. The storage tank stores a processing liquid therein. Through the circulation line, the processing liquid sent from the storage tank is returned back into the storage tank. The supply line connects the circulation line and a supply configured to supply the processing liquid onto a substrate. The return line is connected to the supply line, and the processing liquid is returned back into the storage tank from the supply line through the return line. The filter is provided in at least one of the supply line on an upstream side of a connection point between the return line and the supply line or the return line, and is configured to remove a foreign substance in the processing liquid.Type: GrantFiled: June 22, 2021Date of Patent: October 24, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Kazuki Kosai, Yusuke Takamatsu, Taisei Inoue
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Publication number: 20230268207Abstract: A method includes: supplying a processing liquid to a center position of a substrate surface; shifting a supply position of the processing liquid from the center position to a first eccentric position; holding the supply position of the processing liquid at the first eccentric position and supplying a substitute liquid to a second eccentric position; shifting the supply position of the processing liquid in a direction away from the center position, and shifting a supply position of the substitute liquid to the center position; and supplying the processing liquid to the first eccentric position at a first flow rate, and reducing the flow rate of the processing liquid to a second flow rate after the supply position of the processing liquid starts to be shifted from the first eccentric position in the direction and until the supply position of the substitute liquid reaches the center position.Type: ApplicationFiled: April 7, 2023Publication date: August 24, 2023Inventors: Hiroki SAKURAI, Kazuki KOSAI, Kazuyoshi SHINOHARA
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Publication number: 20230264233Abstract: A liquid processing apparatus includes: a storage tank that stores a processing liquid; a first circulation line that causes the processing liquid sent from the storage tank to pass through a first filter and to return to the storage tank; and at least one second circulation line that causes the processing liquid to pass through a second filter and to return to the storage tank, wherein the second circulation line is shorter in a flow path than the first circulation line, a second flow rate of the processing liquid flowing into the second circulation line is smaller than a first flow rate of the processing liquid flowing into the first circulation line at a downstream side of a location where the first circulation line and the second circulation line are joined, and the second filter is smaller in a filtration amount per unit time than the first filter.Type: ApplicationFiled: June 22, 2021Publication date: August 24, 2023Inventors: Kazuki KOSAI, Taisei INOUE, Yusuke TAKAMATSU, Takahisa OTSUKA, Masaru AMAI, Itaru KANNO, Hiroshi YANO
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Patent number: 11676835Abstract: A method includes: supplying a processing liquid to a center position of a substrate surface; shifting a supply position of the processing liquid from the center position to a first eccentric position; holding the supply position of the processing liquid at the first eccentric position and supplying a substitute liquid to a second eccentric position; shifting the supply position of the processing liquid in a direction away from the center position, and shifting a supply position of the substitute liquid to the center position; and supplying the processing liquid to the first eccentric position at a first flow rate, and reducing the flow rate of the processing liquid to a second flow rate after the supply position of the processing liquid starts to be shifted from the first eccentric position in the direction and until the supply position of the substitute liquid reaches the center position.Type: GrantFiled: February 22, 2021Date of Patent: June 13, 2023Assignee: Tokyo Electron LimitedInventors: Hiroki Sakurai, Kazuki Kosai, Kazuyoshi Shinohara
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Publication number: 20230099012Abstract: A method includes: supplying a processing liquid to a center position of a substrate surface; shifting a supply position of the processing liquid from the center position to a first eccentric position; holding the supply position of the processing liquid at the first eccentric position and supplying a substitute liquid to a second eccentric position; shifting the supply position of the processing liquid in a direction away from the center position, and shifting a supply position of the substitute liquid to the center position; and supplying the processing liquid to the first eccentric position at a first flow rate, and reducing the flow rate of the processing liquid to a second flow rate after the supply position of the processing liquid starts to be shifted from the first eccentric position in the direction and until the supply position of the substitute liquid reaches the center position.Type: ApplicationFiled: February 22, 2021Publication date: March 30, 2023Inventors: Hiroki SAKURAI, Kazuki KOSAI, Kazuyoshi SHINOHARA
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Publication number: 20230079190Abstract: A substrate processing apparatus comprising a holding unit, a liquid supply unit, a recovery unit, a circulation path, a gas supply unit, and a control unit. The holding unit holds a substrate. The liquid supply unit supplies a processing liquid to a first major surface of the substrate being held by the holding unit. The recovery unit recovers the processing liquid that has been used for processing the substrate. The circulation path returns the processing liquid recovered by the recovery unit back to the liquid supply unit. The gas supply unit supplies a gas to a second major surface to the substrate being held by the holding unit opposite to the first major surface. The control unit controls the liquid supply unit and the gas supply unit. The control unit, when the processing liquid planned to be returned back to the liquid supply unit by the circulation path is supplied to the first major surface, causes the gas to be supplied to the second major surface.Type: ApplicationFiled: February 15, 2021Publication date: March 16, 2023Inventors: Kazuki KOSAI, Kazuyoshi SHINOHARA
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Patent number: 11569086Abstract: A substrate processing apparatus includes a substrate processing part that supplies a processing liquid from a processing liquid supply part to a mounted substrate to execute liquid processing, a liquid drainage part that has a recovery channel connected to a storage part that stores the processing liquid and drains the processing liquid used for the liquid processing, and a control unit executes a processing recipe for the liquid processing and a cleaning recipe for cleaning the substrate processing part and the liquid drainage part. The control unit executes a cleaning operation for supplying a cleaning liquid from a cleaning liquid supply part to clean the substrate processing part and the liquid drainage part and subsequently executes a return operation for supplying the processing liquid from the processing liquid supply part to replace the cleaning liquid attached to the substrate processing part and the liquid drainage part with the processing liquid.Type: GrantFiled: October 15, 2020Date of Patent: January 31, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Kazuki Kosai, Kazuyoshi Shinohara
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Publication number: 20230005763Abstract: An apparatus includes: a tank storing a processing liquid; a circulation line; a branch line; a processing part for supplying the processing liquid to a substrate at the branch line; a discharge part for reducing a storage amount of the processing liquid; a supply part for supplying a new processing liquid to the tank; and a controller including: a first determination part for determining whether the storage amount is less than a lower limit value; a first replenishment controller for replenishing the processing liquid to the tank when the storage amount is less than the lower limit value; a calculation part for calculating a replenishment amount of the processing liquid; and a second replenishment controller for reducing the storage amount and replenishing the processing liquid to the tank when a calculation value of the replenishment amount is less than a set value.Type: ApplicationFiled: June 22, 2022Publication date: January 5, 2023Inventors: Kazuki KOSAI, Hideaki UDOU, Seiya FUJIMOTO, Yudai TAKANAGA, Takahito NAKASHOYA, Shogo FUKUI, Atsushi ANAMOTO, So OSADA
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Publication number: 20210398828Abstract: A liquid processing apparatus includes a storage tank, a circulation line, a supply line, a return line and at least one filter. The storage tank stores a processing liquid therein. Through the circulation line, the processing liquid sent from the storage tank is returned back into the storage tank. The supply line connects the circulation line and a supply configured to supply the processing liquid onto a substrate. The return line is connected to the supply line, and the processing liquid is returned back into the storage tank from the supply line through the return line. The filter is provided in at least one of the supply line on an upstream side of a connection point between the return line and the supply line or the return line, and is configured to remove a foreign substance in the processing liquid.Type: ApplicationFiled: June 22, 2021Publication date: December 23, 2021Inventors: Kazuki Kosai, Yusuke Takamatsu, Taisei Inoue
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Publication number: 20210134590Abstract: A substrate processing apparatus includes a substrate processing part that supplies a processing liquid from a processing liquid supply part to a mounted substrate to execute liquid processing, a liquid drainage part that has a recovery channel connected to a storage part that stores the processing liquid and drains the processing liquid used for the liquid processing, and a control unit executes a processing recipe for the liquid processing and a cleaning recipe for cleaning the substrate processing part and the liquid drainage part. The control unit executes a cleaning operation for supplying a cleaning liquid from a cleaning liquid supply part to clean the substrate processing part and the liquid drainage part and subsequently executes a return operation for supplying the processing liquid from the processing liquid supply part to replace the cleaning liquid attached to the substrate processing part and the liquid drainage part with the processing liquid.Type: ApplicationFiled: October 15, 2020Publication date: May 6, 2021Applicant: Tokyo Electron LimitedInventors: Kazuki KOSAI, Kazuyoshi SHINOHARA
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Publication number: 20200365424Abstract: A substrate processing apparatus includes a substrate holding unit 31 configured to hold a substrate W; an outer nozzle 45 configured to discharge a processing liquid toward a surface of the substrate from a position at an outside of an outer edge of the substrate held by the substrate holding unit such that at least a central portion of the surface of the substrate is covered with a liquid film of the discharged processing liquid; and an actuator 46 (90) configured to change a height position or a discharge angle of the outer nozzle.Type: ApplicationFiled: August 5, 2020Publication date: November 19, 2020Inventors: Kazuki Kosai, Yoshihiro Kai, Gentaro Goshi, Hiroshi Komiya, Seiya Fujimoto, Takahisa Otsuka
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Patent number: 10770316Abstract: A substrate processing apparatus includes a substrate holding unit 31 configured to hold a substrate W; an outer nozzle 45 configured to discharge a processing liquid toward a surface of the substrate from a position at an outside of an outer edge of the substrate held by the substrate holding unit such that at least a central portion of the surface of the substrate is covered with a liquid film of the discharged processing liquid; and an actuator 46 (90) configured to change a height position or a discharge angle of the outer nozzle.Type: GrantFiled: November 17, 2016Date of Patent: September 8, 2020Assignee: TOKYO ELECTRON LIMITEDInventors: Kazuki Kosai, Yoshihiro Kai, Gentaro Goshi, Hiroshi Komiya, Seiya Fujimoto, Takahisa Otsuka
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Patent number: 10276408Abstract: A flow-rate regulator device for controlling a flow rate of a liquid includes a first flow-rate regulator component positioned on an upstream side of a liquid line, and a second flow-rate regulator component positioned on a downstream side of the liquid line and connected in series to the first flow-rate regulator component. The first flow-rate regulator component adjusts a degree of opening such that a flow rate of liquid flowing through the liquid line is set a specified number of times greater than a target flow rate when the second flow-rate regulator component has a full opening, and the second flow-rate regulator component adjusts a degree of opening such that the flow rate of the liquid flowing through the liquid line is to be at the target flow rate when the first flow-rate regulator component is adjusted to have the degree of opening.Type: GrantFiled: September 10, 2015Date of Patent: April 30, 2019Assignee: TOKYO ELECTRON LIMITEDInventors: Michitaka Amiya, Takami Satoh, Kazuyoshi Eshima, Akihiro Nakamura, Koji Tanaka, Kazuki Kosai
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Publication number: 20180337067Abstract: A substrate processing apparatus includes a substrate holding unit 31 configured to hold a substrate W; an outer nozzle 45 configured to discharge a processing liquid toward a surface of the substrate from a position at an outside of an outer edge of the substrate held by the substrate holding unit such that at least a central portion of the surface of the substrate is covered with a liquid film of the discharged processing liquid; and an actuator 46 (90) configured to change a height position or a discharge angle of the outer nozzle.Type: ApplicationFiled: November 17, 2016Publication date: November 22, 2018Inventors: Kazuki Kosai, Yoshihiro Kai, Gentaro Goshi, Hiroshi Komiya, Seiya Fujimoto, Takahisa Otsuka
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Patent number: 9842751Abstract: Disclosed is a substrate liquid processing apparatus. The apparatus includes: a substrate holding unit configured to hold a substrate horizontally; a nozzle configured to eject a processing liquid in a transversal direction toward a liquid arrival target position set on the substrate held by the substrate holding unit from an ejection port which is located at an injection position spaced away from the liquid arrival target position by a predetermined distance horizontally; and a liquid receiving unit provided below the nozzle to receive the processing liquid dropping from the ejection port of the nozzle.Type: GrantFiled: October 26, 2015Date of Patent: December 12, 2017Assignee: Tokyo Electron LimitedInventors: Shouta Umezaki, Yoshihiro Kai, Kazuki Kosai, Mitsuo Tanaka
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Patent number: 9627192Abstract: Disclosed is a substrate processing apparatus (a substrate processing method, and a computer readable storage medium having a substrate processing program stored therein) of cleaning an etched substrate with a polymer removing liquid, in which any of isopropyl alcohol vapor, water vapor, deionized water and isopropyl alcohol, ammonia water, and ammonia water and isopropyl alcohol is supplied to the substrate before the substrate is cleaned with the polymer removing liquid.Type: GrantFiled: July 20, 2015Date of Patent: April 18, 2017Assignee: Tokyo Electron LimitedInventors: Naoyuki Okamura, Kazuki Kosai, Kazuhiro Teraoka, Fumihiro Kamimura
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Publication number: 20160114345Abstract: Disclosed is a substrate liquid processing apparatus. The apparatus includes: a substrate holding unit configured to hold a substrate horizontally; a nozzle configured to eject a processing liquid in a transversal direction toward a liquid arrival target position set on the substrate held by the substrate holding unit from an ejection port which is located at an injection position spaced away from the liquid arrival target position by a predetermined distance horizontally; and a liquid receiving unit provided below the nozzle to receive the processing liquid dropping from the ejection port of the nozzle.Type: ApplicationFiled: October 26, 2015Publication date: April 28, 2016Inventors: Shouta Umezaki, Yoshihiro Kai, Kazuki Kosai, Mitsuo Tanaka
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Publication number: 20160027635Abstract: Disclosed is a substrate processing apparatus (a substrate processing method, and a computer readable storage medium having a substrate processing program stored therein) of cleaning an etched substrate with a polymer removing liquid, in which any of isopropyl alcohol vapor, water vapor, deionized water and isopropyl alcohol, ammonia water, and ammonia water and isopropyl alcohol is supplied to the substrate before the substrate is cleaned with the polymer removing liquid.Type: ApplicationFiled: July 20, 2015Publication date: January 28, 2016Inventors: Naoyuki Okamura, Kazuki Kosai, Kazuhiro Teraoka, Fumihiro Kamimura
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Publication number: 20150380280Abstract: A flow-rate regulator device for controlling a flow rate of a liquid includes a first flow-rate regulator component positioned on an upstream side of a liquid line, and a second flow-rate regulator component positioned on a downstream side of the liquid line and connected in series to the first flow-rate regulator component. The first flow-rate regulator component adjusts a degree of opening such that a flow rate of liquid flowing through the liquid line is set a specified number of times greater than a target flow rate when the second flow-rate regulator component has a full opening, and the second flow-rate regulator component adjusts a degree of opening such that the flow rate of the liquid flowing through the liquid line is to be at the target flow rate when the first flow-rate regulator component is adjusted to have the degree of opening.Type: ApplicationFiled: September 10, 2015Publication date: December 31, 2015Applicant: TOKYO ELECTRON LIMITEDInventors: Michitaka AMIYA, Takami SATOH, Kazuyoshi ESHIMA, Akihiro NAKAMURA, Koji TANAKA, Kazuki KOSAI