Abstract: A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

Abstract: Provided are an electron beam curable resin composition including an olefin resin, a crosslinking agent, and a white pigment, in which the crosslinking agent has a saturated or unsaturated ring structure, at least one atom among atoms forming at least one ring is bonded to any allylic substituent of an allyl group, a methallyl group, an allyl group through a linking group, and a methallyl group through a linking group, and the white pigment is blended in an amount of more than 200 parts by mass and 500 parts by mass or less with respect to 100 parts by mass of olefin resin, a reflector resin frame using the resin composition, a reflector, a semiconductor light-emitting device, and a molding method using the resin composition.

Abstract: A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

Abstract: A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

Abstract: An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.

Abstract: A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

Abstract: A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

Abstract: A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

Abstract: A complete test involving the entire number of devices in a large group of managed devices (T) is periodically performed to determine whether the devices are operating normally or have a malfunction; a test result (Ic) is recorded in a management database (Db) for each cycle of the complete test, and a device that has been found to be malfunctioning is repaired or replaced; and the suitability of a device model is determined or a suitable device model is selected for each of the managed devices (T) on the basis of history information (N) about each of the managed devices (T) obtained from the test result (Ic) of the complete test that spans a plurality of cycles, as recorded in the management database (Db).

Abstract: A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

Abstract: Either a complete overhaul for replacing with recommended devices the entire number of devices in a large group of managed devices T, or a partial overhaul for repairing or replacing with recommended devices only those managed devices T that are malfunctioning is selectively performed as an initial overhaul. A complete test involving the entire number of the managed devices T is then periodically performed to determine whether the devices are operating normally or have a malfunction. Any devices found to be malfunctioning during any complete test are repaired or replaced with recommended devices.

Abstract: A resin-attached lead frame includes a lead frame main body having a plurality of die pads (LED element resting portions) and a plurality of lead portions spaced from the die pads, the lead frame main body further including LED element resting regions each formed over an area including an upper surface of each of the die pads and an upper surface of each of the lead portions. A reflecting resin section surrounds each LED element resting region of the lead frame main body. A vapor-deposited aluminum layer or a sputtered aluminum layer is provided on respective upper surfaces of the LED element resting regions of the lead frame main body.

Abstract: A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region.

Abstract: A service condition, a cause of a malfunction, or another aspect of a device in a large group of devices to be managed can be analyzed in an accurate and efficient manner. A complete test involving the entire number of devices in a large group of managed devices (T) is periodically performed to determine whether the devices are operating normally or have a malfunction; a test result (Ic) is recorded for each cycle of the complete test, and a device that has been found to be malfunctioning is repaired or replaced; and analysis data G, E are created showing a malfunctioning frequency (N) of each of the managed devices (T) on the basis of the test result (Ic) of the complete test that spans a plurality of cycles.

Abstract: An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.

Abstract: Provided is a semiconductor device capable of preventing a semiconductor chip from being damaged by any sharp burrs of a metallic shielding plate. The semiconductor device includes a semiconductor chip and a metallic shielding plate provided on a circuit surface of the semiconductor chip. The metallic shielding plate is disposed in such a manner that a second surface of a shielding plate body is directed towards the circuit surface of the semiconductor chip, and burrs are positioned contiguous to the second surface of the shielding plate body. At distal ends of the burrs, cutting burrs are formed in a direction orthogonal to the second surface. The sharp burrs extend in a direction opposite to the semiconductor chip, so that the sharp burrs are prevented from damaging the circuit surface of the semiconductor chip.

Abstract: An aerodynamic device for a vehicle that can effectively adjust airflow within a wheel house is obtained. A fixed aerodynamic stabilizer device 10 is formed at a vehicle body longitudinal direction rear side of a rotational axis of a front wheel 15 within a wheel house 16, as a step having an airflow collision groove wall that faces downward in a vehicle body vertical direction. This fixed aerodynamic stabilizer device 10 suppresses flowing-in, into the wheel house 16, of airflow F that is generated accompanying the front wheel 15 rotating in a direction of arrow R.

Abstract: In a wheel pant device (12), wheel pant plates (34 and 36) that form this wheel pant device are able to be rotated in at least a vehicle width direction. By detecting a driving state of a vehicle using a detecting device and rotating the wheel pant plates of the wheel pant device (12) in response to that detected driving state, the airflow acting on the vehicle can be controlled, thereby enabling the driving performance of the vehicle to be improved.

Abstract: Provided is a semiconductor device capable of preventing a semiconductor chip from being damaged by any sharp burrs of a metallic shielding plate. The semiconductor device includes a semiconductor chip and a metallic shielding plate provided on a circuit surface of the semiconductor chip. The metallic shielding plate is disposed in such a manner that a second surface of a shielding plate body is directed towards the circuit surface of the semiconductor chip, and burrs are positioned contiguous to the second surface of the shielding plate body. At distal ends of the burrs, cutting burrs are formed in a direction orthogonal to the second surface. The sharp burrs extend in a direction opposite to the semiconductor chip, so that the sharp burrs are prevented from damaging the circuit surface of the semiconductor chip.

Abstract: An aerodynamic device for a vehicle that can effectively adjust airflow within a wheel house is obtained. A fixed aerodynamic stabilizer device 10 is formed at a vehicle body longitudinal direction rear side of a rotational axis of a front wheel 15 within a wheel house 16, as a step having an airflow collision groove wall that faces downward in a vehicle body vertical direction. This fixed aerodynamic stabilizer device 10 suppresses flowing-in, into the wheel house 16, of airflow F that is generated accompanying the front wheel 15 rotating in a direction of arrow R.