Abstract: Provided is a polishing composition containing at least aluminum oxide abrasive grains and water, and having a pH of 8.5 or higher. The aluminum oxide abrasive grains have a specific surface area of 20 m2/g or less. It is preferable for the aluminum oxide abrasive grains to have an average secondary particle size of 0.1 ?m or more and 20 ?m or less. The polishing composition is used for polishing hard and brittle materials having a Vickers hardness of 1,500 Hv or higher, such as sapphire, silicon carbide, and gallium nitride.

Abstract: A polishing composition of the present invention contains abrasive grains each having a surface with protrusions. Parts of the abrasive grains have larger particle diameters than the volume-based average particle diameter of the abrasive grains, and the average of values respectively obtained by dividing a height of each protrusion on the surface of each abrasive grain belonging to the parts of the abrasive grains by the width of a base portion of the same protrusion is 0.170 or more. Protrusions on the surfaces of abrasive grains belonging to the parts of the abrasive grains that have larger particle diameters than the volume-based average particle diameter of the abrasive grains have an average height of 3.5 nm or more. The polishing composition has a content of an organic alkali of 100 mmol or less per kilogram of the abrasive grains in the polishing composition.

Abstract: Provided is an article having a metal oxide coating employing a novel configuration exhibiting both color and metallic luster. The article having a metal oxide coating disclosed herein is provided with a base material including a metal material and a metal oxide coating including a metal oxide coated onto the surface of the base material. The metal oxide coating is formed by polishing the surface of the base material, using particles composed of the metal oxide.

Abstract: A polishing device includes a polishing member, a tool, and a contact mechanism. The polishing member includes a polishing surface that is shaped in conformance with the shape of an end of a workpiece. The tool functions as a shape-processing cutting tool or a surface modifying tool that has the same shape as the shape of the end. The shape-processing cutting tool processes the polishing surface of the polishing member to be shaped in conformance with the shape of the end. The surface modifying tool modifies the polishing surface to be shaped in conformance with the shape of the portion to be polished. The contact mechanism brings the tool into contact with the polishing surface of the polishing member.

Abstract: A polishing device includes a motor movement mechanism and a second motor that rotates a workpiece. The motor movement mechanism moves the workpiece in a direction tangential to a radially outer circumferential surface of a polishing member and moves the workpiece in a direction orthogonal to a rotational axis of the polishing member.

Abstract: [Problem] An object is to provide a polishing composition which can improve smoothness of a surface of an alloy material to obtain a highly glossy surface, and can obtain a high-quality mirror surface having significantly reduced scratches or the like. [Solution] There is provided a polishing composition which is used for polishing an alloy material, and which comprises abrasive grains and an additive which does not form a complex with specific metal species and is adsorbed on a surface of the alloy to exhibit an anticorrosive effect.

Abstract: The present invention relates to a polishing method using a polishing tool provided with a polishing pad including a polishing surface shaped in conformance with a curved surface of an object to be polished to efficiently and uniformly polish the curved surface of the object. A polishing tool of the present invention is provided with a polishing pad including a polishing surface shaped in conformance with a curved surface of an object to be polished to uniformly contact the curved surface of the object. The polishing pad preferably has a Shore A hardness of 5 or greater. A polishing method of the present invention uses a polishing tool including a polishing surface shaped in conformance with a curved surface of an object to be polished to uniformly contact the curved surface of the object and polish the curved surface of the object.

Abstract: An alloy material polishing method of the present invention is a method for polishing an alloy material containing a main component and 0.5% by mass or more of an accessory component element having a Vickers hardness (HV) different from that of the main component by 5 or more. The polishing method is characterized by polishing a surface of the alloy material using a polishing composition containing abrasive grains and an oxoacid-based oxidizing agent. The main component of the alloy material is preferably at least one selected from aluminum, titanium, iron, nickel, and copper. The main component of the alloy material is preferably aluminum, and the accessory component element is preferably at least one selected from silicon, magnesium, iron, copper, and zinc. The polishing method preferably includes preliminarily polishing the alloy material using a preliminary polishing composition before the polishing of the alloy material using the polishing composition.

Abstract: Provided is an article having a novel surface with a texture different from conventional kinds. The article having a metal oxide-containing coating provided by the present invention comprises a substrate and a metal oxide-containing coating provided to the substrate surface. The metal oxide-containing coating has a Vickers hardness of 350 or higher, a surface roughness Ra of 300 nm or less, and a 20° gloss value of 50 or higher.

Abstract: A polishing composition which is able to decrease a difference in polishing rate between the alloy material and the resin, and to polish both the alloy material and the resin at a high polishing rate when polishing a substrate which contains an alloy material and a resin on the surface and has a ratio of the alloy material area to the total polishing area in a specific range is provided. To provide the polishing composition used to polish a substrate which contains an alloy material and a resin on a surface thereof and has a ratio of an alloy material area to a total polishing area of from 60 to 95%, the polishing composition containing crystalline abrasive grains having a cumulative 50% particle size (D50) based on a volume-based particle size distribution of 5.0 ?m or more, an acid or a salt thereof and a water-soluble polymer.

Abstract: Provided is a polishing composition with which a high glossy surface is achieved by enhancing smoothness of a surface of an alloy material while maintaining a sufficiently high polishing speed for the alloy material. The present invention relates to a polishing composition used for an application of polishing an alloy material, which contains silica particles having a primary particle average aspect ratio of at least 1.10 and a pH controlling agent.

Abstract: A filtration method, that includes: (A) filtering a liquid having particles with a resin media filter; and (B) applying ultrasonic waves at a frequency of at least 30 kHz to the resin media filter during the filtering (A) or after completion of the filtering (A) to regenerate the resin media filter, where: i) a material of the resin media filter is nylon, polycarbonate, polytetrafluoroethylene (PTFE), polysulfone, polyether sulfone, and/or cellulose, ii) for the regeneration of the resin media filter, the applying results in a filter regeneration ratio of at least 0.40; iii) on a surface of the resin media filter, a support material comprising a mesh resin layer is disposed; and iv) the resin media filter is present in a filter housing having a three-dimensional shape and an ultrasonic vibrator, which generates the ultrasonic waves, is present on a lateral side of said filter housing.

Abstract: The polishing method polishes an alloy material using a polishing pad and a polishing composition supplied to the polishing pad. The polishing composition contains an abrasive of silica or alumina, and a surface temperature of the polishing pad at the end of polishing is 20° C. or below. The method for producing an alloy material comprises a polishing step of polishing an alloy material using a polishing pad and a polishing composition supplied to the polishing pad. The polishing composition contains an abrasive of silica or alumina, and a surface temperature of the polishing pad at the end of polishing is 20° C. or below.

Abstract: Provided is a metal alloy material polishing composition used for polishing a metal alloy material. The metal alloy material contains a first metal species as a main component and a second metal species that is of a different kind from the first metal species and has a standard electrode potential higher than that of the first metal species. The metal alloy material polishing composition contains a compound having a functional group bonded to carbon and capable of trapping the second metal species.

Abstract: A polishing composition of the present invention contains abrasive grains each having a surface with protrusions. Parts of the abrasive grains have larger particle diameters than the volume-based average particle diameter of the abrasive grains, and the average of values respectively obtained by dividing a height of each protrusion on the surface of each abrasive grain belonging to the parts of the abrasive grains by the width of a base portion of the same protrusion is 0.170 or more. Protrusions on the surfaces of abrasive grains belonging to the parts of the abrasive grains that have larger particle diameters than the volume-based average particle diameter of the abrasive grains have an average height of 3.5 nm or more. The polishing composition has a content of an organic alkali of 100 mmol or less per kilogram of the abrasive grains in the polishing composition.

Abstract: An efficient polishing method for polishing an alloy material to have an excellent mirror surface is provided. The alloy material contains a main component and 0.1% by mass or more of an element that has a Vickers hardness (HV) different from the Vickers hardness of the main component by 5 or more. A polishing composition used in the polishing method contains abrasive grains and an oxidant. The alloy material is preferably an aluminum alloy, a titanium alloy, a stainless steel, a nickel alloy, or a copper alloy. It is also preferable that the alloy material is subjected to preliminary polishing before being subjected to polishing in which the polishing composition is used.

Abstract: Disclosed is a polishing composition that contains at least abrasive grains, an oxidizing agent having a redox potential equal to or greater than 1.8 V at a pH for application of polishing, and water. The abrasive grains are preferably composed of at least one substance selected from among silicon oxide, aluminum oxide, cerium oxide, zirconium oxide, titanium oxide, manganese oxide, silicon carbide, and silicon nitride. The oxidizing agent is preferably composed of at least one substance selected from among sodium persulfate, potassium persulfate, and ammonium persulfate. The polishing composition preferably has a pH equal to or less than 3.

Abstract: A polishing composition contains at least abrasive grains and water and is used in polishing an object to be polished. The abrasive grains are selected so as to satisfy the relationship X1×Y1?0 and the relationship X2×Y2>0, where X1 [mV] represents the zeta potential of the abrasive grains measured during polishing of the object by using the polishing composition, Y1 [mV] represents the zeta potential of the object measured during polishing of the object by using the polishing composition, X2 [mV] represents the zeta potential of the abrasive grains measured during washing of the object after polishing, and Y2 [mV] represents the zeta potential of the object measured during washing of the object after polishing. The abrasive grains are preferably of silicon oxide, aluminum oxide, cerium oxide, zirconium oxide, silicon carbide, or diamond. The object is preferably of a nickel-containing alloy, silicon oxide, or aluminum oxide.

Abstract: Provided is a polishing composition containing an abrasive and water. The abrasive content in the polishing composition is no less than 0.1% by mass. The abrasive contains zirconium oxide particles. The zirconium oxide particles have a specific surface area of from 1 to 15 m2/g. The zirconium oxide particles preferably have a purity of no less than 99% by mass. The polishing composition is used in, for example, polishing a hard and brittle material, such as sapphire, silicon nitride, silicon carbide, silicon oxide, glass, gallium nitride, gallium arsenide, indium arsenide, and indium phosphide.

Abstract: Provided is a polishing composition containing at least aluminum oxide abrasive grains and water, and having a pH of 8.5 or higher. The aluminum oxide abrasive grains have a specific surface area of 20 m2/g or less. It is preferable for the aluminum oxide abrasive grains to have an average secondary particle size of 0.1 ?m or more and 20 ?m or less. The polishing composition is used for polishing hard and brittle materials having a Vickers hardness of 1,500 Hv or higher, such as sapphire, silicon carbide, and gallium nitride.