Patents by Inventor Kazushi Higashi
Kazushi Higashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20070119905Abstract: Component 3 is pressed onto a circuit board 4 so that their respective metal interconnects 5, 6 are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle 14 holding the component 3. Friction is thereby generated between metal interconnects 5, 6 whereby the component 3 is bonded on circuit substrate. Suction nozzle 14 for handling components is made of stainless steel and has a working face 14a provided with a hardened layer 14b, or alternatively, suction nozzle 14 may have a suction head 14c having a working face 14a made of cemented carbide. Working face 14a of suction nozzle 14 is refined by polishing as required during the mounting operation.Type: ApplicationFiled: January 30, 2007Publication date: May 31, 2007Inventors: Kazushi Higashi, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi
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Patent number: 7219419Abstract: Component (3) is pressed onto a circuit board (4) so that their respective metal interconnects (5), (6) are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle (14) holding the component (3). Friction is thereby generated between metal interconnects (5), (6) whereby the component (3) is bonded on circuit substrate. Suction nozzle (14) for handling components is made of stainless steel and has a working face (14a) provided with a hardened layer (14b), or alternatively, suction nozzle (14) may have a suction head (14c) having a working face (14a) made of cemented carbide. Working face (14a) of suction nozzle (14) is refined by polishing as required during the mounting operation.Type: GrantFiled: February 28, 2003Date of Patent: May 22, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazushi Higashi, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi
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Publication number: 20070108634Abstract: A first container member (9, 109, 212) mounting an electronic device (71, 171, 261) thereon and a second container member (2, 102, 202) are bonded with an adhesive (3, 103) or a metal layer (103, 251). Thus an inner space (90, 190, 211) is formed and the electronic device can be closed in the inner space at a low temperature. In the case the adhesive is used, an exposed surface of the adhesive is coated with a metal film (4) to improve the closeness of the inner space. Further, an electronic device (261, 272) may be mounted on the second container member so as to increase the electronic device arrangement density in a packaged electronic device.Type: ApplicationFiled: December 2, 2004Publication date: May 17, 2007Inventors: Kazushi Higashi, Shinji Ishitani
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Patent number: 7071090Abstract: A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.Type: GrantFiled: March 8, 2005Date of Patent: July 4, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazushi Higashi, Norihito Tsukahara, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani
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Publication number: 20060081974Abstract: An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, amounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic part from the chamber to the mounting mechanism. After plasma cleaned, the substrate and the electronic part are swiftly conveyed to the mounting mechanism by the conveying robot. After the electronic part is mounted on the substrate by the mounting mechanism, the resultant combination of them is pulse heated. Therefore, the electronic part is appropriately mounted on the substrate in a state that those are exposed to the air. A part mounting mechanism is simplified.Type: ApplicationFiled: November 28, 2005Publication date: April 20, 2006Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Kazushi Higashi, Tatsuo Sasaoka, Satoshi Horie, Takashi Omura
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Publication number: 20060037997Abstract: The joining apparatus includes a suction nozzle for holding an electronic component, a board stage for holding a circuit board in opposition to the electronic component, and an excimer ultraviolet lamp placed at an irradiation position between the positioned electronic component and circuit board. In such a joining apparatus, ultraviolet irradiation to Au bumps of the electronic component and ultraviolet irradiation to board electrodes of the circuit board are performed concurrently by the excimer ultraviolet lamp to execute cleaning process of the two metallic portions. Thereafter, ultrasonic vibrations are imparted to the two metallic portions while those metallic portions are kept in contact with each other, by which metal joining between the two metallic portions is fulfilled.Type: ApplicationFiled: May 25, 2005Publication date: February 23, 2006Inventors: Kazushi Higashi, Tatsuo Sasaoka, Shinji Ishitani
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Patent number: 6996889Abstract: An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, a mounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic part from the chamber to the mounting mechanism. After plasma cleaned, the substrate and the electronic part are swiftly conveyed to the mounting mechanism by the conveying robot. After the electronic part is mounted on the substrate by the mounting mechanism, the resultant combination of them is pulse heated. Therefore, the electronic part is appropriately mounted on the substrate in a state that those are exposed to the air. A part mounting mechanism is simplified.Type: GrantFiled: July 25, 2003Date of Patent: February 14, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazushi Higashi, Tatsuo Sasaoka, Satoshi Horie, Takashi Omura
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Publication number: 20050191838Abstract: A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).Type: ApplicationFiled: April 26, 2005Publication date: September 1, 2005Inventors: Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama, Makoto Imanishi, Kazushi Higashi, Kenji Fukumoto, Hiroshi Wada
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Publication number: 20050146029Abstract: A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.Type: ApplicationFiled: March 8, 2005Publication date: July 7, 2005Inventors: Kazushi Higashi, Norihito Tsukahara, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani
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Patent number: 6910613Abstract: A preheat device (160) is provided to execute, before forming bumps (16) to electrode parts (15), a pre-formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps can be heated under a bonding strength improvement condition by a bonding stage (316) through controlling the heating by a controller (317).Type: GrantFiled: June 29, 2001Date of Patent: June 28, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama, Makoto Imanishi, Kazushi Higashi, Kenji Fukumoto, Hiroshi Wada
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Publication number: 20050104173Abstract: In a semiconductor device of the present invention, in order that the contact of electrodes formed on a film substrate with edge parts of a semiconductor element at the time such as when the semiconductor element is mounted thereon may be reliably prevented, in the semiconductor element mounted on at least one surface of the film substrate having the electrodes, an insulating protection part is formed at a desired position of the surface opposed to the electrodes, and the distance between the semiconductor element and the film substrate is set at not less than 10 ?m.Type: ApplicationFiled: September 21, 2004Publication date: May 19, 2005Inventors: Kazushi Higashi, Kouichi Yoshida, Shinji Ishitani, Daido Komyoji
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Patent number: 6894387Abstract: A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.Type: GrantFiled: January 25, 2001Date of Patent: May 17, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazushi Higashi, Norihito Tsukahara, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani
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Publication number: 20050001315Abstract: An integral type electronic device is formed from a first board and a second board by storing and holding electronic components in component storage parts of the first board, and then electrically connecting the second board to the electronic components. An arrangement accuracy of the electronic components is determined on a basis of an arrangement accuracy of the component storage parts, and the electronic components stored and held in the component storage parts are limited in motion.Type: ApplicationFiled: July 30, 2004Publication date: January 6, 2005Inventors: Kazushi Higashi, Hiroyuki Otani, Norihito Tsukahara
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Patent number: 6825055Abstract: An integral type electronic component is formed of a first board and a second board by storing and holding electronic components to component storage parts of the first board and electrically connecting the second board to the electronic components. An arrangement accuracy of the electronic components is determined on the basis of an arrangement accuracy of the component storage parts, and the electronic components stored in the component storage parts are limited in motion. The electronic components can be arranged highly accurately and simply at low costs in a short time in comparison with the conventional art by being simply inserted to the component storage parts.Type: GrantFiled: August 29, 2001Date of Patent: November 30, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazushi Higashi, Hiroyuki Otani, Norihito Tsukahara
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Publication number: 20040102030Abstract: A preheat device is installed, thereby executing before forming bumps to electrode parts a pre formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during a bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps formed can be heated under a bonding strength improvement condition by a bonding stage through controlling the heating by a controller.Type: ApplicationFiled: January 2, 2003Publication date: May 27, 2004Inventors: Shoriki Narita, Koichi Yoshida, Masahiko Ikeya, Takaharu Mae, Shinji Kanayama, Makoto Imanishi, Kazushi Higashi, Kenji Fukumoto, Hiroshi Wada
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Publication number: 20040022037Abstract: An electronic part mounting apparatus includes a chamber for cleaning a substrate and an electronic part by plasma, a mounting mechanism for mounting the electronic part on the electronic part, and a conveying robot for conveying the substrate and the electronic part from the chamber to the mounting mechanism. After plasma cleaned, the substrate and the electronic part are swiftly conveyed to the mounting mechanism by the conveying robot. After the electronic part is mounted on the substrate by the mounting mechanism, the resultant combination of them is pulse heated. Therefore, the electronic part is appropriately mounted on the substrate in a state that those are exposed to the air. A part mounting mechanism is simplified.Type: ApplicationFiled: July 25, 2003Publication date: February 5, 2004Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Kazushi Higashi, Tatsuo Sasaoka, Satoshi Horie, Takashi Omura
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Publication number: 20030205607Abstract: The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.Type: ApplicationFiled: April 21, 2003Publication date: November 6, 2003Inventors: Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa
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Publication number: 20030150108Abstract: Component 3 is pressed onto a circuit board 4 so that their respective metal interconnects 5, 6 are in close contact with each other, and ultrasonic vibration is applied to the suction nozzle 14 holding the component 3. Friction is thereby generated between metal interconnects 5, 6 whereby the component 3 is bonded on circuit substrate. Suction nozzle 14 for handling components is made of stainless steel and has a working face 14a provided with a hardened layer 14b, or alternatively, suction nozzle 14 may have a suction head 14c having a working face 14a made of cemented carbide. Working face 14a of suction nozzle 14 is refined by polishing as required during the mounting operation.Type: ApplicationFiled: February 28, 2003Publication date: August 14, 2003Inventors: Kazushi Higashi, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi
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Patent number: 6590199Abstract: An optical information processing apparatus for use in optical computing, optical image processing, and the like and, more particularly, a small-sized integrated optical information processing apparatus having multiple arrays, a high pixel density and a large number of pixels. The optical information processing apparatus includes a light emitting device array 11 in which light emitting devices 6 are inserted in through holes provided in a silicon substrate for receiving light emitting devices, a semiconductor arithmetic circuit chip 17, and a glass substrate 16 provided with diffraction type optical devices. Thus, a small-sized optical information processing apparatus having multiple arrays and a high pixel density can be realized.Type: GrantFiled: December 28, 2000Date of Patent: July 8, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideo Kawai, Kazushi Higashi
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Patent number: 6572005Abstract: The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.Type: GrantFiled: September 28, 2001Date of Patent: June 3, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa