Patents by Inventor Kazushi Higashi
Kazushi Higashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6506222Abstract: A divided component separated individually beforehand is supplied in a state while stored in a storage body, taken outside by a take-out and storage unit, and a component is mounted on the divided component by a mounting unit, and thereby a divided component with the component is produced. A plurality of the produced divided components with the components mounted thereon are collected into the storage body. Since the component is mounted on the already divided component, as compared with the prior art, no trouble is given rise to at a junction part between the divided component and the component, thus contributing to an improvement in product quality.Type: GrantFiled: June 5, 2001Date of Patent: January 14, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Takashi Shimizu, Shinji Kanayama, Kenji Takahashi, Kazushi Higashi, Satoshi Shida, Naoto Hosotani
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Patent number: 6481616Abstract: To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.Type: GrantFiled: October 17, 2001Date of Patent: November 19, 2002Assignee: Matsushita Electric Industrial Co. Ltd.Inventors: Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Takahiro Yonezawa, Kazushi Higashi, Koichi Yoshida, Kouji Hirotani
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Patent number: 6467670Abstract: Sealant 11 is supplied in advance to one or both of the electrical bonding areas 5,6 of the component 3 and the mounting surface 4, and as the component 3 is brought in contact with the mounting surface 4, the sealant 11 is compressed and filled therebetween in a required area. At the same time ultrasonic vibration is applied to the component 3 for generating friction between the electrical bonding areas 5, 6 of the component 3 and the mounting surface 4 in tight contact with each other, so that both electrical bonding areas 5, 6 are melted and ultrasonically bonded together, and thereby the component 3 is mounted on the mounting surface 4.Type: GrantFiled: January 8, 2001Date of Patent: October 22, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazushi Higashi, Hiroyuki Otani, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi
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Patent number: 6439447Abstract: When electrodes on an electronic component and electrode portions on a circuit board are joined via bumps with the electronic component and the circuit board vibrated respectively, a vibration damping detect device and a deciding device detect damping of the vibration caused by a progress of joining between the bumps and the electrode portions, and then determine a good or defective of the joining on a basis of the damping of the vibration. Further, regarding an impedance of an ultrasonic oscillator, a movement amount of a nozzle, or a current supplying to a VCM, these waveforms during the joining are compared with waveforms of good joining thereof and then the good or defective is determined. According to the above constructions, the good or defective of the joining between the electronic component and the circuit board can be determined during the joining. Further, when a joining state becomes wrong during the joining, the joining state can be changed.Type: GrantFiled: February 28, 2001Date of Patent: August 27, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa, Makoto Akita, Kenji Okamoto, Shinzo Eguchi, Yasuhiro Kametani
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Publication number: 20020030087Abstract: To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.Type: ApplicationFiled: October 17, 2001Publication date: March 14, 2002Inventors: Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Takahiro Yonezawa, Kazushi Higashi, Koichi Yoshida, Kouji Hirotani
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Publication number: 20020028595Abstract: An integral type electronic component is formed of a first board and a second board by storing and holding electronic components to component storage parts of the first board and electrically connecting the second board to the electronic components. An arrangement accuracy of the electronic components is determined on the basis of an arrangement accuracy of the component storage parts, and the electronic components stored in the component storage parts are limited in motion. The electronic components can be arranged highly accurately and simply at low costs in a short time in comparison with the conventional art by being simply inserted to the component storage parts.Type: ApplicationFiled: August 29, 2001Publication date: March 7, 2002Inventors: Kazushi Higashi, Hiroyuki Otani, Norihito Tsukahara
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Publication number: 20020008132Abstract: The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.Type: ApplicationFiled: September 28, 2001Publication date: January 24, 2002Inventors: Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa
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Patent number: 6332268Abstract: An IC chip (2) can be provided to a pre-mount process while being held on a tape-shaped supporting member (5), without being taken out of the tape-shaped supporting member (5).Type: GrantFiled: March 16, 1999Date of Patent: December 25, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Makoto Imanishi, Yoshifumi Kitayama, Koichi Kumagai, Shinji Kanayama, Yoshinori Wada, Takahiro Yonezawa, Kazushi Higashi
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Patent number: 6328196Abstract: To eliminate breakage of electronic parts or defective bonding, and enhance reliability of electronic parts, in regulation of electronic parts in bump bonding device. A bump bonding device comprising a stage 1 for mounting and heating an electronic part, and a position regulating device including a rotatable regulating plate 2 having a side for positioning the electronic part, a plate 4 having a side for positioning the electronic part in collaboration with the regulating plate, and a regulating spring 5 for applying a regulating force to the regulating plate in order to press the electronic part to the plate 4.Type: GrantFiled: December 17, 1998Date of Patent: December 11, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Makoto Imanishi, Akihiro Yamamoto, Hiroyuki Otani, Shinzo Eguchi, Takahiro Yonezawa, Kazushi Higashi, Koichi Yoshida, Kouji Hirotani
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Patent number: 6321973Abstract: The present invention provides a bump-joining apparatus, a bump-joining method, and a semiconductor component-manufacturing apparatus whereby bumps and electrode portions of circuit board are perfectly joined, with higher join strength than in the conventional art. The apparatus includes a vibration generation device, a pressing device and a control unit, wherein bumps are pressed to electrode portions of a circuit board and vibrated with ultrasonic waves after reaching an initial contact area before reaching a join-completed-contact area at a completion of the joining, so that the bumps are more perfectly joined to the electrode portion than in the conventional art which vibrates the bump only after reaching the join-completed-contact area. Larger join strength is achieved than in the conventional art.Type: GrantFiled: July 15, 1999Date of Patent: November 27, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa
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Publication number: 20010026012Abstract: A divided component separated individually beforehand is supplied in a state while stored in a storage body, taken outside by a take-out and storage unit, and a component is mounted on the divided component by a mounting unit, and thereby a divided component with the component is produced. A plurality of the produced divided components with the components mounted thereon are collected into the storage body. Since the component is mounted on the already divided component, as compared with the prior art, no trouble is given rise to at a junction part between the divided component and the component, thus contributing to an improvement in product quality.Type: ApplicationFiled: June 5, 2001Publication date: October 4, 2001Inventors: Shozo Minamitani, Takashi Shimizu, Shinji Kanayama, Kenji Takahashi, Kazushi Higashi, Satoshi Shida, Naoto Hosotani
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Patent number: 6264704Abstract: A divided component separated individually beforehand is supplied in a state while stored in a storage body, taken outside by a take-out and storage unit, and a component is mounted on the divided component by a mounting unit, and thereby a divided component with the component is produced. A plurality of the produced divided components with the components mounted thereon are collected into the storage body.Type: GrantFiled: March 12, 1999Date of Patent: July 24, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Shozo Minamitani, Takashi Shimizu, Shinji Kanayama, Kenji Takahashi, Kazushi Higashi, Satoshi Shida, Naoto Hosotani
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Publication number: 20010006219Abstract: An optical information processing apparatus for use in optical computing, optical image processing, and the like and, more particularly, a small-sized integrated optical information processing apparatus having multiple arrays, a high pixel density and a large number of pixels. The optical information processing apparatus includes a light emitting device array 11 in which light emitting devices 6 are inserted in through holes provided in a silicon substrate for receiving light emitting devices, a semiconductor arithmetic circuit chip 17, and a glass substrate 16 provided with diffraction type optical devices. Thus, a small-sized optical information processing apparatus having multiple arrays and a high pixel density can be realized.Type: ApplicationFiled: December 28, 2000Publication date: July 5, 2001Inventors: Hideo Kawai, Kazushi Higashi
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Publication number: 20010005054Abstract: A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.Type: ApplicationFiled: January 25, 2001Publication date: June 28, 2001Inventors: Kazushi Higashi, Norihito Tsukahara, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani
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Publication number: 20010001469Abstract: Sealant 11 is supplied in advance to one or both of the electrical bonding areas 5,6 of the component 3 and the mounting surface 4, and as the component 3 is brought in contact with the mounting surface 4, the sealant 11 is compressed and filled therebetween in a required area. At the same time ultrasonic vibration is applied to the component 3 for generating friction between the electrical bonding areas 5, 6 of the component 3 and the mounting surface 4 in tight contact with each other, so that both electrical bonding areas 5, 6 are melted and ultrasonically bonded together, and thereby the component 3 is mounted on the mounting surface 4.Type: ApplicationFiled: January 8, 2001Publication date: May 24, 2001Inventors: Kazushi Higashi, Hiroyuki Otani, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi
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Patent number: 6207549Abstract: A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.Type: GrantFiled: September 30, 1997Date of Patent: March 27, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazushi Higashi, Norihito Tsukahara, Takahiro Yonezawa, Yoshihiko Yagi, Yoshifumi Kitayama, Hiroyuki Otani
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Patent number: 6193136Abstract: Sealant 11 is supplied in advance to one or both of the electrical bonding areas 5,6 of the component 3 and the mounting surface 4, and as the component 3 is brought in contact with the mounting surface 4, the sealant 11 is compressed and filled therebetween in a required area. At the same time ultrasonic vibration is applied to the component 3 for generating friction between the electrical bonding areas 5, 6 of the component 3 and the mounting surface 4 in tight contact with each other, so that both electrical bonding areas 5, 6 are melted and ultrasonically bonded together, and thereby the component 3 is mounted on the mounting surface 4.Type: GrantFiled: August 13, 1999Date of Patent: February 27, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazushi Higashi, Hiroyuki Otani, Shozo Minamitani, Shinji Kanayama, Kenji Takahashi
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Patent number: 5686353Abstract: An electrode terminal (5) provided on a surface of a semiconductor chip (4) has a square shape in plane view. Further, the projecting apex portion (8a) of a bump (8) provided on the electrode terminal (5) orients to a corner portion (5a) of the electrode terminal (5). Hereupon, a gold ball (2a) formed by melting the lower end portion of a gold wire (2) supplied through a capillary (1) is joined to the electrode terminal (5), and then the capillary (1) is moved in the direction of a diagonal line of the square electrode (5). Thus, the main portion of the gold wire (2) is separated from the gold ball (2a) so that the bump (8) is formed.Type: GrantFiled: December 21, 1995Date of Patent: November 11, 1997Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yoshihiko Yagi, Kazushi Higashi, Norihito Tsukahara, Koichi Kumagai, Takahiro Yonezawa