Abstract: The present invention addresses the problem of providing a photosensitive resin composition which exhibits good imidization rate even in cases where the photosensitive resin composition is fired at a temperature of 200° C. or less, while having high pattern processability, and a cured film of which exhibits high long-term reliability if used in an organic EL display device. In order to solve the above-described problem, a photosensitive resin composition according to the present invention contains (a) a polyimide precursor, (b) a phenolic compound having an electron-withdrawing group and (c) a photosensitive compound; and the polyimide precursor (a) has a residue which is derived from a diamine that has an ionization potential of less than 7.1 eV.

Abstract: The present invention relates to a photosensitive resin composition having high sensitivity, high bending resistance for the cured film, and high long-term reliability for an organic EL display device in which the cured film is used. The present invention is a photosensitive resin composition containing an alkali-soluble resin (a), a phenolic resin (b) having a halogen atom, and a photosensitive compound (c).

Abstract: The present invention provides a negative-type photosensitive resin composition capable of obtaining a cured film suppressing generation of development residues caused by a pigment and having high sensitivity and excellent heat resistance and light blocking capability. A negative-type photosensitive resin composition contains an alkali-soluble resin (A), a radical-polymerizable compound (B), a photopolymerization initiator (C1), and a pigment (D1).

Abstract: A resin composition which is configured such that if the resin composition is formed into a resin composition film that has a thickness of 3.0 ?m after a heat treatment at a temperature within the range of 200-350° C., the resin composition film forms a heat-resistant resin film that has a light transmittance of 50% or more at a wavelength of 365-436 nm before the heat treatment, while having a light transmittance of 10% or less at a wavelength of 365-436 nm after the heat treatment. Provided is a resin composition having a function of absorbing ultraviolet light and visible light in a short wavelength range, which is suitable for the formation of a planarization film, an insulating layer and a partition wall that are used for organic light emitting devices or display devices.

Abstract: An object of the present invention is to provide an organic EL display device which does not undergo the decrease in luminance or pixel shrinkage and has excellent long-term reliability. The present invention is an organic EL display device constituting a cured product of a photosensitive resin composition containing an alkali-soluble resin (A) and a naphthoquinone diazide sulfonic acid ester compound (B), wherein an intensity ratio I(S)/I(TOTAL) is 0.0001 or more and 0.008 or less, where I(S) is a negative secondary ion intensity of sulfur, and I(TOTAL) is a sum total of negative secondary ion intensities of carbon, oxygen, fluorine, silicon and sulfur obtained by time-of-flight secondary ion mass spectrometry of the cured product. Alternatively, the present invention is a method for producing the cured product.

Abstract: The invention aims to provide a cured film that is high in sensitivity, able to form a pattern having a small-tapered shape after a development step and after a heat curing step, helpful to depress the difference in the width of patterned openings between before and after the heat curing step, and high in light-shielding capability and also aims to provide a negative type photosensitive resin composition that serves for the production thereof.

Abstract: The present invention provides a resin composition which is highly sensitive and exhibits high chemical resistance even in the case of being baked at a low temperature of 250° C. or less and can suppress the generation of outgas after curing. The present invention is a resin composition which contains (a) an alkali-soluble resin containing polyimide, polybenzoxazole, polyamide-imide, a precursor of any one of these compounds and/or a copolymer of these compounds and (b) an alkali-soluble resin having a monovalent or divalent group represented by the following general formula (1) in a structural unit and in which the modification rate of a phenolic hydroxyl group in the alkali-soluble resin (b) is 5% to 50%. (In general formula (1), O represents an oxygen atom. R1 represents a hydrogen atom or a hydrocarbon group which has 1 to 20 carbon atoms and may be substituted and R2 represents an alkyl group having 1 to 5 carbon atoms. s and t each independently represent an integer from 0 to 3.

Abstract: An organic EL display device having excellent light-emitting reliability while it has pixel division layer (8) and/or planarization layer (4) having excellent optical properties is provided.

Abstract: The present invention addresses the problem of providing a photosensitive resin composition which exhibits good imidization rate even in cases where the photosensitive resin composition is fired at a temperature of 200° C. or less, while having high pattern processability, and a cured film of which exhibits high long-term reliability if used in an organic EL display device. In order to solve the above-described problem, a photosensitive resin composition according to the present invention contains (a) a polyimide precursor, (b) a phenolic compound having an electron-withdrawing group and (c) a photosensitive compound; and the polyimide precursor (a) has a residue which is derived from a diamine that has an ionization potential of less than 7.1 eV.

Abstract: The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate.

Abstract: The present invention relates to a photosensitive resin composition having high sensitivity, high bending resistance for the cured film, and high long-term reliability for an organic EL display device in which the cured film is used. The present invention is a photosensitive resin composition containing an alkali-soluble resin (a), a phenolic resin (b) having a halogen atom, and a photosensitive compound (c).

Abstract: A photosensitive composition containing at least one compound selected from the group of the following (a-1) to (a-3) and containing (b) a photosensitizer: (a-1) an epoxy compound having a C9-C19 long-chain alkyl group, (a-2) a resin having a structure represented by the following general formula (1), and (a-3) a resin having a structure represented by the following general formula (2). A photosensitive composition capable of forming a pixel division layer that has high flexibility and affords excellent light emission reliability to an organic EL display device is provided.

Abstract: The present invention provides a resin composition which is highly sensitive and exhibits high chemical resistance even in the case of being baked at a low temperature of 250° C. or less and can suppress the generation of outgas after curing. The present invention is a resin composition which contains (a) an alkali-soluble resin containing polyimide, polybenzoxazole, polyamide-imide, a precursor of any one of these compounds and/or a copolymer of these compounds and (b) an alkali-soluble resin having a monovalent or divalent group represented by the following general formula (1) in a structural unit and in which the modification rate of a phenolic hydroxyl group in the alkali-soluble resin (b) is 5% to 50%. (In general formula (1), O represents an oxygen atom. R1 represents a hydrogen atom or a hydrocarbon group which has 1 to 20 carbon atoms and may be substituted and R2 represents an alkyl group having 1 to 5 carbon atoms. s and t each independently represent an integer from 0 to 3.

Abstract: An object of the invention is to provide a cured film which is high in sensitivity, capable of forming a pattern in a low-taper shape after development, capable of the change in pattern opening width between before and after thermal curing, an excellent in light-blocking property, and a negative photosensitive resin composition that forms the film. The negative photosensitive resin composition contains an (A) alkali-soluble resin, a (C1) photo initiator, and a (Da) black colorant, where the (A) alkali-soluble resin contains a (A1) first resin including one or more selected from the group consisting of a (A1-1) polyimide, a (A1-2) polyimide precursor, a (A1-3) polybenzoxazole, and a (A1-4) polybenzoxazole precursor, and has a structural unit having a fluorine atom at a specific ratio, and the (C1) photo initiator contains an (C1-1) oxime ester-based photo initiator that has a specific structure.

Abstract: A photosensitive resin composition including: an alkali-soluble resin (A); a photo acid generator (B); a thermal cross-linking agent (C); a phenolic antioxidant (D); and a compound (E2) having a phenolic hydroxyl group indicating an acid dissociation constant pKa of 6.0 to 9.5 at 25° C.; or a photosensitive resin composition including: an alkali-soluble resin (A); a photo acid generator (B); a thermal cross-linking agent (C); a phenolic antioxidant (D); and a compound (E) having a phenolic hydroxyl group other than (D); wherein the compound (E) having a phenolic hydroxyl group other than (D) contains a compound (E1) having an electron-withdrawing group and a phenolic hydroxyl group in the molecule. Provided is a photosensitive resin composition whose cured film has high bending resistance even after a reliability test, and also has excellent chemical resistance.

Abstract: The organic EL display device includes at least a transparent electrode, an organic EL layer, and a non-transparent electrode in this order and further includes a black insulating layer, and the non-transparent electrode has a reflectance of 25%±20%.

Abstract: The present invention provides a negative type photosensitive resin composition having high sensitivity, excellent halftone characteristics, capability to form a small tapered pattern shape, and alkali-developability. The negative type photosensitive resin composition includes, as an alkali-soluble resin (A), at least a weakly acidic group-containing resin (A1) and an unsaturated group-containing resin (A2), the weakly acidic group-containing resin (A1) containing an acidic group having an acid dissociation constant in the range of 13.0 to 23.0 in dimethyl sulfoxide, and the unsaturated group-containing resin (A2) containing an ethylenically unsaturated double bond group.

Abstract: The purpose is to provide an organic EL display device which has good sensitivity and is free from the occurrence of luminance decrease or pixel shrinkage, thereby having excellent long-term reliability. In order to achieve the above-described purpose, provided is the following configuration. Namely, an organic EL display device wherein an insulating layer formed on a first electrode is a cured film obtained by curing a photosensitive resin composition; and the residual amount of acid anhydrides contained in the cured film is from 0.003 to 0.04 (inclusive) when the residual amount of aromatic rings contained in the cured film is taken as 1 (the reference value).

Abstract: The invention provides a cured film and a positive type photosensitive resin composition unlikely to cause a decrease in light emission luminance or shrinkage of pixels and high in long term reliability. [Solution] The invention provides a cured film comprising a cured product of a photosensitive resin composition including an alkali-soluble resin (a), a photoacid generating agent (b), at least one compound (c) selected from the group consisting of cyclic amides, cyclic ureas, and derivatives thereof, and a thermal crosslinking agent (d), the thermal crosslinking agent (d) containing an epoxy compound, oxetanyl compound, isocyanate compound, acidic group-containing alkoxymethyl compound, and/or acidic group-containing methylol compound, and the total content of the compound (c) in the cured film being 0.005 mass % or more and 5 mass % or less.

Abstract: To provide an alkaline developable negative-type photosensitive resin composition from which a cured film that has a high-resolution and low-taper pattern shape and that are excellent in heat resistance and light blocking property can be obtained. A negative-type photosensitive resin composition is characterized by containing an (A1) first resin, a (A2) second resin, a (C) photopolymerization initiator, and a (D) coloring agent, wherein the (A1) first resin is an (A1-1) polyimide and/or an (A1-2) polybenzo-oxazole, and wherein the (A2) second resin is one or more species selected from a (A2-1) polyimide precursor, a (A2-2) polybenzo-oxazole precursor, a (A2-3) polysiloxane, a (A2-4) cardo based resin, and an (A2-5) acrylic resin, and wherein a content ratio of the (A1) first resin in a total of 100 mass % of the (A1) first resin and the (A2) second resin is within the range of 25 to 90 mass %.