Abstract: A plasma processing apparatus includes a flow splitter for dividing a common gas into two common gas streams of common gas branch lines. A central introduction portion connected to one of the common gas branch lines supplies a common gas to a central portion of a substrate to be processed. A peripheral introducing portion connected to the other one of the common gas branch lines supplies the common gas to a peripheral portion of the substrate. The peripheral introducing portion has peripheral inlets arranged about a circumferential region above the substrate. An additive gas line is connected to an additive gas source to add an additive gas to at least one of the common gas branch lines. In addition, an electron temperature of a plasma in a region where the peripheral inlets are disposed is lower than that in a region where the introduction portion is disposed.

Abstract: A dielectric plate 20 is provided at a ceiling surface facing a susceptor 3 of a processing chamber 2, and a slot antenna 30 having a multiple number of microwave transmissive slots 33 is provided on a top surface of the dielectric plate 20. A protrusion member 21 configured as a separate member from the dielectric plate 20 is provided on a peripheral portion of a bottom surface of the dielectric plate 20 so as to prevent an abnormal electric discharge. Electric field intensity in the vicinity of the dielectric plate 20 is controlled by adjusting a gap between an outer peripheral surface 22 of a cylindrical part of the protrusion member 21 and an inner peripheral surface 5a of a sidewall of the processing chamber 2 or by adjusting a thickness of the cylindrical part of the protrusion member 21.

Abstract: A plasma processing apparatus includes a processing container in which a plasma processing is performed on a substrate to be processed, a holding stage which is disposed in the processing container and holds thereon the substrate to be processed, a dielectric plate which is provided at a location facing the holding stage and transmits a microwave into the processing container, and a reactive gas supply unit which supplies a reactive gas for plasma processing toward the central region of the substrate to be processed held by the holding stage. Here, the reactive gas supply unit includes an injector base, which is disposed at a location more recessed inside the dielectric plate than a wall surface of the dielectric plate facing the holding stage. A supply hole, which supplies a reactive gas for plasma processing into the processing container, is formed in the injector base.

Abstract: A process monitoring device 11 includes a light source unit that outputs light; a light detection unit that detects an intensity of light; a first optical path 21 that guides the light outputted from the light source unit to a wafer W and guides reflection light from the wafer W to the light detection unit; a second optical path that has a light propagation characteristic equivalent to that of the first optical path 21 and guides the light outputted from the light source unit to the light detection unit without allowing the light to pass the wafer W; and a controller 17 that corrects intensity information of the light detected by the light detection unit via the first optical path 21 based on intensity information of the light detected by the light detection unit via the second optical path, and analyzes a structure of the wafer W.

Abstract: Provided is a plasma processing apparatus featuring highly improved plasma ignition property and ignition stability by defining a positional relationship between a dielectric and the slots. A plasma processing apparatus 11 includes a processing chamber 12 having a top opening; a dielectric 15 which has inclined surfaces 16a and 16b on a bottom surface thereof so that a thickness dimension is successively varied, and is disposed so as to close the top opening of the processing chamber 12; and an antenna 24disposed on a top surface of the dielectric 15, for supplying microwave to the dielectric 15, thereby generating plasma at the bottom surface of the dielectric 15. Further, the antenna 24 is provided with a plurality of slots 25positioned uprightly above the inclined surfaces 16a and 16b.

Abstract: A plasma processing apparatus includes a processing container in which a plasma processing is performed on a substrate to be processed, a holding stage which is disposed in the processing container and holds thereon the substrate to be processed, a dielectric plate which is provided at a location facing the holding stage and transmits a microwave into the processing container, and a reactive gas supply unit which supplies a reactive gas for plasma processing toward the central region of the substrate to be processed held by the holding stage. Here, the reactive gas supply unit includes an injector base, which is disposed at a location more recessed inside the dielectric plate than a wall surface of the dielectric plate facing the holding stage. A supply hole, which supplies a reactive gas for plasma processing into the processing container, is formed in the injector base.

Abstract: A dielectric board (20) is arranged on a ceiling surface, which is of a processing container (2) and faces a susceptor (3), a slot antenna (30) having a plurality of slots (33) which pass through microwaves is arranged on an upper surface of the dielectric board (20), and a protruding member (21), which is composed of a member different from the dielectric board (20) and eliminates abnormal discharge, is provided on a lower peripheral section of the dielectric board (20). A field strength at the peripheral section of the dielectric board (20) is controlled by adjusting a space between an outer circumference surface (22) of a cylindrical section of the protruding member (21) and a side wall inner circumference surface (5a) of the processing container (2) or adjusting the thickness of the cylindrical section of the protruding member (21).

Abstract: A solid electrolytic capacitor is provided in which volume efficiency of its capacitor element is improved. A converting substrate having an anode terminal forming portion and cathode terminal portion obtained by forming notches on faces exposed on outside faces of the anode and cathode portions and performing plating in the notches in portions in which the anode and cathode portions of a lower-face electrode type solid electrolytic capacitor is connected to the capacitor element and, after a sheathing resin is formed therein, the sheathed portion and converting substrate are cut along cutting planes to form fillet forming faces on the outside faces of the anode portion and cathode portion of the lower-face electrode type solid electrolytic capacitor.

Abstract: Provided is a plasma processing apparatus featuring highly improved plasma ignition property and ignition stability by defining a positional relationship between a dielectric and the slots. A plasma processing apparatus 11 includes a processing chamber 12 having a top opening; a dielectric 15 which has inclined surfaces 16a and 16b on a bottom surface thereof so that a thickness dimension is successively varied, and is disposed so as to close the top opening of the processing chamber 12; and an antenna 24 disposed on a top surface of the dielectric 15, for supplying microwave to the dielectric 15, thereby generating plasma at the bottom surface of the dielectric 15. Further, the antenna 24 is provided with a plurality of slots 25 positioned uprightly above the inclined surfaces 16a and 16b.

Abstract: A solid electrolytic capacitor is provided in which volume efficiency of its capacitor element is improved. A converting substrate having an anode terminal forming portion and cathode terminal portion obtained by forming notches on faces exposed on outside faces of the anode and cathode portions and performing plating in the notches in portions in which the anode and cathode portions of a lower-face electrode type solid electrolytic capacitor is connected to the capacitor element and, after a sheathing resin is formed therein, the sheathed portion and converting substrate are cut along cutting planes to form fillet forming faces on the outside faces of the anode portion and cathode portion of the lower-face electrode type solid electrolytic capacitor.

Abstract: In order to provide a current fuse with high solderability without containing harmful materials, solder chips containing 30 to 60 percent by weight of zinc, 0.1 to 2 percent by weight of copper, 0.1 to 1 percent by weight of nickel, and the remainder percent by weight being tin, or further containing 0.01 to 0.5 percent by weight of aluminum are inserted into the interior of the electrodes before pressing the electrodes into the ends of the substrate of the fuse, the exterior of the electrodes is heated to melt the solder chips, thereby connecting between the electrodes and the fuse wire.

Abstract: A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liquid phase temperature of 260 degrees C. or greater, and contains 30 to 70 weight percent zinc, 5 weight percent or less nickel, and the remaining weight percent tin. Moreover, a joint is manufactured using these lead-free solders. As a result, a lead-free solder and a lead-free joint having excellent electrical characteristics but not including harmful substances, can be provided.

Abstract: In order to provide a current fuse with high solderability without containing harmful materials, solder chips containing 30 to 60 percent by weight of zinc, 0.1 to 2 percent by weight of copper, 0.1 to 1 percent by weight of nickel, and the remainder percent by weight being tin, or further containing 0.01 to 0.5 percent by weight of aluminum are inserted into the interior of the electrodes before pressing the electrodes into the ends of the substrate of the fuse, the exterior of the electrodes is heated to melt the solder chips, thereby connecting between the electrodes and the fuse wire.

Abstract: In order to provide a current fuse with high solderability without containing harmful materials, solder chips containing 30 to 60 percent by weight of zinc, 0.1 to 2 percent by weight of copper, 0.1 to 1 percent by weight of nickel, and the remainder percent by weight being tin, or further containing 0.01 to 0.5 percent by weight of aluminum are inserted into the interior of the electrodes before pressing the electrodes into the ends of the substrate of the fuse, the exterior of the electrodes is heated to melt the solder chips, thereby connecting between the electrodes and the fuse wire.

Abstract: A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liquid phase temperature of 260 degrees C. or greater, and contains 30 to 70 weight percent zinc, 5 weight percent or less nickel, and the remaining weight percent tin. Moreover, a joint is manufactured using these lead-free solders. As a result, a lead-free solder and a lead-free joint having excellent electrical characteristics but not including harmful substances, can be provided.

Abstract: A power supply unit includes a battery, a motor which is driven by the battery, an electric power converting device which is provided between the battery and the motor, a simulated electric leak generating device which generates an electric leak state between the battery and a vehicle body, and an electric leak detecting device which detects a simulated electric leak. A diagnostic system which performs a diagnosis of operating performance of the electric leak detecting device includes an opening/closing device which connects/disconnects the electric power converting device to/from the battery, and an opening/closing detecting device which detects opening/closing of the opening/closing device and which outputs a result of detection to the simulated electric leak generating device and the electric leak detecting device.

Abstract: In order to provide a current fuse with high solderability without containing harmful materials, solder chips containing 30 to 60 percent by weight of zinc, 0.1 to 2 percent by weight of copper, 0.1 to 1 percent by weight of nickel, and the remainder percent by weight being tin, or further containing 0.01 to 0.5 percent by weight of aluminum are inserted into the interior of the electrodes before pressing the electrodes into the ends of the substrate of the fuse, the exterior of the electrodes is heated to melt the solder chips, thereby connecting between the electrodes and the fuse wire.

Abstract: A power supply unit includes a battery, a motor which is driven by the battery, an electric power converting device which is provided between the battery and the motor, a simulated electric leak generating device which generates an electric leak state between the battery and a vehicle body, and an electric leak detecting device which detects a simulated electric leak. A diagnostic system which performs a diagnosis of operating performance of the electric leak detecting device includes an opening/closing device which connects/disconnects the electric power converting device to/from the battery, and an opening/closing detecting device which detects opening/closing of the opening/closing device and which outputs a result of detection to the simulated electric leak generating device and the electric leak detecting device.

Abstract: The invention includes a process which provides a projection system which projects an image of a predetermined pattern formed on a reticle to a photosensitive substrate; a setting process which sets a correction member which corrects residual aberration in the projection system at a predetermined position between a reticle setting position where the reticle is arranged and a substrate setting position where the photosensitive substrate is set; and a process which corrects degradation of optical characteristics of the projection system caused by setting the correction member at the predetermined position. Furthermore, the correction process includes a first adjusting process which adjusts at least one of the reticle setting position and the substrate setting position.

Abstract: A condom disperses local tightening force at the opening end portion and maintains wind-up property. Further, it enables the drug to be automatically applied when it is being used to effectively prevent infection of diseases. The condom has a sperm reservoir at an end portion thereof and extends in a cylindrical form, wherein an open end portion includes elastic annular trapezoidal portions in cross section with notch and an elastic annular end with a hollow end portion. The condom may have sol type active drug in the porous hollow end portion, so that said drug is applied to the outer surface of the cylindrical portion when the condom is used.