Patents by Inventor Ke-Hung Chen

Ke-Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTI-CHIP STRUCTURE AND METHOD OF ASSEMBLING CHIPS
    Publication number: 20060220259
    Abstract: A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.
    Type: Application
    Filed: January 24, 2006
    Publication date: October 5, 2006
    Inventors: Ke-Hung Chen, Shih-Hsiung Lin, Mou-Shiung Lin