Abstract: An electronic assembly includes a Light Emitting Diode (LED) and a substrate. The LED has a solderable surface other than the contacts. The substrate has an opening. The solderable surface is mounted substantially over the opening. When the opening is filled with solder, the solderable surface is metallically bonded with the solder in the opening.

Abstract: A lighting apparatus having wavelength-converting materials formed in a carrier layer is disclosed. In one embodiment, the lighting apparatus has a light source attached to a substrate that is assembled in a housing. The light source is configured to emit a substantially narrow band light that is transformed into broad-spectrum white light by the wavelength-converting materials positioned on the carrier layer. The wavelength-converting materials and the carrier layer are distanced away from the light source, such that the carrier layer is thermally isolated from the light source.

Abstract: A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.

Abstract: A lighting apparatus having wavelength-converting materials formed in a carrier layer is disclosed. In one embodiment, the lighting apparatus has a light source attached to a substrate that is assembled in a housing. The light source is configured to emit a substantially narrow band light that is transformed into broad-spectrum white light by the wavelength-converting materials positioned on the carrier layer. The wavelength-converting materials and the carrier layer are distanced away from the light source, such that the carrier layer is thermally isolated from the light source.

Abstract: Light sources are disclosed herein. One embodiment comprises a substrate having a first surface and a second surface located opposite the first surface. At least one first electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. At least one second electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. A light emitter is affixed to the first surface of the substrate in an area not covered by either of the at least one first electrically conductive layer or the at least one second electrically conductive layer. The substrate may be thinner in the area where the light emitter is affixed than in the areas where the first and second electrically conductive layers are affixed. A heat sink may be attached to the second surface of the substrate.

Abstract: Light sources are disclosed herein. An embodiment of a light sources comprises a substrate having a first surface and a second surface located opposite the first surface. At least one first electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. At least one second electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. A light emitter is affixed to the first surface of the substrate in an area not covered by either of the at least one first electrically conductive layer or the at least one second electrically conductive layer.

Abstract: A device and method for emitting composite output light uses multiple wavelength-conversion mechanisms to convert the original light generated by a light source of the device into longer wavelength light to produce the composite output light. One of the wavelength-conversion mechanisms of the device is a fluorescent substrate of the light source that converts the original light into first converted light. Another wavelength-conversion mechanism of the device is a wavelength-conversion region optically coupled to the light source that converts the original light into second converted light. The original light, the first converted light and the second converted light are emitted from the device as components of the composite output light.

Abstract: A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive edge interconnecting elements.

Abstract: Light sources are disclosed herein. An embodiment of a light sources comprises a substrate having a first surface and a second surface located opposite the first surface. At least one first electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. At least one second electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. A light emitter is affixed to the first surface of the substrate in an area not covered by either of the at least one first electrically conductive layer or the at least one second electrically conductive layer.

Abstract: Light sources are disclosed herein. One embodiment comprises a substrate having a first surface and a second surface located opposite the first surface. At least one first electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. At least one second electrically conductive layer is affixed to the first surface of the substrate and partially covering the first surface of the substrate. A light emitter is affixed to the first surface of the substrate in an area not covered by either of the at least one first electrically conductive layer or the at least one second electrically conductive layer. The substrate may be thinner in the area where the light emitter is affixed than in the areas where the first and second electrically conductive layers are affixed. A heat sink may be attached to the second surface of the substrate.

Abstract: A light source having a plurality of dies mounted on leads that are partially enclosed in a plastic body is disclosed. Each die is powered by first and second contacts. One contact is connected to the lead on which the die is mounted. Light from the LED exits the die through the top surface. Each lead includes a layer of metal of substantially constant thickness. The layer includes a boundary, a die mounting region within the boundary and a heat transfer region within the boundary. The boundary increases in a dimension perpendicular to a line connecting the die mounting region and the heat transfer region. The leads are arranged such that the die mounting regions are proximate to a first point and oriented such that the lines radiate from the first point. The light source can be manufactured using conventional lead frame techniques.

Abstract: A semiconductor device includes a light emitting semiconductor die mounted on at least one of first and second electrically conductive bonding pads, which are located on a first major surface of a substrate of the device. The light emitting semiconductor die has an anode and a cathode, which are electrically connected to the first and second electrically conductive bonding pads. The semiconductor device further includes first and second electrically conductive connecting pads, which are located on a second major surface of the substrate. The first and second electrically conductive bonding pads are electrically connected to the first and second electrically conductive connecting pads via first and second electrically conductive interconnecting elements.

Abstract: An electronic assembly includes a Light Emitting Diode (LED) and a substrate. The LED has a solderable surface other than the contacts. The substrate has an opening. The solderable surface is mounted substantially over the opening. When the opening is filled with solder, the solderable surface is metallically bonded with the solder in the opening.

Abstract: A pointing device having an illumination system, an imaging array, and a controller is disclosed. The illumination system illuminates a surface over which the pointing device moves, the illumination system generating a light signal having first and second spectral regions. A portion of the light signal is viewable by a user of the pointing device. The first spectral region includes visible light of a predetermined color and the second spectral region includes infrared light. The imaging array records a plurality of images of the illuminated surface and is sensitive to light in the second spectral region. The second spectral region can be chosen to match the sensitivity of a silicon imaging array, while the first spectral region provides a decorative glow that is seen by the user.

Abstract: A lighting apparatus is described. One embodiment of the lighting apparatus includes a substrate and a lighting element. The lighting element is coupled to the substrate to emit light through a light exit plane. The light exit plane is substantially perpendicular to the substrate. By providing a lighting device with a substrate oriented perpendicular to the light exit plane of the lighting device, the lighting device can enable better mixing of the light from different LEDs. The lighting apparatus facilitates light mixing, generally, to minimize or eliminate dark spots on the diffusion panel. The lighting device also facilitates color mixing to produce relatively consistent white light on the diffusion panel.

Abstract: A light emitting device having a die that includes a light source that generates light of a first wavelength and a layer of phosphor particles covering the die is disclosed. The phosphor particles convert a portion of the light of the first wavelength to light of a second wavelength. The light source can be fabricated by attaching the light source to a substrate, and converting the light source by applying a light converting layer that includes a volatile carrier material and particles of a phosphor that convert light of the first wavelength to light of the second wavelength over the light source. The volatile carrier material is then caused to evaporate leaving a layer of the phosphor particles over the light source. A binder material can be incorporated in the volatile carrier for binding the phosphor particles to one another after the volatile carrier material is evaporated.

Abstract: An eye detection system for safe detection of the eye positions of a subject estimates the distance from the eye detection system to the subject and reduces the power level of at least one primary light source of the eye detection system if the subject is too close to the eye detection system. If the subject is not too close to the eye detection system, the power level of the at least one primary light source of the eye detection system is increased, provided the power level is below a predetermined maximum power level. Primary light from the at least one primary light source reflected from the subject is sensed by an imager to obtain one or more images, from which the eye positions of the subject are estimated.

Abstract: A light emitting diode display device includes a substrate having a first conductive portion and a second conductive portion. A light emitting diode die is coupled to the first conductive portion. A wire bond is coupled to the light emitting diode die and coupled to the second conductive portion. An encapsulant encases the light emitting diode die and the wire bond above the substrate. An overlay is above the encapsulant, wherein the overlay has a high glass transition temperature.

Abstract: A light emitting diode (“LED”) device that emits omni-directional light is disclosed. Such omni-directional LED device may include a LED chip capable of emitting light in all directions. In one example of one implementation, the LED chip is then assembled and sealed inside a casing, such as a glass casing or tube that is capable of emitting light in 360 degree beam pattern. Further, the anode and cathode, or P or N-type contacts, may be configured on the LED chip such that light is allowed to emit from the top and/or the bottom surface of the LED chip in the LED device and is further able to reflect outward and fill the casing or tube of the LED device with light capable of emitting omni-directionally.

Abstract: A lighting device having a light source, light pipe, and a light-dispensing element is disclosed. The light source emits light at a first wavelength and transmits that light to the light pipe. The light dispensing emitter includes an extended section coupled to the light pipe that emits light along the extended section, the extended section having a side surface through which light exits from the extended section. The extended section can include a medium that is transparent to light of the first wavelength and a plurality of scattering centers, the extended section having a shape such that light that is not scattered by the scattering centers is trapped within the extended section by internal reflection. The extended section can also include a light conversion material that converts light of the first wavelength to light of a second wavelength.