Abstract: A light emitting device assembly comprises a light emitting diode (LED) chip, a substrate with two terminals, at least one encapsulation layer, and a thermally conductive adhesive to connect the LED chip and the substrate. The first terminal of the substrate is comprised of a portion with a width at least as wide as the LED chip and a vertical cross-sectional area of at least 30% of the total vertical cross-sectional area of the encapsulated assembly, and a straight element. The enlarged first terminal portion provides more area for heat dissipation and conduction, and along with the thermally conductive adhesive and the encapsulation package, provide enhanced thermal conductivity.

Abstract: A surface mountable electronic device includes a body with a first surface for mounting the device. The first surface has recessed portions therein. Electrical contacts are provided in the first surface. The electrical contacts include first portions that form at least a portion of at least one inner surface of said recessed portions.

Abstract: An optical encoder module is employed to detect light modulated by a moveable member (e.g., code wheel). The optical encoder includes an emitter having a light-emitting element, and a transparent medium encapsulating the light-emitting element. The transparent medium has a convex aspherical external surface shaped so as to focus light received from the light-emitting element into a substantially collimated beam of light using a single refractive interface for illuminating the movable member. The optical encode module also includes a detector facing the emitter for detecting modulated light of the collimated beam transmitted through the movable member.

Abstract: The packaging device includes a substrate, a mounting pad, a connecting pad and an interconnecting element. The substrate is substantially planar and has opposed major surfaces. The mounting pad is conductive and is located on one of the major surfaces. The connecting pad is conductive and is located on the other of the major surfaces. The conductive interconnecting element extends through the substrate and electrically interconnects the mounting pad and the connecting pad. The packaging device has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

Abstract: A substantially planar substrate having opposed major surfaces is provided. The substrate includes a through hole that extends between the major surfaces. The through hole is filled with a conductive interconnecting element. A conductive mounting pad and a conductive connecting pad are formed on different ones of the major surfaces in electrical contact with the conductive interconnecting element. The packaging device formed by the method has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

Abstract: An illuminated display is disclosed which allows characters to be displayed with near type-set like appearance. This is accomplished by using an appropriately formed and placed rib to connect the optically opaque inner member with the optically opaque base.

Abstract: An apparatus for illumination comprises a light source operable to generate a radiation pattern. The apparatus further comprises a light guide adjacent the light source, which is operable to be illuminated by the radiation pattern. The light guide comprises a pattern of varying sized dots operable to diffusely reflect the illuminating radiation pattern. The dot pattern comprises monotonically increasing dot sizes intermediate between the smallest and the largest dot sizes, such that the smallest dot size is proximate to the light source and the largest dot size is distal from the light source.

Abstract: A light source having an LED that is covered by a layer containing a phosphor is disclosed. The LED emits light in a first wavelength band. The phosphor containing layer includes particles that contain a phosphor having the formula Dy3A5O12, where A is at least one of the elements aluminum, gallium, indium, magnesium or silicon. The layer is positioned to receive a portion of the light from the LED and convert the light to light in a second wavelength band. The phosphor may be doped with Ce. Eu, and Tb, or a combination thereof.

Abstract: Reflective members for use in encoder systems are provided. One embodiment comprises a reflective member comprising a reflective layer, at least another layer, and a reflective pattern comprising a first portion having a first reflective property and a second portion having a different reflective property. The reflective layer forms at least a part of the reflective pattern. In addition, the aforementioned first portion of the reflective member has a width of less than half of the grating period. The reflective member enables measurement of at least one operational attribute of an object.

Abstract: A LED of flip-chip design comprises a light emitting region and one or more transparent substrates overlying the light emitting region. The light emitting region includes a negatively doped layer, a positively doped layer, and an active p-n junction layer between the negatively doped layer and the positively doped layer. At least one of the substrates has a pyramidal shape determined by (1) the composition of electrically conductive or electrically non-conductive material, (2) the number of side surfaces, (3) the degree of offset of an apex or top surface, and (4) the slope angle of each side surface relative to a bottom surface.

Abstract: An optical encoder module includes a housing that includes at least one recess having an open end and an opposite closed end, and an electrical component accommodated within the recess. A first locking member is formed on the electrical component and a second locking member is formed in the housing. The first and second locking members are engaged with each other for locking the electrical component, when inserted into said recess, into a locking position. At least one resiliently compressible protrusion is provided between the electrical component and the closed end of the recess so as to be resiliently compressed therebetween into its compressed state when the electrical component is locked in the recess in its locking position.

Abstract: An optical encoder device (100) comprises an optical encoder for detecting codewheel/codestrip positions, an optical encoder housing of accommodating the optical encoder, a first tapered guidepost (103) protruding from a sidewall (102) of the optical encoder housing, said first guidepost (103) having a star-shaped cross-section and being arranged adjacent to the optical encoder, and a second tapered guidepost (104) protruding from the sidewall (102) of the optical encoder housing and extending substantially parallel to the first guidepost (103), said second guidepost (104) having a diamond-shaped cross-section and being arranged remote from the optical encoder.

Abstract: A LED of flip-chip design comprises a light emitting region and one or more transparent substrates overlying the light emitting region. The light emitting region includes a negatively doped layer, a positively doped layer, and an active p-n junction layer between the negatively doped layer and the positively doped layer. At least one of the substrates has a pyramidal shape determined by (1) the composition of electrically conductive or electrically non-conductive material, (2) the number of side surfaces, (3) the degree of offset of an apex or top surface, and (4) the slope angle of each side surface relative to a bottom surface.

Abstract: A surface mountable electronic device includes a body with a first surface for mounting the device. The first surface has recessed portions therein. Electrical contacts are provided in the first surface. The electrical contacts include first portions that form at least a portion of at least one inner surface of said recessed portions.

Abstract: An apparatus is directed to providing backlighting utilizing luminescent impregnated material. The apparatus includes a radiation source providing a first radiation and a filter layer optically coupled to the radiation source including a luminescent material designed to absorb the first radiation, and emit one or more radiations. The apparatus further includes a light guide optically coupled to the filter layer and designed to receive the emitted radiation and reflect at least a portion of the emitted radiation. The apparatus additionally includes a display layer optically coupled to the light guide and designed to receive the reflected radiation. The system provides means for providing a first radiation, means for absorbing the first radiation, means for emitting one or more radiations based on the absorbed first radiation, means for receiving the emitted radiation, means for reflecting the emitted radiation, and means for receiving the reflected emitted radiation.

Abstract: The invention relates to an adhesive attaching method for attaching a semiconductor die to a substrate in which an adhesive is deposited onto the substrate, the deposited adhesive is partially cured and/or dried, the partially cured and/or dried adhesive is reheated and a semiconductor die is placed onto the reheated adhesive, after which the adhesive is fully cured so that the semiconductor die is bonded, both electrically and mechanically, to the substrate.

Abstract: The invention concerns light emitting devices and, more specifically, light emitting diode devices and methods of construction of such devices.