Patents by Inventor Kegang Huang
Kegang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10850973Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.Type: GrantFiled: November 27, 2019Date of Patent: December 1, 2020Assignee: INVENSENSE, INC.Inventors: Michael Daneman, Martin Lim, Kegang Huang, Igor Tchertkov
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Publication number: 20200109045Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.Type: ApplicationFiled: November 27, 2019Publication date: April 9, 2020Inventors: Michael DANEMAN, Martin LIM, Kegang HUANG, Igor TCHERTKOV
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Patent number: 10532926Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.Type: GrantFiled: November 22, 2016Date of Patent: January 14, 2020Assignee: INVENSENSE, INC.Inventors: Michael Daneman, Martin Lim, Kegang Huang, Igor Tchertkov
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Patent number: 10442680Abstract: Electric connection flexures for moving stages of microelectromechanical systems (MEMS) devices are disclosed. The disclosed flexures may provide an electrical and mechanical connection between a fixed frame and a moving frame, and are flexible in the moving frame's plane of motion. In implementations, the flexures are formed using a process that embeds the two ends of each flexure in the fixed frame and moving frame, respectively.Type: GrantFiled: June 14, 2016Date of Patent: October 15, 2019Assignee: MEMS Drive, Inc.Inventors: Xiaolei Liu, Kegang Huang, Guiqin Wang, Matthew Ng, Benson Mai, Changgeng Liu
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Publication number: 20170359003Abstract: Electric connection flexures for moving stages of microelectromechanical systems (MEMS) devices are disclosed. The disclosed flexures may provide an electrical and mechanical connection between a fixed frame and a moving frame, and are flexible in the moving frame's plane of motion. In implementations, the flexures are formed using a process that embeds the two ends of each flexure in the fixed frame and moving frame, respectively.Type: ApplicationFiled: June 14, 2016Publication date: December 14, 2017Applicant: MEMS DRIVE, INC.Inventors: XIAOLEI LIU, KEGANG HUANG, GUIQIN WANG, MATTHEW NG, BENSON MAI, CHANGGENG LIU
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Publication number: 20170297907Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.Type: ApplicationFiled: November 22, 2016Publication date: October 19, 2017Inventors: Michael DANEMAN, Martin LIM, Kegang HUANG, Igor TCHERTKOV
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Patent number: 9540230Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.Type: GrantFiled: June 27, 2012Date of Patent: January 10, 2017Assignee: INVENSENSE, INC.Inventors: Michael Daneman, Martin Lim, Kegang Huang, Igor Tchertkov
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Patent number: 9221676Abstract: A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises forming a MEMS wafer. Forming a MEMS wafer includes forming one cavity in a first semiconductor layer, bonding the first semiconductor layer to a second semiconductor layer with a dielectric layer disposed between the first semiconductor layer and the second semiconductor layer, and etching at least one via through the second semiconductor layer and the dielectric layer and depositing a conductive material on the second semiconductor layer and filling the at least one via. Forming a MEMS wafer also includes patterning and etching the conductive material to form one standoff and depositing a germanium layer on the conductive material, patterning and etching the germanium layer, and patterning and etching the second semiconductor layer to define one MEMS structure. The method also includes bonding the MEMS wafer to a base substrate.Type: GrantFiled: January 6, 2015Date of Patent: December 29, 2015Assignee: INVENSENSE, INC.Inventors: Kegang Huang, Jongwoo Shin, Martin Lim, Michael Julian Daneman, Joseph Seeger
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Publication number: 20150336792Abstract: A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises forming a MEMS wafer. Forming a MEMS wafer includes forming one cavity in a first semiconductor layer, bonding the first semiconductor layer to a second semiconductor layer with a dielectric layer disposed between the first semiconductor layer and the second semiconductor layer, and etching at least one via through the second semiconductor layer and the dielectric layer and depositing a conductive material on the second semiconductor layer and filling the at least one via. Forming a MEMS wafer also includes patterning and etching the conductive material to form one standoff and depositing a germanium layer on the conductive material, patterning and etching the germanium layer, and patterning and etching the second semiconductor layer to define one MEMS structure. The method also includes bonding the MEMS wafer to a base substrate.Type: ApplicationFiled: January 6, 2015Publication date: November 26, 2015Inventors: Kegang HUANG, Jongwoo SHIN, Martin LIM, Michael Julian DANEMAN, Joseph SEEGER
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Patent number: 8945969Abstract: A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises forming a MEMS wafer. Forming a MEMS wafer includes forming one cavity in a first semiconductor layer, bonding the first semiconductor layer to a second semiconductor layer with a dielectric layer disposed between the first semiconductor layer and the second semiconductor layer, and etching at least one via through the second semiconductor layer and the dielectric layer and depositing a conductive material on the second semiconductor layer and filling the at least one via. Forming a MEMS wafer also includes patterning and etching the conductive material to form one standoff and depositing a germanium layer on the conductive material, patterning and etching the germanium layer, and patterning and etching the second semiconductor layer to define one MEMS structure. The method also includes bonding the MEMS wafer to a base substrate.Type: GrantFiled: August 11, 2014Date of Patent: February 3, 2015Assignee: InvenSense, Inc.Inventors: Kegang Huang, Jongwoo Shin, Martin Lim, Michael Julian Daneman, Joseph Seeger
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Publication number: 20140349434Abstract: A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises forming a MEMS wafer. Forming a MEMS wafer includes forming one cavity in a first semiconductor layer, bonding the first semiconductor layer to a second semiconductor layer with a dielectric layer disposed between the first semiconductor layer and the second semiconductor layer, and etching at least one via through the second semiconductor layer and the dielectric layer and depositing a conductive material on the second semiconductor layer and filling the at least one via. Forming a MEMS wafer also includes patterning and etching the conductive material to form one standoff and depositing a germanium layer on the conductive material, patterning and etching the germanium layer, and patterning and etching the second semiconductor layer to define one MEMS structure. The method also includes bonding the MEMS wafer to a base substrate.Type: ApplicationFiled: August 11, 2014Publication date: November 27, 2014Inventors: Kegang HUANG, Jongwoo SHIN, Martin LIM, Michael Julian DANEMAN, Joseph SEEGER
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Publication number: 20140264655Abstract: In an integrated MEMS device, moving silicon parts with smooth surfaces can stick together if they come into contact. By roughening at least one smooth surface, the effective area of contact, and therefore surface adhesion energy, is reduced and hence the sticking force is reduced. The roughening of a surface can be provided by etching the smooth surfaces in gas, plasma, or liquid with locally non-uniform etch rate. Various etch chemistries and conditions lead to various surface roughness.Type: ApplicationFiled: October 23, 2013Publication date: September 18, 2014Applicant: InvenSense, Inc.Inventors: Kirt Reed WILLIAMS, Kegang HUANG, Wencheng XU, Jongwoo SHIN, Martin LIM
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Patent number: 8822252Abstract: A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises forming a MEMS wafer. Forming a MEMS wafer includes forming one cavity in a first semiconductor layer, bonding the first semiconductor layer to a second semiconductor layer with a dielectric layer disposed between the first semiconductor layer and the second semiconductor layer, and etching at least one via through the second semiconductor layer and the dielectric layer and depositing a conductive material on the second semiconductor layer and filling the at least one via. Forming a MEMS wafer also includes patterning and etching the conductive material to form one standoff and depositing a germanium layer on the conductive material, patterning and etching the germanium layer, and patterning and etching the second semiconductor layer to define one MEMS structure. The method also includes bonding the MEMS wafer to a base substrate.Type: GrantFiled: September 20, 2013Date of Patent: September 2, 2014Assignee: Invensense, Inc.Inventors: Kegang Huang, Jongwoo Shin, Martin Lim, Michael Julian Daneman, Joseph Seeger
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Publication number: 20140213007Abstract: A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises forming a MEMS wafer. Forming a MEMS wafer includes forming one cavity in a first semiconductor layer, bonding the first semiconductor layer to a second semiconductor layer with a dielectric layer disposed between the first semiconductor layer and the second semiconductor layer, and etching at least one via through the second semiconductor layer and the dielectric layer and depositing a conductive material on the second semiconductor layer and filling the at least one via. Forming a MEMS wafer also includes patterning and etching the conductive material to form one standoff and depositing a germanium layer on the conductive material, patterning and etching the germanium layer, and patterning and etching the second semiconductor layer to define one MEMS structure. The method also includes bonding the MEMS wafer to a base substrate.Type: ApplicationFiled: September 20, 2013Publication date: July 31, 2014Applicant: InvenSense, Inc.Inventors: Kegang HUANG, Jongwoo SHIN, Martin LIM, Michael Julian DANEMAN, Joseph SEEGER
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Patent number: 8564076Abstract: A MEMS device is disclosed. The MEMS device comprises a MEMS substrate. The MEMS substrate includes a first semiconductor layer connected to a second semiconductor layer with a dielectric layer in between. MEMS structures are formed from the second semiconductor layer and include a plurality of first conductive pads. The MEMS device further includes a base substrate which includes a plurality of second conductive pads thereon. The second conductive pads are connected to the first conductive pads. Finally, the MEMS device includes a conductive connector formed through the dielectric layer of the MEMS substrate to provide electrical coupling between the first semiconductor layer and the second semiconductor layer. The base substrate is electrically connected to the second semiconductor layer and the first semiconductor layer.Type: GrantFiled: January 30, 2013Date of Patent: October 22, 2013Assignee: Invensense, Inc.Inventors: Kegang Huang, Jongwoo Shin, Martin Lim, Michael J. Daneman, Joseph Seeger
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Patent number: 8513747Abstract: An integrated MEMS device comprises a wafer where the wafer contains two or more cavities of different depths. The MEMS device includes one movable structure within a first cavity of a first depth and a second movable structure within a second cavity of a second depth. The cavities are sealed to maintain different pressures for the different movable structures for optimal operation. MEMS stops can be formed in the same multiple cavity depth processing flow. The MEMS device can be integrated with a CMOS wafer.Type: GrantFiled: December 11, 2012Date of Patent: August 20, 2013Assignee: Invensense, Inc.Inventors: Kegang Huang, Martin Lim, Steven S. Nasiri
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Patent number: 8350346Abstract: An integrated MEMS device comprises a wafer where the wafer contains two or more cavities of different depths. The MEMS device includes one movable structure within a first cavity of a first depth and a second movable structure within a second cavity of a second depth. The cavities are sealed to maintain different pressures for the different movable structures for optimal operation. MEMS stops can be formed in the same multiple cavity depth processing flow. The MEMS device can be integrated with a CMOS wafer.Type: GrantFiled: July 3, 2012Date of Patent: January 8, 2013Assignee: Invensense, Inc.Inventors: Kegang Huang, Martin Lim, Steven S. Nasiri
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Publication number: 20120326248Abstract: A Microelectromechanical systems (MEMS) structure comprises a MEMS wafer. A MEMS wafer includes a handle wafer with cavities bonded to a device wafer through a dielectric layer disposed between the handle and device wafers. The MEMS wafer also includes a moveable portion of the device wafer suspended over a cavity in the handle wafer. Four methods are described to create two or more enclosures having multiple gas pressure or compositions on a single substrate including, each enclosure containing a moveable portion. The methods include: A. Forming a secondary sealed enclosure, B. Creating multiple ambient enclosures during wafer bonding, C. Creating and breaching an internal gas reservoir, and D. Forming and subsequently sealing a controlled leak/breach into the enclosure.Type: ApplicationFiled: June 27, 2012Publication date: December 27, 2012Applicant: INVENSENSE, INC.Inventors: Michael DANEMAN, Martin LIM, Kegang HUANG, Igor TCHERTKOV
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Publication number: 20120313189Abstract: A method and apparatus are disclosed for reducing stiction in MEMS devices. The method comprises patterning a CMOS wafer to expose Titanium-Nitride (TiN) surface for a MEMS stop and patterning the TiN to form a plurality of stop pads on the top metal aluminum surface of the CMOS wafer. The method is applied for a moveable MEMS structure bonded to a CMOS wafer. The TiN surface and/or plurality of stop pads minimize stiction between the MEMS structure and the CMOS wafer. Further, the TiN film on top of aluminum electrode suppresses the formation of aluminum hillocks which effects the MEMS structure movement.Type: ApplicationFiled: June 5, 2012Publication date: December 13, 2012Applicant: INVENSENSE, INC.Inventors: Kegang HUANG, Martin LIM, Xiang LI
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Patent number: 7923789Abstract: The contrast offered by a spatial light modulator device may be enhanced by positioning nonreflective elements such as supporting posts and moveable hinges, behind the reflecting surface of the pixel. In accordance with one embodiment, the reflecting surface is suspended over and underlying hinge-containing layer by integral ribs of the reflecting material defined by gaps in a sacrificial layer. In accordance with an alternative embodiment, the reflecting surface is separated from the underlying hinge by a gap formed in an intervening layer, such as oxide. In either embodiment, walls separating adjacent pixel regions may be recessed beneath the reflecting surface to further reduce unwanted scattering of incident light and thereby enhance contrast.Type: GrantFiled: April 25, 2008Date of Patent: April 12, 2011Assignee: Miradia Inc.Inventors: Kegang Huang, Xiao Yang, Dongmin Chen