Abstract: Provided is a method of manufacturing a liquid ejection head, which is capable of patterning a dry film while suppressing deformation of the dry film caused by a pressure. The method of manufacturing a liquid ejection head includes: preparing a substrate including an ejection orifice member on a first surface; forming, on an ejection orifice surface of the ejection orifice member, a protection film having communicating holes for allowing ejection orifices to communicate to outside; closing an opening of a supply port on a second surface on a side opposite to the first surface of the substrate with a dry film; and patterning the dry film by irradiating the dry film with light under a state in which the protection film is formed on the ejection orifice surface.

Abstract: To manufacture a liquid ejection head, a film having a lower surface free energy than a surface free energy of a substrate is first formed on an inner face of a liquid supply port. Next, a dry film to be a flow path forming member is attached to cover the surface of the substrate, and then a member to be an ejection orifice forming member is provided on the surface of the dry film.

Abstract: A battery embedded structure is disclosed. The battery embedded structure comprises a substrate including one or more stacked battery units. Each stacked battery unit includes two or more conductive layers and one or more unit cells. Each unit cell is disposed between two conductive layers. The substrate has a principal surface provided by one or more respective side surfaces of the one or more stacked battery units. The battery embedded structure also comprises a wiring layer disposed on the principal surface of the substrate. The wiring layer includes a plurality of electrical paths and a plurality of vias. Each via is connected with one electrical path. Each via is located at a position corresponding to an edge surface of a conductive layer of the two or more conductive layers of the one or more stacked battery units so as to contact electrically to that conductive layer.

Abstract: A process for producing a liquid discharge head including a substrate having a liquid supply path passing through from its first surface to second surface and an discharge port forming member having a discharge port communicating with the supply path through a flow path, the process including providing a first layer of photosensitive resin in a region covering an opening of the supply path in the first surface; forming a latent image of a pattern of the flow path in the first layer by exposure; providing a second layer of negative photosensitive resin on the first layer; curing a portion, opposing to the opening of the supply path in the first surface, of the second layer; forming a latent image of a pattern of the discharge port in the second layer by exposure; and developing latent images of patterns of the flow path and discharge port.

Abstract: An autonomous travel work vehicle (1), which is provided with a position calculation means that measures the device body position by means of a satellite positioning system, a steering actuator (40) that operates a steering device, an engine rotation control means, a transmission means (44), and a control device (30) that controls each of same, is caused to autonomously travel, along a set travel path stored in the control device (30), by an accompanying travel work vehicle (100) that works while accompanying the travel of the autonomous travel work vehicle (1) by means of attended operation and that is mounted with a remote operation device (112) that can operate the autonomous travel work vehicle, and the control device (30) halts autonomous travel when a signal disruption from the satellites, a large deviation from the set travel path, an abnormal sensor value, fuel exhaustion, or the like is detected.

Abstract: An ink jet recording apparatus includes a recording head having a plurality of nozzles through which an ink composition containing an inorganic pigment is ejected, a nozzle surface having nozzle orifices, and a liquid-repellent film disposed on the nozzle surface; an absorbing member that absorbs the ink composition containing the inorganic pigment from the nozzle orifices and the nozzle surface; and an actuating mechanism including a pressing member that presses the absorbing member and the nozzle surface relative to each other. The actuating mechanism moves at least one of the absorbing member and the recording head relative to the other to perform a cleaning operation in which the ink composition is removed from the nozzle surface with the absorbing member. The absorbing member contains an impregnation liquid having a surface tension of 45 mN/m or less during the cleaning operation.

Abstract: A computer-implemented structure for optimizing a route for power supply and heat dissipation in a multilayer chip. The method includes: setting a heat conductive thermal value for the multilayer chip by way of density, preparing a substrate that contains silicon where a wiring layer is formed facing the upper surface side of the multilayer chip, setting the power from the wiring layer of the substrate that uses silicon, manipulating the value of the power supply, and manipulating the heat conductive thermal value based on density. Both apparatus's include an organic substrate, a multilayer chip, a substrate containing silicon, a wiring layer, and a heat dissipater, wherein the components are configured to perform the steps of the above method. The method of configuring an apparatus ensures that all the multilayer chips are stored in the concave part of the organic substrate.

Abstract: Highly reliable chip mounting is accomplished by using a substrate having such a shape that a stress exerted on a flip-chip-connected chip can be reduced, so that the stress exerted on the chip is reduced and separation of an interlayer insulating layer having a low dielectric constant (low-k) is minimized. Specifically, in a chip mounting structure, a chip including an interlayer insulating layer having a low dielectric constant (low-k) is flip-chip connected to a substrate via bumps is shown. In the chip mounting structure, the substrate has such a shape that a mechanical stress exerted on the interlayer insulating layer at corner portions of the chip due to a thermal stress is reduced, the thermal stress occurring due to a difference in coefficient of thermal expansion between the chip and the substrate.

Abstract: For easy setting of a path of an autonomously-traveling autonomous travel work vehicle, provided is a method for setting a path for an autonomous travel work vehicle to run and operate by determining positions with the use of a satellite positioning system so as to drive and carry out an agricultural field operation. The method includes inputting a front-to-back length of a vehicle body, a width of an implement and an overlapping amount of implements (24) in a width direction, positioning a work vehicle at inflection points successively along an outer circumference of the agricultural field and determining positions with the use of the satellite positioning system, setting a work area, an operation start position and an operation end position, a direction for starting reference traveling, headlands (HB) on both ends of the work area (HA), and a travel path (R) within the agricultural field.

Abstract: The present invention is an induction control system for an autonomous-traveling vehicle that performs traveling and work autonomously while measuring the position of the traveling vehicle by using a satellite positioning system, the induction control system being characterized by, when the autonomous-traveling vehicle is moved backward, setting a virtual antenna position more backward, by a predetermined distance, than the antenna position of the satellite positioning system, and performing a lateral control by using a lateral deviation from a target path at the virtual antenna position. This makes it possible to travel along a pre-designed target path during a forward movement, turning, and a backward movement of the autonomous-traveling vehicle.

Abstract: Electrical package including bimetal lid. The electrical package includes: an organic substrate; a semiconductor chip electrically connected to electrical pads on a surface of the organic substrate via a plurality of solder balls; and a lid for encapsulating the semiconductor chip on the organic substrate, wherein (i) an inner surface of a central part of the lid is connected to a surface of the semiconductor chip via a first TIM, (ii) an inner surface of an outer part of the lid is hermetically connected to the surface of the organic substrate, and (iii) the lid has a bimetal structure including at least two different metals. A circuit module is also provided.

Abstract: This invention relates to a microorganism that produces a polyhydroxyalkanoate (PHA) copolymer with a regulated monomer composition ratio and comprises a (R)-specific enoyl-CoA hydratase gene in the genome DNA, wherein a nucleotide sequence upstream of the (R)-specific enoyl-CoA hydratase gene comprises a modification consisting of a substitution(s), a deletion(s), an insertion(s), and/or an addition(s) of one or a plurality of nucleotides so that the expression of the (R)-specific enoyl-CoA hydratase gene is regulated, and to a method for producing a PHA copolymer using the microorganism.

Abstract: According to an embodiment, an emergency core cooling system has: three active safety divisions each including only one motor-driven active safety system; one passive safety division including a passive safety system; an emergency power source disposed in each of the active safety divisions to supply electric power to the motor-driven active safety system; and an advanced passive containment cooling system disposed in the passive safety division. Only two active safety divisions each includes a low pressure flooder system that is commonly used with a residual heat removal system as the only one motor-driven active safety system. The other active safety division includes an air-cooled injection system as the only one motor-driven active safety system.

Abstract: Electrical package including bimetal lid. The electrical package includes: an organic substrate; a semiconductor chip electrically connected to electrical pads on a surface of the organic substrate via a plurality of solder balls; and a lid for encapsulating the semiconductor chip on the organic substrate, wherein (i) an inner surface of a central part of the lid is connected to a surface of the semiconductor chip via a first TIM, (ii) an inner surface of an outer part of the lid is hermetically connected to the surface of the organic substrate, and (iii) the lid has a bimetal structure including at least two different metals. A circuit module is also provided.

Abstract: A nuclear power plant according to an embodiment comprises: a reactor well; a reactor well upper lid; an operation floor; an operation floor area wall; a standby gas treatment system; and a reactor well exhaust section to release the gas inside the reactor well to the environment without releasing the gas into the operation floor area in an event of a predetermined accident, e.g., causing diminished cooling of a containment vessel or otherwise increasing its temperature. The standby gas treatment system includes: a suction pipe to take in gas inside the reactor building; an exhaust fan; a standby gas treatment system exhaust pipe; a heater that is disposed between the suction pipe and the standby gas treatment system exhaust pipe; and a filter to filter the gas heated by the heater and to send the gas to the standby gas treatment system exhaust pipe.

Abstract: [Object] A hollow stranded wire line, for manipulation, having an excellent torque transmittability is provided. [Solution] A hollow stranded wire line 2 for manipulation is a hollow stranded wire line 2 that is advantageously used as a stranded wire line for manipulation in a medical instrument, and a side wire 4 or a side strand which is an outermost layer has a forming rate that is greater than 100% and not greater than 110%. The side wire 4 or the side strand having been formed has a spiral shape in which a flatness that is an aspect ratio obtained by a major axis being divided by a minor axis is preferably not less than 1.01 and preferably not greater than 1.10.

Abstract: A liquid ejection head includes a liquid ejection board and a liquid ejection head component disposed on the liquid ejection board. The liquid ejection board includes a substrate, an energy generating device on the substrate, a channel defining member defining a liquid channel and having a liquid ejection opening in communication with the liquid channel, a liquid supply passage in communication with the liquid channel, a liquid supply opening in communication with the liquid supply passage and having a smaller opening cross-sectional area taken in a direction perpendicular to a flow direction of a liquid than the liquid supply passage, and an opening in communication with the liquid channel. The liquid channel allows a liquid to be in contact with the energy generating device. The liquid ejection opening allows a liquid to be ejected therethrough. The liquid ejection head component closes at least a portion of the opening.

Abstract: A method for manufacturing a liquid discharge head includes a transferring step of transferring a dry film supported by a supporting member to a substrate having a hole, and a peeling step of peeling the supporting member off the dry film on the substrate. In the peeling step, the dry film is in contact with a wall surface defining the hole in the substrate.

Abstract: [Object] A manipulation rope having an excellent torque transmittability is provided. [Solution] A manipulation rope 2 is a rope 2 that is advantageously used as a manipulation rope for a medical instrument, and includes a side wire 6 or a side strand which is an outermost layer, the side wire 6 or the side strand having a spiral shape in which a flatness that is an aspect ratio obtained by a major axis being divided by a minor axis is greater than 1.00 and not greater than 1.10. An elongation of the rope at a time when a tensile load that is 1.0% of a breaking load is applied, is preferably not less than 0.04% and preferably not greater than 0.10%.

Abstract: A liquid ejecting apparatus includes a liquid ejecting head which ejects liquid from a nozzle that is disposed on a nozzle surface, a first wiping portion which is able to wipe away the liquid that is adhered to the nozzle surface, and a second wiping portion which is able to hold the liquid that is adhered to the nozzle surface by contacting the nozzle surface, wherein it is possible to perform a first maintenance operation in which the nozzle surface is wiped using the first wiping portion and a second maintenance operation in which the second wiping portion is caused to contact the nozzle surface due to the second wiping portion being biased by the first wiping portion.