Abstract: An electronic circuit includes a substrate device which includes a first substrate section including a first plurality of layers attached to each other having a first orientation (x2) and a second substrate section including a second plurality of layers attached to each other. The second plurality of layers have a second orientation (x3). The first orientation (x2) and the second orientation (x3) are perpendicular with respect to one another.

Abstract: An autonomous travel work vehicle (1), which is provided with a position calculation means that measures the device body position by means of a satellite positioning system, a steering actuator (40) that operates a steering device, an engine rotation control means, a transmission means (44), and a control device (30) that controls each of same, is caused to autonomously travel, along a set travel path stored in the control device (30), by an accompanying travel work vehicle (100) that works while accompanying the travel of the autonomous travel work vehicle (1) by means of attended operation and that is mounted with a remote operation device (112) that can operate the autonomous travel work vehicle, and the control device (30) halts autonomous travel when a signal disruption from the satellites, a large deviation from the set travel path, an abnormal sensor value, fuel exhaustion, or the like is detected.

Abstract: For easy setting of a path of an autonomously-traveling autonomous travel work vehicle, provided is a method for setting a path for an autonomous travel work vehicle to run and operate by determining positions with the use of a satellite positioning system so as to drive and carry out an agricultural field operation. The method includes inputting a front-to-back length of a vehicle body, a width of an implement and an overlapping amount of implements (24) in a width direction, positioning a work vehicle at inflection points successively along an outer circumference of the agricultural field and determining positions with the use of the satellite positioning system, setting a work area, an operation start position and an operation end position, a direction for starting reference traveling, headlands (HB) on both ends of the work area (HA), and a travel path (R) within the agricultural field.

Abstract: A passive containment cooling and filtered venting system includes: an outer well; a scrubbing pool arranged in the outer well; a cooling water pool installed above the dry well and the outer well; a heat exchanger partly submerged in the cooling water; a gas supply pipe that is connected to the inlet plenum of the ruin of the heat exchanger at one end and connected to a gas phase region of the containment vessel at the other end; a condensate return pipe that is connected to the outlet plenum of the heat exchanger at one end, and connected to inside the containment vessel at other end; and a gas vent pipe that is connected to the outlet plenum of the heat exchanger at one end and is submerged in the scrubbing pool at other end.

Abstract: A method that minimizes adjustment of a wiring layer in reducing a warpage of a multilayered substrate and enables location of a part of a wiring layer that needs correction in order to reduce the warpage. The difference in average coefficient of thermal expansion, ??, varies in a substrate. The method focuses in on the difference in ?? with a great length scale (low frequency) having a relatively significant effect on the warpage compared to the difference in ?? with a smaller length scale (high frequency) and corrects only the difference in ?? with a greater length scale. The distribution of the difference in ?? in a plane of substrate is determined. Then digital filtering is performed to extract only the difference in ?? with a low frequency and the difference in ?? between before and after correction, thereby revealing a part that requires correction.

Abstract: A method for manufacturing liquid ejection heads includes the steps of forming ejection port members on a substrate, the ejection port members each having a liquid channel and an ejection port for ejecting liquid through the channel, the liquid channel communicating with the substrate; forming supply ports passing through the substrate to supply liquid to the channels; and forming a separation groove in the substrate to separate the substrate for each liquid ejection head. The step of forming the ejection port members includes the step of hardening a material constituting the ejection port member by heat treatment. The step of forming the separation groove is performed before the step of hardening.

Abstract: A liquid ejecting apparatus includes a pressure-regulating mechanism which is provided in a liquid supply path in which it is possible to supply liquid to a liquid ejecting unit, and includes a liquid accommodation part which can accommodate the liquid internally, and in which a volume of the liquid accommodation part is changed depending on displacing of a diaphragm section, in which the diaphragm section includes an annular corrugated portion formed in a sectional waveform shape which is deformed when the diaphragm section receives pressure.

Abstract: The objective of the present invention is to reduce the calculation time in an interregional supply adjustment plan.

Abstract: Electrical package including bimetal lid. The electrical package includes: an organic substrate; a semiconductor chip electrically connected to electrical pads on a surface of the organic substrate via a plurality of solder balls; and a lid for encapsulating the semiconductor chip on the organic substrate, wherein (i) an inner surface of a central part of the lid is connected to a surface of the semiconductor chip via a first TIM, (ii) an inner surface of an outer part of the lid is hermetically connected to the surface of the organic substrate, and (iii) the lid has a bimetal structure including at least two different metals. A circuit module is also provided.

Abstract: Electrical package including bimetal lid. The electrical package includes: an organic substrate; a semiconductor chip electrically connected to electrical pads on a surface of the organic substrate via a plurality of solder balls; and a lid for encapsulating the semiconductor chip on the organic substrate, wherein (i) an inner surface of a central part of the lid is connected to a surface of the semiconductor chip via a first TIM, (ii) an inner surface of an outer part of the lid is hermetically connected to the surface of the organic substrate, and (iii) the lid has a bimetal structure including at least two different metals. A circuit module is also provided.

Abstract: A liquid ejecting apparatus includes a liquid ejecting unit which can eject liquid from a nozzle; a supply flow path through which liquid is supplied to the nozzle; a pressure adjusting unit which includes a pressure chamber which can store liquid; a storage chamber at least a part of which is formed by a gas permeable unit, and which stores liquid; a connection flow path which connects a space including a flow path portion from the pressure chamber to the nozzle and the pressure chamber, and the storage chamber; an opening-closing valve which can switch a communicating state between the space and the storage chamber through the connection flow path; and a pressurizing unit which pressurizes the storage chamber when the opening-closing valve is in the closed state.

Abstract: First, second, and third ink absorbing bodies are accommodated in a container of a recovery reservoir in this order from the side corresponding to a bottom surface of the container, so that an introduction chamber is defined in the middle of a recovery space. A lid having a shutter plate and a communication hole is located over the third ink absorbing body. The upper side of the introduction chamber is covered by the shutter plate to suppress volatilization of solvent element of waste ink introduced into the introduction chamber. In addition, the communication hole is located in a portion of the upper surface of the third ink absorbing body, so that solvent element of ink absorbed by the third ink absorption body volatilizes.

Abstract: A liquid ejecting apparatus includes a liquid ejecting head which ejects liquid from a nozzle that is disposed on a nozzle surface, a first wiping portion which is able to wipe away the liquid that is adhered to the nozzle surface, and a second wiping portion which is able to hold the liquid that is adhered to the nozzle surface by contacting the nozzle surface, wherein it is possible to perform a first maintenance operation in which the nozzle surface is wiped using the first wiping portion and a second maintenance operation in which the second wiping portion is caused to contact the nozzle surface due to the second wiping portion being biased by the first wiping portion.

Abstract: A liquid ejecting apparatus includes: a liquid ejecting unit that ejects a liquid supplied through a liquid supply path from a nozzle; a maintenance unit that performs a maintenance operation of the liquid ejecting unit; and an ejection state detecting unit that is able to detect a state inside a pressure chamber communicating with the nozzle. The ejection state detecting unit detects a state inside the pressure chamber before the maintenance operation and at least one state inside the pressure chamber during the maintenance operation or after the maintenance operation, and is able to determine malfunction of at least one of the maintenance unit and function units arranged in the liquid supply path based on a change in a state inside the pressure chamber due to the maintenance operation.

Abstract: A printing apparatus includes a removal portion that removes attached materials attached to a printing surface by coming in contact with the printing surface of a printing medium; a pressing portion that presses the printing surface with which the removal portion is in contact; and a liquid ejecting portion that performs printing by ejecting a liquid with respect to the printing surface pressed by the pressing portion.

Abstract: The present invention includes the following steps: setting the thickness of an interposer to an initial value; determining the axial force of the interposer and the radius of curvature of the warpage caused by the difference in the thermal expansion coefficients of the supporting substrate, the joined layer and the interposer at the set thickness; determining the absolute value of the stress on the chip-connecting surface of the interposer from the stress due to the axial force of the interposer and the stress due to the warpage using the determined axial force and the radius of curvature; determining whether or not the absolute value of the stress is within a tolerance; changing the thickness of the interposer by a predetermined value; and confirming the set thickness as the thickness of the interposer when the determined absolute value of the stress is within the tolerance.

Abstract: A liquid ejection head includes a liquid ejection board and a liquid ejection head component disposed on the liquid ejection board. The liquid ejection board includes a substrate, an energy generating device on the substrate, a channel defining member defining a liquid channel and having a liquid ejection opening in communication with the liquid channel, a liquid supply passage in communication with the liquid channel, a liquid supply opening in communication with the liquid supply passage and having a smaller opening cross-sectional area taken in a direction perpendicular to a flow direction of a liquid than the liquid supply passage, and an opening in communication with the liquid channel. The liquid channel allows a liquid to be in contact with the energy generating device. The liquid ejection opening allows a liquid to be ejected therethrough. The liquid ejection head component closes at least a portion of the opening.

Abstract: A method for determining an area of a region for receiving a heat sink on a surface of a chip-supporting substrate is disclosed. The method can include determining, in response to a specified voltage drop associated with substrate wiring, a first set of wiring cross-sectional areas and corresponding lengths that satisfy the specified voltage drop. The method can also include determining, by selecting, in response to a specified thermal resistance associated with substrate wiring and insulating layers, from the first set, a second set of wiring cross-sectional areas and corresponding lengths that satisfy the specified thermal resistance. The method can also include selecting, from a set of placement areas corresponding to the second set of wiring cross-sectional areas and corresponding lengths, a heat sink placement area that is greater than a lower size for a placement area and less than an upper size for a placement area.

Abstract: This invention relates to a microorganism that produces a polyhydroxyalkanoate (PHA) copolymer with a regulated monomer composition ratio and comprises a (R)-specific enoyl-CoA hydratase gene in the genome DNA, wherein a nucleotide sequence upstream of the (R)-specific enoyl-CoA hydratase gene comprises a modification consisting of a substitution(s), a deletion(s), an insertion(s), and/or an addition(s) of one or a plurality of nucleotides so that the expression of the (R)-specific enoyl-CoA hydratase gene is regulated, and to a method for producing a PHA copolymer using the microorganism.

Abstract: An attitude changing apparatus which can change an attitude of a component with certainty without damaging the component. The component has a rectangular parallelepiped shape where a pair of rectangular end surfaces opposite to each other are connected to each other by four side surfaces. The component is stored in a cavity which penetrates between main surfaces of a conveyance member, the conveyance member is moved relative to a base, and the component is made to pass through an engaging groove formed on a reference surface of the base.