Patents by Inventor Keisuke Aramaki

Keisuke Aramaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240124758
    Abstract: A heat-conductive sheet includes a binder resin and a fibrous filler having a major axis and dispersed in the binder resin. The major axis of the fibrous filler is arranged at an angle of 70 to 90 degrees with respect to a surface direction of the heat-conductive sheet when viewed in a cross-section along a thickness direction of the heat-conductive sheet. If the heat-conductive sheet is processed to a shape having a thickness of 2 mm and a diameter of 29 mm, and subject to a compression such that the thickness is decreased by 40% of the thickness before the compression, at room temperature for 24 hours, a difference of an angle of the major axis of the fibrous filler after release of the compression and an angle of the major axis of the fibrous filler before the compression is in a range within 10 degrees.
    Type: Application
    Filed: January 27, 2022
    Publication date: April 18, 2024
    Applicant: DEXERIALS CORPORATION
    Inventors: Marina TOBATA, Keisuke ARAMAKI
  • Publication number: 20240117148
    Abstract: A thermally conductive sheet includes a binder resin and boron nitride flakes. The boron nitride flakes are oriented in a thickness direction of the thermally conductive sheet, and both surfaces of the thermally conductive sheet are tacky. A method for manufacturing a thermally conductive sheet includes preparing a thermally conductive composition containing a binder resin and boron nitride flakes. A molded block is formed from the thermally conductive composition. The molded block is sliced into a sheet shape to obtain a thermally conductive sheet precursor. The thermally conductive sheet precursor is pressed to obtain a thermally conductive sheet.
    Type: Application
    Filed: January 28, 2022
    Publication date: April 11, 2024
    Applicant: DEXERIALS CORPORATION
    Inventors: Keisuke ARAMAKI, Yuma SATO, Yusuke KUBO
  • Publication number: 20240120254
    Abstract: A thermally-conductive sheet includes: a binder; and an anisotropic thermally-conductive filler. The anisotropic thermally-conductive filler is oriented in a thickness direction of the thermally-conductive sheet An arithmetical mean height Sa is 5 ?m or less and a maximum height Sz is 50 ?m or less on either surface of the thermally-conductive sheet. A dielectric breakdown voltage of the thermally-conductive sheet is 0.5 kV/mm or higher.
    Type: Application
    Filed: February 9, 2022
    Publication date: April 11, 2024
    Applicant: DEXERIALS CORPORATION
    Inventors: Keisuke ARAMAKI, Yuma SATO, Yusuke KUBO
  • Publication number: 20240116146
    Abstract: A method for producing a heat transfer sheet, includes: (A1) forming a mixture including at least one of a carbon fiber and a boron nitride flake, an inorganic filler, and a binder resin into a molded body in which the at least one of the carbon fiber and the boron nitride flake is oriented in a thickness direction of the molded body; (B1) slicing the molded body into a sheet shape to obtain a molded sheet; (C1) pressing the molded sheet; and (D1), after the pressing, inserting the molded sheet between films and performing a vacuum packing of the molded sheet with the films such that an uncured component of the binder resin present inside the molded sheet is exuded to a surface of the molded sheet, which is the heat transfer sheet.
    Type: Application
    Filed: February 3, 2022
    Publication date: April 11, 2024
    Applicant: DEXERIALS CORPORATION
    Inventors: Keisuke MUKASA, Yusuke KUBO, Keisuke ARAMAKI
  • Publication number: 20240010898
    Abstract: Provided is a thermally conductive sheet which is highly flexible and of which the thermal resistance value has small load dependency. A thermally conductive sheet 1 contains a curable resin composition 2, a flaky thermally conductive filler 3, and a non-flaky thermally conductive filler 4, wherein the amount of change between the thermal resistance value at load of 1 kgf/cm2 and the thermal resistance value at load in a range greater than 1 kgf/cm2 and not greater than 3 kgf/cm2 is not greater than 0.4° C.·cm2/W, and the amount of change between the compression rate at load of 3 kgf/cm2 and the compression rate at load of 1 kgf/cm2 is not less than 20%.
    Type: Application
    Filed: August 3, 2021
    Publication date: January 11, 2024
    Applicant: DEXERIALS CORPORATION
    Inventors: Yuma SATO, Keisuke ARAMAKI, Yusuke KUBO
  • Publication number: 20230348679
    Abstract: A thermally conductive sheet includes: a binder resin; and a first thermally conductive filler oriented in a thickness direction of the thermally conductive sheet. The thermally conductive sheet has a contact thermal resistance with regard to an adherend of 0.46° C.·cm2/W or less. The first thermally conductive filler is preferably a fibrous thermally conductive filler and/or a flaky thermally conductive filler. The thermally conductive sheet preferably further includes a second thermally conductive filler which is at least one selected from a group consisting of alumina, aluminum, zinc oxide, boron nitride, aluminum nitride, graphite, and a magnetic powder.
    Type: Application
    Filed: August 6, 2021
    Publication date: November 2, 2023
    Applicant: DEXERIALS CORPORATION
    Inventors: Keisuke ARAMAKI, Yuma SATO, Yusuke KUBO
  • Patent number: 11742258
    Abstract: A thermally conductive sheet having a binder resin, a first thermally conductive filler, and a second thermally conductive filler, wherein the first thermally conductive filler and the second thermally conductive filler are dispersed in the binder resin, and the specific permittivity and the thermal conductivity are different in the thickness direction B and the surface direction A of the thermally conductive sheet. A thermally conductive sheet includes step A of preparing a resin composition for forming a thermally conductive sheet by dispersing a first thermally conductive filler and a second thermally conductive filler in a binder resin, step B of forming a molded block from the resin composition for forming a thermally conductive sheet, and step C of slicing the molded block into a sheet and obtaining a thermally conductive sheet having different relative permittivity and thermal conductivity in the thickness direction and the surface direction.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: August 29, 2023
    Assignee: DEXERIALS CORPORATION
    Inventors: Yuma Sato, Keisuke Aramaki, Yusuke Kubo
  • Patent number: 11597196
    Abstract: A method for producing a thermally conductive sheet, includes forming a molded body sheet having thermal conductivity and comprising a fibrous thermally conductive filler. A silicone resin film is formed by applying a silicone resin to a supporting body. At least one surface of the molded body sheet is directly affixed to a silicone resin side of the silicone resin film. The silicone resin is transferred to the at least one surface of the molded body sheet to form a silicone resin layer on the molded body sheet. The silicone resin layer is to be attached to a heat source or a heat dissipating member. The molded body sheet has a change in thermal resistance due to the transferring of the silicone resin of 0.5° C.·cm2/W or less.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: March 7, 2023
    Assignee: DEXERIALS CORPORATION
    Inventors: Yusuke Kubo, Keisuke Aramaki
  • Publication number: 20220262702
    Abstract: A thermally conductive sheet having a binder resin, a first thermally conductive filler, and a second thermally conductive filler, wherein the first thermally conductive filler and the second thermally conductive filler are dispersed in the binder resin, and the specific permittivity and the thermal conductivity are different in the thickness direction B and the surface direction A of the thermally conductive sheet. A thermally conductive sheet includes step A of preparing a resin composition for forming a thermally conductive sheet by dispersing a first thermally conductive filler and a second thermally conductive filler in a binder resin, step B of forming a molded block from the resin composition for forming a thermally conductive sheet, and step C of slicing the molded block into a sheet and obtaining a thermally conductive sheet having different relative permittivity and thermal conductivity in the thickness direction and the surface direction.
    Type: Application
    Filed: April 23, 2021
    Publication date: August 18, 2022
    Applicant: DEXERIALS CORPORATION
    Inventors: Yuma SATO, Keisuke ARAMAKI, Yusuke KUBO
  • Publication number: 20220240411
    Abstract: A thermal conductive sheet includes a cured product of a resin composition containing carbon fiber, an inorganic filler other than carbon fiber, and binder resin. The tack force of the sheet surface is 100 gf or greater, determined when the sheet between release films is subjected to press processing at 0.5 MPa for 30 sec, and after the films are peeled off, is indented by 50 ?m at 2 mm/second with a probe 5.1 mm in diameter and the probe is pulled away at 10 mm/sec. Additionally, (B/A)×100?80% is true, where A denotes the tack force of the sheet surface after the films are peeled off subsequent to press processing; and B denotes the tack force of the sheet surface when the sheet is indented by 50 ?m at 2 mm/second with a probe 5.1 mm in diameter and the probe is pulled away at 10 mm/second after exposure to atmosphere for 1 hour subsequent to press processing.
    Type: Application
    Filed: May 13, 2021
    Publication date: July 28, 2022
    Applicant: DEXERIALS CORPORATION
    Inventors: Keisuke MUKASA, Yusuke Kubo, Keisuke Aramaki
  • Publication number: 20220173494
    Abstract: The disclosure aims at providing an antenna array for 5G communications that has superior thermal dissipation and crosstalk suppression effect. To achieve the above-described object, an antenna array 1 for 5G communications according to the disclosure includes a substrate 10; at least one high-frequency semiconductor device 20, a noise-suppressing thermally conductive sheet 20, and a first thermal dissipation member 41 sequentially formed on one surface 10a of the substrate 10; and at least one antenna 50 and a second thermal dissipation member 42 sequentially formed on the other surface 10b of the substrate 10.
    Type: Application
    Filed: February 27, 2020
    Publication date: June 2, 2022
    Applicant: Dexerials Corporation
    Inventors: Sergey BOLOTOV, Hiroyuki RYOSON, Keisuke ARAMAKI, Yusuke KUBO
  • Patent number: 11296007
    Abstract: Provided is a thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: April 5, 2022
    Assignee: Dexerials Corporation
    Inventors: Hiroki Kanaya, Shinichi Uchida, Keisuke Aramaki
  • Publication number: 20220098462
    Abstract: A thermally conductive sheet excellent in adhesiveness to an electronic component, handleability and reworkability, a method for manufacturing the same, and a method for mounting a thermally conductive sheet, the sheet includes: a sheet body formed by curing a thermally conductive resin composition containing at least a polymer matrix component and a thermally conductive filler, wherein the volume ratio of the thermally conductive filler to the polymer matrix component is 1.00 to 1.70, the thermally conductive filler contains a fibrous thermally conductive filler, and the fibrous thermally conductive filler projects from the surface of the sheet body and is coated with an uncured component of the polymer matrix component.
    Type: Application
    Filed: December 9, 2020
    Publication date: March 31, 2022
    Applicant: DEXERIALS CORPORATION
    Inventors: Marina TOBATA, Keisuke ARAMAKI
  • Publication number: 20220089919
    Abstract: A thermally conductive sheet includes a sheet body and an adhesive layer. The sheet body is obtained by curing a thermally conductive resin composition. The thermally conductive resin composition includes a polymer matrix component and a fibrous thermally conductive filler. The adhesive layer is formed on at least one surface of the sheet body and imparts tackiness to the at least one surface of the sheet body. A volume of the adhesive layer is 0.0002 cm3 or more and 0.001 cm3 or less per 1 cm2 of the sheet body.
    Type: Application
    Filed: January 21, 2020
    Publication date: March 24, 2022
    Applicant: DEXERIALS CORPORATION
    Inventors: Yusuke KUBO, Keisuke ARAMAKI
  • Publication number: 20220080718
    Abstract: A method for producing a thermally conductive sheet, includes forming a molded body sheet having thermal conductivity and comprising a fibrous thermally conductive filler. A silicone resin film is formed by applying a silicone resin to a supporting body. At least one surface of the molded body sheet is directly affixed to a silicone resin side of the silicone resin film. The silicone resin is transferred to the at least one surface of the molded body sheet to form a silicone resin layer on the molded body sheet. The silicone resin layer is to be attached to a heat source or a heat dissipating member. The molded body sheet has a change in thermal resistance due to the transferring of the silicone resin of 0.5° C.·cm2/W or less.
    Type: Application
    Filed: January 21, 2020
    Publication date: March 17, 2022
    Applicant: DEXERIALS CORPORATION
    Inventors: Yusuke KUBO, Keisuke ARAMAKI
  • Publication number: 20220084902
    Abstract: Provided is a thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.
    Type: Application
    Filed: September 20, 2021
    Publication date: March 17, 2022
    Inventors: Hiroki Kanaya, Shinichi Uchida, Keisuke Aramaki
  • Publication number: 20210296207
    Abstract: A thermally conductive sheet excellent in adhesiveness to an electronic component, handleability and reworkability, a method for manufacturing the same, and a method for mounting a thermally conductive sheet. The sheet includes: a sheet body obtained by curing a binder resin containing at least a polymer matrix component and a fibrous thermally conductive filler, wherein the volume ratio of the fibrous thermally conductive filler to the binder resin is 0.6 or less considering the binder resin as 1, and the fibrous thermally conductive filler projects from the surface of the sheet body and is coated with an uncured component of the binder resin.
    Type: Application
    Filed: July 4, 2019
    Publication date: September 23, 2021
    Applicant: DEXERIALS CORPORATION
    Inventors: Marina TOBATA, Keisuke ARAMAKI
  • Patent number: 10892204
    Abstract: Disclosed is an electromagnetic wave absorbing heat conductive sheet having superior heat conductivity and electromagnetic wave absorbency. The electromagnetic wave absorbing heat conductive sheet comprises a polymer matrix component; a magnetic metal power; and a fibrous heat conductive filler oriented in one direction.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: January 12, 2021
    Assignee: Dexerials Corporation
    Inventors: Tatsuo Kumura, Yusuke Kubo, Keisuke Aramaki, Hiroyuki Ryoson
  • Publication number: 20200251402
    Abstract: A thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein a mass ratio (insulating-coated carbon fibers/binder resin) of the insulating-coated carbon fibers to the binder resin is less than 1.30, and wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.
    Type: Application
    Filed: April 21, 2020
    Publication date: August 6, 2020
    Inventors: Hiroki Kanaya, Shinichi Uchida, Shunsuke Uchida, Gupta Rishabh, Keisuke Aramaki
  • Patent number: 10734305
    Abstract: A thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein a mass ratio (insulating-coated carbon fibers/binder resin) of the insulating-coated carbon fibers to the binder resin is less than 1.30, and wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: August 4, 2020
    Assignee: DEXERIALS CORPORATION
    Inventors: Hiroki Kanaya, Shinichi Uchida, Shunsuke Uchida, Gupta Rishabh, Keisuke Aramaki