Patents by Inventor Keisuke Aramaki

Keisuke Aramaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10672682
    Abstract: A thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein a mass ratio (insulating-coated carbon fibers/binder resin) of the insulating-coated carbon fibers to the binder resin is less than 1.30, and wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: June 2, 2020
    Assignee: DEXERIALS CORPORATION
    Inventors: Hiroki Kanaya, Shinichi Uchida, Shunsuke Uchida, Gupta Rishabh, Keisuke Aramaki
  • Patent number: 10526519
    Abstract: A thermal conducting sheet including: a binder resin; carbon fibers; and a thermal conducting filler other than the carbon fibers, wherein a mass ratio (carbon fibers/binder resin) of the carbon fibers to the binder resin is less than 1.30, wherein an amount of the thermal conducting filler is from 48% by volume through 70% by volume, and wherein the carbon fibers are oriented in a thickness direction of the thermal conducting sheet.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: January 7, 2020
    Assignee: Dexerials Corporation
    Inventors: Hiroki Kanaya, Yu Nomura, Shunsuke Uchida, Shinichi Uchida, Keisuke Aramaki
  • Patent number: 10336929
    Abstract: A method of producing a heat conductive sheet without using a high-cost magnetic field generator. This is achieved by allowing a large amount of a fibrous filler to be contained in a thermosetting resin composition, so that good heat conductivity is obtained without applying a load that may interfere with the normal operation of a heat generating body and a radiator to the heat generating body and the radiator when the heat conductive sheet is disposed therebetween. The method includes: a step (A) of dispersing a fibrous filler in a binder resin to prepare a heat conductive sheet-forming composition; a step (B) of forming a molded block using the prepared heat conductive sheet-forming composition according to an extrusion molding method or a die molding method; a step (C) of slicing the formed molded block into a sheet; and a step (D) of pressing the sliced surface of the obtained sheet.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: July 2, 2019
    Assignee: DEXERIALS CORPORATION
    Inventor: Keisuke Aramaki
  • Publication number: 20190080978
    Abstract: Disclosed is an electromagnetic wave absorbing heat conductive sheet having superior heat conductivity and electromagnetic wave absorbency. The electromagnetic wave absorbing heat conductive sheet comprises a polymer matrix component; a magnetic metal power; and a fibrous heat conductive filler oriented in one direction.
    Type: Application
    Filed: March 24, 2017
    Publication date: March 14, 2019
    Applicant: Dexerials Corporation
    Inventors: Tatsuo KUMURA, Yusuke KUBO, Keisuke ARAMAKI, Hiroyuki RYOSON
  • Publication number: 20190055443
    Abstract: A thermal conducting sheet including: a binder resin; carbon fibers; and a thermal conducting filler other than the carbon fibers, wherein a mass ratio (carbon fibers/binder resin) of the carbon fibers to the binder resin is less than 1.30, wherein an amount of the thermal conducting filler is from 48% by volume through 70% by volume, and wherein the carbon fibers are oriented in a thickness direction of the thermal conducting sheet.
    Type: Application
    Filed: January 13, 2017
    Publication date: February 21, 2019
    Inventors: Hiroki Kanaya, Yu Nomura, Shunsuke Uchida, Shinichi Uchida, Keisuke Aramaki
  • Publication number: 20190035712
    Abstract: A thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein a mass ratio (insulating-coated carbon fibers/binder resin) of the insulating-coated carbon fibers to the binder resin is less than 1.30, and wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.
    Type: Application
    Filed: January 13, 2017
    Publication date: January 31, 2019
    Inventors: Hiroki Kanaya, Shinichi Uchida, Shunsuke Uchida, Gupta Rishabh, Keisuke Aramaki
  • Publication number: 20190019739
    Abstract: Provided is a thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.
    Type: Application
    Filed: January 13, 2017
    Publication date: January 17, 2019
    Inventors: Hiroki Kanaya, Shinichi Uchida, Keisuke Aramaki
  • Patent number: 10106672
    Abstract: A heat conductive sheet is provided in which the frequency of contact between fibrous fillers is high. In the heat conductive sheet, the exposed ends of fibrous fillers do not remain exposed and are embedded into the sheet, and it is unnecessary to apply a load that may interfere with the normal operation of a heat generating body and a heat dissipator to the heat generating body and the heat dissipator when the heat conductive sheet is disposed therebetween. The heat conductive sheet contains fibrous fillers and a binder resin, and the ratio of the fibrous fillers that are not oriented in the direction of the thickness of the heat conductive sheet in all the fibrous fillers is 45 to 95%.
    Type: Grant
    Filed: July 5, 2013
    Date of Patent: October 23, 2018
    Assignee: DEXERIALS CORPORATION
    Inventors: Keisuke Aramaki, Takuhiro Ishii
  • Patent number: 10012453
    Abstract: A thermally conductive sheet having good thermal conductivity in the thickness direction and a method for producing a thermally conductive sheet. A thermally conductive sheet having a surface with an L* value in a L*a*b color system of 29 or more and 47 or less is obtained by preparing a thermally conductive composition comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, extrusion-molding the thermally conductive composition to obtain a columnar cured product, and cutting the columnar cured product in a direction almost perpendicular to a length direction of a column to a predetermined thickness.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: July 3, 2018
    Assignee: Dexerials Corporation
    Inventor: Keisuke Aramaki
  • Patent number: 9966324
    Abstract: A thermally conductive sheet, which contains: a binder; carbon fibers; and an inorganic filler, wherein the thermally conductive sheet is to be sandwiched between a heat source and a heat dissipation member of a semiconductor device, wherein the carbon fibers have an average fiber length of 50 ?m to 250 ?m, wherein thermal resistance of the thermally conductive sheet is less than 0.17 K·cm2/W, as measured in accordance with ASTM-D5470 with a load of 7.5 kgf/cm2, and wherein the thermally conductive sheet has an average thickness of 500 ?m or less.
    Type: Grant
    Filed: June 18, 2014
    Date of Patent: May 8, 2018
    Assignee: DEXERIALS CORPORATION
    Inventors: Keisuke Aramaki, Atsuya Yoshinari, Takuhiro Ishii, Shin-ichi Uchida, Masahiko Ito, Syunsuke Uchida
  • Patent number: 9944840
    Abstract: A method of producing a heat conductive sheet includes: a step (A) of dispersing a fibrous filler and a spherical filler in a binder resin to prepare a heat conductive sheet-forming composition; a step (B) of forming a molded block using the prepared heat conductive sheet-forming composition; a step (C) of slicing the formed molded block to a desired thickness to form a sheet; and a step (D) of pressing the sliced surface of the formed sheet, the sliced surface being pressed such that the thermal resistance value of the sheet after pressing becomes lower than the thermal resistance value of the sheet before pressing.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: April 17, 2018
    Assignee: DEXERIALS CORPORATION
    Inventor: Keisuke Aramaki
  • Patent number: 9922901
    Abstract: A thermally conductive sheet including a sheet body that is a cured product of a thermally conductive resin composition including a binder resin and carbon fibers covered with insulating coating films, wherein the carbon fibers exposed on a surface of the sheet body are not covered with the insulating coating films and are covered with a component of the binder resin.
    Type: Grant
    Filed: October 27, 2015
    Date of Patent: March 20, 2018
    Assignee: DEXERIALS CORPORATION
    Inventors: Keisuke Aramaki, Hiroki Kanaya, Masahide Daimon
  • Publication number: 20170309542
    Abstract: A thermally conductive sheet including a sheet body that is a cured product of a thermally conductive resin composition including a binder resin and carbon fibers covered with insulating coating films, wherein the carbon fibers exposed on a surface of the sheet body are not covered with the insulating coating films and are covered with a component of the binder resin.
    Type: Application
    Filed: October 27, 2015
    Publication date: October 26, 2017
    Applicant: Dexerials Corporation
    Inventors: Keisuke ARAMAKI, Hiroki KANAYA, Masahide DAIMON
  • Patent number: 9560791
    Abstract: Provided is a method of manufacturing a heat conductive sheet with improved adhesion and heat conductivity. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and pressing the molded product sheet.
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: January 31, 2017
    Assignee: Dexerials Corporation
    Inventors: Keisuke Aramaki, Atsuya Yoshinari, Takuhiro Ishii, Shinichi Uchida, Masahiko Ito
  • Patent number: 9536804
    Abstract: Provided is a method of manufacturing a heat conductive sheet that itself is imparted with stickiness and has reduced heat resistance due to improved adhesion to a heat generator and a heat dissipater and that may be fixed provisionally without the need for using an adhesive agent or the like. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and coating an entire surface of a sheet main body (7) with an uncured component (8) of the binder resin oozing from the sheet main body (7).
    Type: Grant
    Filed: June 27, 2014
    Date of Patent: January 3, 2017
    Assignee: Dexerials Corporation
    Inventors: Keisuke Aramaki, Atsuya Yoshinari, Takuhiro Ishii, Shinichi Uchida, Masahiko Ito
  • Patent number: 9437521
    Abstract: A thermally conductive sheet, comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, wherein the thermally conductive sheet has a compressibility of 40% or more.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: September 6, 2016
    Assignee: DEXERIALS CORPORATION
    Inventors: Keisuke Aramaki, Takuhiro Ishii, Masahiko Ito, Shinichi Uchida, Atsuya Yoshinari, Syunsuke Uchida
  • Patent number: 9365001
    Abstract: A thermally conductive sheet has cut surfaces with low surface roughness and hence shows reduced thermal resistance at the interfaces, and high thermal conductivity in the thickness direction. Thus, the thermally conductive sheet can be interposed between any of various heat sources and a radiation member. The process for producing the thermally conductive sheet includes at least: an extrusion molding step in which a thermally conductive composition containing a polymer, an anisotropic thermally conductive filler, and a filler is extruded with an extruder to thereby mold an extrusion-molded product in which the anisotropic thermally conductive filler has been oriented along the extrusion direction; a curing step in which the extrusion-molded product is cured to obtain a cured object; and a slicing step in which the cured object is sliced into a given thickness with an ultrasonic cutter in the direction perpendicular to the extrusion direction.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: June 14, 2016
    Assignee: DEXERIALS CORPORATION
    Inventors: Hiroyuki Usui, Keisuke Aramaki
  • Publication number: 20160150680
    Abstract: Provided is a method of manufacturing a heat conductive sheet with improved adhesion and heat conductivity. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and pressing the molded product sheet.
    Type: Application
    Filed: June 27, 2014
    Publication date: May 26, 2016
    Applicant: Dexerials Corporation
    Inventors: Keisuke ARAMAKI, Atsuya YOSHINARI, Takuhiro ISHII, Shinichi UCHIDA, Masahiko ITO
  • Publication number: 20160141223
    Abstract: Provided is a method of manufacturing a heat conductive sheet that itself is imparted with stickiness and has reduced heat resistance due to improved adhesion to a heat generator and a heat dissipater and that may be fixed provisionally without the need for using an adhesive agent or the like. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and coating an entire surface of a sheet main body (7) with an uncured component (8) of the binder resin oozing from the sheet main body (7).
    Type: Application
    Filed: June 27, 2014
    Publication date: May 19, 2016
    Applicant: Dexerials Corporation
    Inventors: Keisuke ARAMAKI, Atsuya YOSHINARI, Takuhiro ISHII, Shinichi UCHIDA, Masahiko ITO
  • Publication number: 20160118316
    Abstract: A thermally conductive sheet, comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, wherein the thermally conductive sheet has a compressibility of 40% or more.
    Type: Application
    Filed: January 6, 2016
    Publication date: April 28, 2016
    Inventors: Keisuke Aramaki, Takuhiro Ishii, Masahiko Ito, Shinichi Uchida, Atsuya Yoshinari, Syunsuke Uchida