Patents by Inventor Keisuke Arimura

Keisuke Arimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060068323
    Abstract: A photosensitive lithographic printing plate comprising: a hydrophilic support; a photosensitive layer; and a protective layer, wherein the photosensitive layer contains a compound having an ethylenically unsaturated double bond, a high molecular binder having a crosslinking group and a hexaaryl biimidazole compound; and the protective layer has an oxygen permeability at 25° C. under one atmosphere of from 1.0 to 20 cc/m2·day.
    Type: Application
    Filed: September 26, 2005
    Publication date: March 30, 2006
    Inventors: Keisuke Arimura, Takahiro Goto
  • Publication number: 20060024611
    Abstract: A photosensitive composition comprising: at least one photopolymerization initiator; an N-oxyamide compound represented by formula (1); and a compound of undergoing a reaction by an effect of at least one of a radical and an acid to irreversibly change in its physical or chemical property, wherein X, Y and Z each independently represents a monovalent substituent.
    Type: Application
    Filed: July 15, 2005
    Publication date: February 2, 2006
    Inventors: Tomotaka Tsuchimura, Keisuke Arimura, Tadahiro Sorori
  • Publication number: 20050064330
    Abstract: A lithographic printing plate precursor comprising, in this order, a support, an undercoat layer and a photosensitive layer containing an infrared absorber, a polymerization initiator, a polymerizable compound and a binder polymer, wherein the undercoat layer contains a polymer compound having an acid group, and Ra, ?S and a45 of a surface of the support are satisfied with the following conditions (i) to (iii), respectively: (i) Ra: 0.2 to 0.40 ?m, (ii) AS: 35 to 85%, (iii) a45: 25 to 55%, in which Ra, ?S (%) and a45 are defined herein.
    Type: Application
    Filed: September 22, 2004
    Publication date: March 24, 2005
    Inventors: Keisuke Arimura, Takahiro Goto