Abstract: A substrate processing apparatus includes a processing container configured to accommodate a plurality of substrates therein, a gas supply configured to supply a first raw material gas of a compound containing Si or Ge and H and a second raw material gas of a compound containing Si or Ge and a halogen element into the processing container; and an exhauster configured to evacuate an inside of the processing container, wherein the gas supply has a dispersion nozzle provided with a plurality of gas holes for discharging the first raw material gas and the second raw material gas, and the substrate processing apparatus further comprises a heater configured to heat the first raw material gas and the second raw material gas in the dispersion nozzle.

Abstract: There is provided a film forming method including: supplying a halogen-free silicon raw material gas and a halogen-containing silicon raw material gas into a processing container while lowering a temperature of a substrate accommodated in the processing container from a first temperature to a second temperature in a temperature lowering process; and supplying the halogen-free silicon raw material gas and the halogen-containing silicon raw material gas into the processing container while maintaining the temperature of the substrate at a third temperature in a temperature stabilizing process, that occurs after the temperature lowering process.

Abstract: There is provided a film forming method including: supplying a halogen-free silicon raw material gas into a processing container that accommodates a substrate therein in a halogen-free silicon raw material gas supply process; supplying a halogen-containing silicon raw material gas into the processing container in a halogen-containing silicon raw material gas supply process; removing the halogen-containing silicon raw material gas inside the processing container in a halogen-containing silicon raw material gas removal process; and repeating a cycle including a sequence of the halogen-free silicon raw material gas supply process, the halogen-containing silicon raw material gas supply process, and the halogen-containing silicon raw material gas removal process in a continuous manner.

Abstract: According to one embodiment of the present disclosure, a method for forming a crystallized semiconductor film having a specific grain size on a substrate includes: forming a seed layer on the substrate accommodated in a processing container; vacuuming an interior of the processing container to a medium vacuum or less in a state in which the substrate, on which the seed layer is formed, is accommodated in the processing container; forming an amorphous semiconductor film on the seed layer after vacuuming the interior of the processing container; and crystallizing the amorphous semiconductor film by heat processing.

Abstract: A printing system includes a printing device, a platen roller, a controller, and an interface. The printing device includes a thermal head, a ribbon drive source, and a head drive source. When receiving a print command, the controller executes head movement control for moving the thermal head and ribbon acceleration control for accelerating a transport speed of an ink ribbon to a target speed. After completion of the head movement control and the ribbon acceleration control, the controller is configured to control the thermal head to perform printing on the print medium. At least before receiving the print command, the controller is configured to determine a printable distance over which the print medium is transported from the reception of the print command till the completion of the head movement control and the ribbon acceleration control and outputs the determined printable distance through the interface.

Abstract: A printing system includes a platen roller, a storage unit, a controller, and a printing device including a thermal head, a head drive source that is configured to move the thermal head in a first direction along which the thermal head approaches or separates from the platen roller, and at least a sensor that is configured to detect a position of the thermal head. In the printing system, the controller is configured to determine whether setting information of a print position is stored in the storage unit, detect the print position with the head drive source and the sensor when the setting information is not stored in the storage unit, and cause the head drive source to move the thermal head from a first position to a second position, when the setting information is stored in the storage unit.

Abstract: A printing system includes: a movable printing device; a control unit; and a device moving unit that is configured to move the movable printing device, the movable printing device includes a thermal head and a ribbon transport unit, the control unit is configured to: execute print operation control including: device position control; ribbon transport control; and head print control; execute, when a print stop command is received, print stop control; execute, when a print resume command is received after a start of execution of the print stop control, the print resume control, and execute, when predetermined information is received after the start of execution of the print stop control, reset control of causing the device moving unit to move the movable printing device to a reference position, causing the ribbon transport unit to transport the ink ribbon by a predetermined amount and then restarting the print operation control.

Abstract: A printing system includes: a printing device including a thermal head, a supplier, a winder, and a ribbon transport mechanism; and a controller configured to: transport an ink ribbon in a first direction from the supplier to the winder and heat the ink ribbon to perform printing; rewind the ink ribbon subjected to the printing in a second direction opposite to the first direction; after again receiving a print command, rewind the ink ribbon in the second direction by a first length corresponding to a length required to reach a printable speed; after the rewindings, store a second length corresponding to a length of the ink ribbon subjected to the printing upstream of the thermal head in the first direction; and feed the ink ribbon in the first direction by the stored second length.

Abstract: A printing system includes: a printing device including a thermal head, a supplier, a winder and a ribbon transport mechanism; a moving mechanism moving the printing device in a width direction of an ink ribbon; and a controller configured to: move the printing device in the width direction; when the printing device is moved for printing of a second row, rewind the ink ribbon; store the longest length of use of the ink ribbon by the printing in a first column of the ink ribbon; when printing with the thermal head proceeds to a second column, determine a transport amount of the ink ribbon based on the stored length; and after the first column of the ink ribbon is used by the printing, transport the ink ribbon based on the determined transport amount.

Abstract: A gas supply system includes: a plurality of tanks that are filled with a gas; a supply pipe that branches and is connected to the plurality of tanks and supplies the gas to a destination of supply; a plurality of shutoff valves that shut off connections between the plurality of tanks and the supply pipe; a plurality of temperature measuring units that measures an internal temperature of the plurality of tanks; and a control unit that determines the shutoff valve that is to be opened first out of the plurality of shutoff valves by using the internal temperatures of the plurality of tanks, which are measured at a time of start of the supply of the gas, when the control unit switching the plurality of shutoff valves from a closed state to an open state at the time of start of the supply of the gas.

Abstract: There is provided a film forming apparatus for performing a film forming process on substrates by heating the substrates while the substrates are held in a shelf shape by a substrate holder in a vertical reaction container. The film forming apparatus includes: an exhaust part configured to evacuate the reaction container; a gas supply part configured to supply a film forming gas into the reaction container; a heat insulating member provided above or below an arrangement region of the substrates to overlap with the arrangement region and configured to thermally insulate the arrangement region from an upper region above the arrangement region or a lower region below the arrangement region; and a through-hole provided in the heat insulating member at a position overlapping with central portions of the substrates to adjust a temperature distribution in a plane of each substrate held near the heat insulating member.

Abstract: The present invention relates to a fixing apparatus including a tubular film, a heater provided at an inside of the film, a protection element provided at the inside of the film, and at least one conductive member provided at the inside of the film. The protection element includes two terminals and a switch that turns off to shut off power to the heater when the heater abnormally generates heat. A first end of the conductive member is electrically connected to one of the terminals of the protection element. The conductive member is not coated with an insulator, and a second end of the conductive member projects out of the film so that the cost of the fixing apparatus is reduced.

Abstract: A heater holder includes a restriction portion and a recessed portion. The restriction portion determines the position of a cable in the longitudinal direction of the heater. The recessed portion, against which a bare conductive portion of the cable is to be positioned, is provided at a position that is different from the position of the restriction portion as viewed in a direction intersecting with the longitudinal direction. A wire is joined to the bare conductive portion somewhere between the restriction portion and the recessed portion.

Abstract: There is provided a substrate processing apparatus including: a processing container accommodating a boat on which a substrate is mounted; and an injector that extends in a vertical direction along an inner wall of the processing container in a vicinity of the processing container and has a plurality of gas holes in a longitudinal direction, wherein the plurality of gas holes is oriented toward the inner wall in the vicinity of the processing container.

Abstract: There is provided a method of forming a silicon film, which includes: a film forming step of forming the silicon film on a base, the silicon film having a film thickness thicker than a desired film thickness; and an etching step of reducing the film thickness of the silicon film by supplying an etching gas containing bromine or iodine to the silicon film.

Abstract: There is provided a substrate processing method comprising etching a silicon film formed on a surface of a substrate accommodated in a processing container by supplying an etching gas to the substrate, purging the processing container by supplying a hydrogen-containing gas that reacts with the etching gas as a purge gas into the processing container, and forming an additional silicon film on the substrate.

Abstract: A non-transitory computer-readable storage medium storing a display control program that causes a computer to execute a process, the process including, monitoring an operation of a user for one or a plurality of display contents displayed on a screen, determining whether a result of the monitoring corresponds to at least one of a plurality of operation patterns stored in a memory, and outputting, on the screen, information corresponding to the one or the plurality of display contents when the result of the monitoring corresponds to the at least one of the plurality of operation patterns, the information being different in accordance with which operation pattern, included in the plurality of operation patterns, corresponds to the result of the monitoring.

Abstract: The present invention relates to a fixing apparatus including a tubular film, a heater provided at an inside of the film, a protection element provided at the inside of the film, and at least one conductive member provided at the inside of the film. The protection element includes two terminals and a switch that turns off to shut off power to the heater when the heater abnormally generates heat. A first end of the conductive member is electrically connected to one of the terminals of the protection element. The conductive member is not coated with an insulator, and a second end of the conductive member projects out of the film so that the cost of the fixing apparatus is reduced.

Abstract: The present invention relates to a fixing apparatus including a tubular film, a heater provided at an inside of the film, a protection element provided at the inside of the film, and at least one conductive member provided at the inside of the film. The protection element includes two terminals and a switch that turns off to shut off power to the heater when the heater abnormally generates heat. A first end of the conductive member is electrically connected to one of the terminals of the protection element. The conductive member is not coated with an insulator, and a second end of the conductive member projects out of the film so that the cost of the fixing apparatus is reduced.