Abstract: To provide a manufacturing method, for a liquid discharge head that includes a silicon substrate in which a supply port is formed for supplying a liquid, includes the steps of: providing the silicon substrate, a mask layer provided with an opening that corresponds to the supply port being provided on one face of the silicon substrate; forming a groove in the silicon substrate along the shape of the opening in the mask layer; removing, using sandblasting, silicon of the silicon substrate from the inner wall of the groove in the silicon substrate; and performing, from the one face, anisotropic etching of the silicon substrate that has been sandblasted, and forming the supply port.

Abstract: A method of manufacturing a substrate for a liquid discharge head having a silicon substrate in which a liquid supply port is provided includes providing the silicon substrate, an etching mask layer having an opening being formed on a one surface of the silicon substrate, forming a region comprising an amorphous silicon in the interior of the silicon substrate by irradiating the silicon substrate with laser light, forming a recess, which has an opening at a part of a portion exposed from said opening on said one surface, from said one surface of the silicon substrate toward the region, and forming the supply port by performing etching on the silicon substrate in which the recess and the region have been formed from said one surface through the opening of the etching mask layer.

Abstract: A method for manufacturing a substrate for a liquid discharge head having a silicon substrate provided with a supply port of a liquid comprises steps of preparing a substrate which is provided with a passive film on one side face thereof, has a first recess and a second recess provided therein so as to penetrate from the one side face into the inner part through the passive film, wherein the recesses satisfy a relation of a×tan 54.7 degrees?d, when a is defined as a distance between the first recess and the second recess, and d is defined as a depth of the second recess, and forming the supply port by anisotropically etching the crystal from the one side face.

Abstract: Provided is a method of manufacturing a substrate for a liquid discharge head, the substrate including a silicon substrate with a liquid supply opening formed therein, the method including: forming one processed portion by laser processing on the substrate from one surface of the substrate; expanding the one processed portion to form a recess portion by performing laser processing at a position which overlaps a part of the one processed portion and does not overlap another part of the one processed portion; and etching from the one surface the substrate with the recess portion formed therein to form the liquid supply opening.

Abstract: There is provided a substrate for an inkjet printing head and a method for manufacturing the same, in which the substrate has a structure that different kinds of metals do not come into contact with ink or moisture. For this purpose, the structure is constituted such that a diffusion preventing layer for mainly protecting a lower layer among power wiring metals is covered by a metal layer for mainly supplying power, in connection with its upper surface and at least part of a side surface. Herewith, since a single metal appears on a surface of the power wiring including up to its side surface, even circumstance occurs of coming into contact with the ink or the moisture, a battery reaction accompanied by difference of ionization tendency is not generated, and thus corrosion or short-circuit of the power wiring is suppressed.