Abstract: A parallel driving device that drives parallel-connected semiconductor elements includes a control unit and a gate driving circuit. The control unit detects a temperature difference between the semiconductor elements on the basis of detected values by temperature sensors that detect temperatures of the individual semiconductor elements. The control unit generates a control signal for changing the timing at which to turn on a first semiconductor element specified from the semiconductor elements on the basis of the temperature difference. The gate driving circuit generates a first driving signal for driving the semiconductor elements, and generates a second driving signal that is the first driving signal delayed on the basis of the control signal, and applies the second driving signal to the first semiconductor element.

Abstract: A current sensor capable of efficiently cooling a busbar by using a cooling device includes a busbar, a shield disposed to face the busbar, a magnetic sensor disposed between the shield and the busbar, and an enclosure that integrally encases part of the busbar, the shield, and the magnetic sensor. When a side on which the busbar is disposed in the X-axis direction in which the busbar, the magnetic sensor, and the shield are arranged is defined as an X1 side, the busbar is disposed on the X1 side from the center line of the enclosure, and at least the X1 side of the enclosure is disposed to face the cooling device.

Abstract: Provided is a wireless LAN system in which an interference control signal transmitter that is provided in the surroundings of the wireless LAN base station and the wireless LAN terminal, and is configured to collect wireless environment information regarding the interfering AP/STA, and transmit, to the interfering AP/STA, an interference control signal that is to be used to set a transmission waiting period; and an interference control signal management device configured to collect the wireless environment information from the interference control signal transmitter, determine the interference control signal transmitter whose communication area includes the interfering AP/STA based on the wireless environment information, and control the determined interference control signal transmitter to transmit the interference control signal to be used to set the transmission waiting period that corresponds to a length of time of the communication between the wireless LAN base station and the wireless LAN terminal, wher

Abstract: A current detecting device has: a bus bar through which a current under measurement flows; a fastening member for fastening an external member to the bus bar; a chassis formed integrally with the bus bar and a shield, the chassis holding the bus bar and fastening member in a mutual contact state; and a magnetic sensor placed so as to face the bus bar, the magnetic sensor being capable of detecting a magnetic field generated when the current under measurement flows through the bus bar. The bus bar has a fastening terminal portion on the same side as an end of the bus bar, the fastening terminal portion being in contact with the external member. A connection surface is provided so as to be exposed from the chassis, the connection surface being a surface through which the fastening terminal portion is brought into contact with the external member.

Abstract: A current sensor according to the present invention includes a bus bar through which a measuring current flows; a nut with which the bus bar and an external terminal are brought into contact with and fastened to each other; a magnetic sensor capable of detecting a magnetic field generated when a current flows through the bus bar; a case member having a housing area in which the magnetic sensor is allowed to be housed, the case member sealing the bus bar and the nut inside; and a cover member provided over the housing area. The case member has an open part in which a portion of the nut is exposed. The open part is covered by an insulative protective member. Therefore, shavings generated when a bolt for fastening an external terminal is screwed into the nut are prevented from dropping to the outside of the current sensor.

Abstract: Fixed conductive plates are buried in a case. In its internal space, a first contact surface, which is part of each fixed conductive plate, and a second contact surface, which is an inner surface of the case, are opposite to each other, and an elastic conductive plate is interposed in this opposing portion. The elastic conductive plate is structured so that, in a restricting portion, a support piece portion is fitted to the thin plate portion of the fixed conductive plate and that an elastic arm portion extends from the support piece portion.

Abstract: An information sharing support device supports sharing of a plurality of pieces of sharing target information related to the development and the manufacture of a manufacturing target apparatus, the information sharing support device including: a tagging unit for attaching a tag selected from a plurality of tags to each of the plurality of pieces of sharing target information; and a sharing target information managing unit for managing the plurality of pieces of sharing target information in association with each other on the basis of the tag attached to each of the plurality of pieces of sharing target information, wherein the plurality of pieces of sharing target information includes basic sharing target information and additional sharing target information that is additionally input to the basic sharing target information by a staff member at a manufacturing site of the manufacturing target apparatus, and a tag attached to the additional sharing target information includes a tag attached to the basic sharin

Abstract: A wheel portion allows a shaft body that serves as a detection object to be inserted therein in a direction of a rotational axis from a position in front of the wheel portion, and is rotated about the rotational axis when the shaft body is rotated. The wheel portion includes a tubular portion in which the shaft body is inserted and a projecting edge portion extending away from the rotational axis at a front end of the tubular portion. The housing portion includes a cover portion having a hollow tubular opening portion in which the shaft body is inserted. The cover portion and the wheel portion are engaged with each other such that the opening portion is located on an inner side of the projecting edge portion.

Abstract: According to an aspect, a semiconductor device and an IO-cell include a plurality of first power supply lines and a plurality of second power supply lines alternately arranged in a first direction, the first and second power supply lines each being supplied with electric power in which the voltage of the electric power supplied to the first power supply is different from that supplied to the second power supply, and a third power supply line formed in a wiring layer different from a wiring layer in which the first and second power supply lines are arranged, the third power supply line being connected to adjacent first power supply lines among the plurality of first power supply lines through a via, in which all of the first, second and third power supply lines are formed so as to extend in a second direction perpendicular to the first direction.

Abstract: A wheel portion allows a shaft body that serves as a detection object to be inserted therein in a direction of a rotational axis from a position in front of the wheel portion, and is rotated about the rotational axis when the shaft body is rotated. The wheel portion includes a tubular portion in which the shaft body is inserted and a projecting edge portion extending away from the rotational axis at a front end of the tubular portion. The housing portion includes a cover portion having a hollow tubular opening portion in which the shaft body is inserted. The cover portion and the wheel portion are engaged with each other such that the opening portion is located on an inner side of the projecting edge portion.

Abstract: Fixed conductive plates are buried in a case. In its internal space, a first contact surface, which is part of each fixed conductive plate, and a second contact surface, which is an inner surface of the case, are opposite to each other, and an elastic conductive plate is interposed in this opposing portion. The support piece portion of the elastic conductive plate, is constrained from above by a restricting support portion and from below by a restricting opposing portion at a position close to a boundary portion with an elastic arm portion.

Abstract: Fixed conductive plates are buried in a case. In its internal space, a first contact surface, which is part of each fixed conductive plate, and a second contact surface, which is an inner surface of the case, are opposite to each other, and an elastic conductive plate is interposed in this opposing portion. The elastic conductive plate is structured so that, in a restricting portion, a support piece portion is fitted to the thin plate portion of the fixed conductive plate and that an elastic arm portion extends from the support piece portion.

Abstract: Fixed conductive plates are buried in a case. In its internal space, a first contact surface, which is part of each fixed conductive plate, and a second contact surface, which is an inner surface of the case, are opposite to each other, and an elastic conductive plate is interposed in this opposing portion. The support piece portion of the elastic conductive plate, is constrained from above by a restricting support portion and from below by a restricting opposing portion at a position close to a boundary portion with an elastic arm portion.

Abstract: A first main body portion and a second main body portion of an electronic package are mounted on a mount portion of a support body, first metal projections are caused to enter first receiving recesses, and second metal projections are caused to enter second receiving recesses. When a clip member is mounted in the a first direction, the first metal projections are pressed by first pressing portions of the clip member, the second metal projections are pressed by second pressing portions of the clip member, and an elastic piece is pressed against a rear side of the support body. Thus, the electronic package is secured.

Abstract: According to an aspect, a semiconductor device and an IO-cell include a plurality of first power supply lines and a plurality of second power supply lines alternately arranged in a first direction, the first and second power supply lines each being supplied with electric power in which the voltage of the electric power supplied to the first power supply is different from that supplied to the second power supply, and a third power supply line formed in a wiring layer different from a wiring layer in which the first and second power supply lines are arranged, the third power supply line being connected to adjacent first power supply lines among the plurality of first power supply lines through a via, in which all of the first, second and third power supply lines are formed so as to extend in a second direction perpendicular to the first direction.

Abstract: According to an aspect, a semiconductor device and an IO-cell include a plurality of first power supply lines and a plurality of second power supply lines alternately arranged in a first direction, the first and second power supply lines each being supplied with electric power in which the voltage of the electric power supplied to the first power supply is different from that supplied to the second power supply, and a third power supply line formed in a wiring layer different from a wiring layer in which the first and second power supply lines are arranged, the third power supply line being connected to adjacent first power supply lines among the plurality of first power supply lines through a via, in which all of the first, second and third power supply lines are formed so as to extend in a second direction perpendicular to the first direction.

Abstract: There are provided a fine concave-convex structure substrate which is hydrophobic and excellent in heat resistance, a solution used for producing the concave-convex structure substrate, and a method for producing the concave-convex structure substrate. The concave-convex structure substrate having the concave-convex structure includes a concave-convex structure layer made of a sol-gel material, and a contact angle of water on the sol-gel material in a flat and smooth film shape is not less than 80°. The concave-convex structure substrate according to the present invention has a hydrophobic surface, and thus, in the element in which the concave-convex structure substrate is incorporated, moisture adsorption onto the surface of the concave-convex structure substrate can be prevented, thereby making it possible to lengthen a service life of the element.