Abstract: A substrate for a surface light emitting device in which a transparent electrode, an organic thin film layer, and a cathode electrode are sequentially stacked, the substrate including: a transparent support substrate; and a highly refractive layer that is disposed between the support substrate and the transparent electrode and comprises at least one layer having a refractive index that is equal to or greater than a refractive index of the support substrate, wherein the highly refractive layer comprises a light diffusion unit that diffuses light incident from the transparent electrode and a planarized surface that contacts the transparent electrode. Accordingly, a Haze value of the highly refractive layer is set to be 5% or less, and a diameter of bubbles existing in the highly refractive layer is set to be 1/10th or less of a thickness of the highly refractive layer.

Abstract: A vacuum insulation material includes a pair of gas barrier exterior materials, a core material including a cellulose structure having porosity of greater than or equal to about 80% under reduced pressure of about 1 Pa, where the cellulose structure has a unit length of greater than or equal to about 1 ?m and less than or equal to about 5 mm in the heat-insulation direction, and the method of manufacturing the same, and a gas adsorption agent, where the core material and the gas adsorption agent are interposed between the pair of gas barrier exterior materials and sealed inside of the pair of gas barrier exterior materials under reduced pressure.

Abstract: A vacuum insulation includes a core material and a gas adsorption agent interposed between a first gas barrier material and a second gas barrier material, wherein the first and the second gas barrier materials sealingly enclose the core material and the gas adsorption agent, and wherein at least one of the first and the second gas barrier materials includes a laminate including a copper alloy foil and a polymeric material.

Abstract: A barrier film for an electronic device includes: a resin film; an adsorption layer disposed on a side of the resin film and including an inorganic material, which is electrostatically chargeable with a positive charge or a negative charge and having higher hydrophilicity than a surface of the resin film; and a stacked layer disposed on a side of the adsorption layer and including a plate-shaped particle layer including an inorganic plate-shaped particle, which is electrostatically chargeable with a positive charge or a negative charge, and a binder layer including a binder particle, which is electrostatically chargeable with a positive charge or a negative charge, where the plate-shaped particle layer and binder layer are alternately stacked.

Abstract: A section signature stacking body where one or more section signatures are stacked in a proper appearance is formed and carried out. A section signature accumulating apparatus includes: a first carrying part configured to receive and carry the manufactured section signature; a classifying/carrying part configured to classify N (N is an integer equal to or larger than 2 section signatures having the same configuration transported by the first carrying part to N different section signature accumulating parts one by one to carry the section signatures; N section signature accumulating parts configured to stock the section signatures carried by the classifying/carrying part and form a section signature stacking body where one or more sections signatures are stacked; and a second carrying part configured to carry N section signature stacking bodies discharged from the N section signature accumulating parts, respectively.

Abstract: A barrier film including a plurality of cured layers each cured layer including a curing product of a polysilazane photocurable precursor, an uncured layer disposed between a first and a second cured layer of the plurality of cured layers, the uncured layer including the polysilazane photocurable precursor, and a gradient composition layer disposed between the first and the second cured layer and the uncured layer, wherein a concentration of the polysilazane photocurable precursor in the gradient composition layer increases with a distance from the first and the second cured layers toward the uncured layer.

Abstract: A section signature stacking body where one or more section signatures are stacked in a proper appearance is formed and carried out. A section signature accumulating apparatus includes: a first carrying part configured to receive and carry the manufactured section signature; a classifying/carrying part configured to classify N (N is an integer equal to or larger than 2 section signatures having the same configuration transported by the first carrying part to N different section signature accumulating parts one by one to carry the section signatures; N section signature accumulating parts configured to stock the section signatures carried by the classifying/carrying part and form a section signature stacking body where one or more sections signatures are stacked; and a second carrying part configured to carry N section signature stacking bodies discharged from the N section signature accumulating parts, respectively.

Abstract: A barrier film for an electronic device, the barrier film including a resin film, and a layer-by-layer stack portion including a first inorganic material layer and a second inorganic material layer which are alternately disposed on the resin film, wherein the first inorganic material layer and the second inorganic material layer are oppositely charged.

Abstract: A barrier film for an electronic device, the barrier film including: a resin film; a layer-by-layer stack portion including a tabular inorganic particle layer and a binder layer which are alternately disposed on the resin film and are oppositely charged; and a filling portion that fills a defect portion of the tabular inorganic particle layer wherein the defect portion is a portion of the tabular inorganic particle layer where a tabular inorganic particle of the tabular inorganic particle layer is not present.

Abstract: A substrate for a surface light emitting device in which a transparent electrode, an organic thin film layer, and a cathode electrode are sequentially stacked, the substrate including: a transparent support substrate; and a highly refractive layer that is disposed between the support substrate and the transparent electrode and comprises at least one layer having a refractive index that is equal to or greater than a refractive index of the support substrate, wherein the highly refractive layer comprises a light diffusion unit that diffuses light incident from the transparent electrode and a planarized surface that contacts the transparent electrode. Accordingly, a Haze value of the highly refractive layer is set to be 5% or less, and a diameter of bubbles existing in the highly refractive layer is set to be 1/10th or less of a thickness of the highly refractive layer.

Abstract: A method is provided, of manufacturing a material to be etched that can more preferably prevent a region to be etched from remaining as an un-etched region and reduce deviation of etched/un-etched regions. Patterning (a method of manufacturing a material to be etched) of a substrate 100, which is manufactured by performing etching through an opened region 10 by an etching mask M1, is performed by a first etching process and a second etching process that is performed after the first etching process. The second etching process is a process for etching a region including a region that is not etched by the first etching process. An un-etched region, which is the same as etched using a virtual etching mask M1?, is formed on the surface of an object to be etched by the first and second etching processes.

Abstract: An organic EL panel forming light-emitting elements on a substrate includes lower electrode lines stripe-formed on the substrate, upper electrode lines stripe-formed so as to cross the lower electrode lines, an organic EL element laminating an organic layer including a light-emitting layer between the lower electrode lines and the upper electrode lines in the crossing part of the lower electrode lines and the upper electrode lines, extracting terminals electrically connected to the respective upper electrode lines and formed outside the light-emitting element forming area, a common organic layer formed so as to cover at least the overall side edges of the lower electrode lines within the light-emitting element forming area, and a cathode separator stripe-formed on the common organic layer within the light-emitting element forming area so as to insulate-segment the upper electrode lines with the end part extending to the extracting terminals.

Abstract: A film-forming composition that attains an improvement in the solubility of a hole-injecting/transporting material and/or an electron-accepting compound and has a drying rate appropriate for stable formation of a uniform coating film, being suitable for the formation of a hole-injecting/transporting layer. This composition comprises a hole-injecting/transporting material and/or an electron-accepting compound and a liquid in which the hole-injecting/transporting material and/or the electron-accepting compound are dissolved. This liquid mainly contains a solvent whose molecule has an aromatic ring and/or an aliphatic ring and an oxygen atom and which has either a boiling point of at least 200° C. or a vapor pressure of 1 torr or lower at 25° C.

Abstract: An organic semiconductor device in which an organic semiconductor layer is easily formed into a pattern, and a method of manufacturing same. On a substrate, a first structural portion including a first electrode, an organic semiconductor layer made of an organic compound having a semiconductor property, and a second structural portion having a second electrode are provided in order. The second structural portion is formed in a prescribed pattern. The second structural portion includes a mask portion having an etching-resistant property, and etching of the organic semiconductor layer is performed while using the mask portion as a mask. The mask portion may be the second electrode.

Abstract: A main subject is to provide a novel method for patterning of organic film which is suitable for manufacturing various organic devices. In a method for patterning of an organic film formed at a prescribed region, an organic covering layer forming step where an organic covering layer which includes a metal complex is formed on the organic film at a portion which corresponds to a portion where the organic film should be remained after patterning, and a plasma etching step where the organic film which is located at the portion of being not covered with the organic covering layer is etched out by irradiating the organic film with a plasma from above the organic covering layer after the organic covering layer forming step, are included.

Abstract: Disclosed is a semiconductor apparatus having a sealing structure that allows high-precision detection of defects occurring in a protective film, and a method of manufacturing the same. A semiconductor apparatus 1 includes a substrate 10, a semiconductor device 14 formed on the substrate 10, and a protective film 17 for sealing the semiconductor device 14. The semiconductor apparatus 1 further includes a first conductive layer 16 in contact with a back surface of the protective film 17, and a second conductive layer 18 in contact with a front surface of the protective film 17.

Abstract: A laminate for forming a substrate with wires in which a silver type material is used for a conductor layer and the layer is covered with a conductive protection layer for protection, the laminate for forming a substrate with wires exhibiting an extremely low contact resistance between the conductive protection layer and a cathode superposed thereon, is presented. A laminate for forming a substrate with wires, which comprises a substrate, a conductor layer comprising silver or a silver alloy, formed on the substrate, and a conductive protection layer comprising indium zinc oxide, formed on the conductor layer to cover the conductor layer, wherein the conductive protection layer is a conductive protection layer formed by sputtering in an atmosphere wherein the oxidizing gas content in the sputtering gas is not more than 1.5 vol %.

Abstract: A method is provided, of manufacturing a material to be etched that can more preferably prevent a region to be etched from remaining as an un-etched region and reduce deviation of etched/un-etched regions. Patterning (a method of manufacturing a material to be etched) of a substrate 100, which is manufactured by performing etching through an opened region 10 by an etching mask M1, is performed by a first etching process and a second etching process that is performed after the first etching process. The second etching process is a process for etching a region including a region that is not etched by the first etching process. An un-etched region, which is the same as etched using a virtual etching mask M1?, is formed on the surface of an object to be etched by the first and second etching processes.

Abstract: The present invention provides an organic electroluminescent display panel that is resistant to deterioration by outgas and to light emission problems attributable to mask contact, and a method for manufacturing this panel. The organic electroluminescent display panel includes a substrate, a first display electrode formed on the main face of the substrate and having one or more pixel light-emitting regions, an organic functional layer that is formed on the first display electrode and includes at least one organic material layer, a mask spacer provided near the organic functional layer, and a second display electrode formed on the organic functional layer. The mask spacer is made of the same material as any one of the organic material layers and has a top face located higher than the position of the second display electrode, when measured from the main face of the substrate.

Abstract: A film-forming composition that attains an improvement in the solubility of a hole-injecting/transporting material and/or an electron-accepting compound and has a drying rate appropriate for stable formation of a uniform coating film, being suitable for the formation of a hole-injecting/transporting layer. This composition comprises a hole-injecting/transporting material and/or an electron-accepting compound and a liquid in which the hole-injecting/transporting material and/or the electron-accepting compound are dissolved. This liquid mainly contains a solvent whose molecule has an aromatic ring and/or an aliphatic ring and an oxygen atom and which has either a boiling point of at least 200° C. or a vapor pressure of 1 torr or lower at 25° C.