Abstract: [PROBLEM] There is provided a waveguide device which connects a WRG structure with a microwave IC with low losses. [SOLUTION] A waveguide device (130) includes a first waveguide module having a first waveguide (140) and a second waveguide module having a second waveguide (142). The first and second waveguides are connected. The first waveguide module includes a microstrip line composed of a strip conductor (134), a ground conductor (132) opposing the strip conductor, and a dielectric (136) therebetween. The second waveguide module includes an electrically conductive member having an electrically conductive surface (110), a waveguide member (122) having an electrically-conductive waveguide face, and an artificial magnetic conductor on opposite sides of the waveguide member, and includes as the second waveguide a space between the electrically conductive surface and the waveguide face.

Abstract: In a method for joining members, a first tube, and a second tube capable of being inserted into the first tube are prepared. The second tube is inserted in a tube hole of the first tube in an axial direction of the first tube. The second tube is radially expanded toward the first tube so that the first tube and the second tube are joined by press-fitting. The first tube is made of a material having a spring back amount larger than a spring back amount of the second tube.

Abstract: A joint body includes first and second metal members and a joint portion including a welded portion where the first and second metal members are joined together, the welded portion having a line shape. The joint portion includes first and second longitudinal portions and a plurality of connecting portions. The first longitudinal portion has first intersecting portions arranged in a first direction and extends in the first direction. The second longitudinal portion has second intersecting portions arranged in the first direction and extends in the first direction. The welded portion intersects itself at the first and second intersecting portions. The connecting portions are arranged in the first direction. The connecting portions extend in a first direction and connect the first and second longitudinal portions.

Abstract: A joining method for members according to the present invention includes: providing a steel component including insertion holes, an aluminum pipe having a hollow shape, and a support component; inserting the aluminum pipe into the insertion holes of the steel component; and enlarging the aluminum pipe through deformation and joining the aluminum pipe to the steel component by press-fitting. The press-fit joining is performed while at least part of the support component is disposed in a press-fitting region.

Abstract: Disclosed herein is an apparatus that includes an output signal line, and first and second tristate buffer circuits each having an output node connected to the output signal line in common. The output signal line includes a first section having first and second connection points, a second section having third and fourth connection points, a third section connected between the first and third connection points, and a fourth section connected between second and fourth connection points. At least a part of the first section of the output signal line is located on the first tristate buffer circuit, and at least a part of the second section of the output signal line is located on the second tristate buffer circuit.

Abstract: A multilayer wiring in a semiconductor device includes a first lower wiring formed in a first insulating layer, a via which is formed in a second insulating layer over the first insulating layer and which is connected to the first lower wiring, and an upper wiring connected to the via. The upper wiring has an outer edge at which a nick portion is formed beside a portion of the upper wiring to which the via is connected. The formation of the nick portion at the outer edge of the upper wiring prevents the via from enlarging.

Abstract: An epoxy resin composition includes an organic phosphinic acid metal salt; an epoxy resin; dicyandiamide or a derivative thereof; a curing accelerator having a dimethylureido group; and an imidazole-based curing accelerator having a curing initiation temperature of 100° C. or higher. The curing initiation temperature is measured by a method includes preparing a sample resin composition by adding 10 parts by mass of an imidazole-based curing accelerator to 100 parts by mass of a bisphenol A type epoxy resin having an epoxy equivalent of 180 to 220, and mixing the components; measuring a calorific value of the sample resin composition using a differential scanning calorimeter at a rate of temperature increase of 10° C./min, and designating a temperature at the intersection point of the tangent line at the inflection point of the DSC curve thus obtained and the baseline as the curing initiation temperature.

Abstract: A multilayer wiring in a semiconductor device includes a first lower wiring formed in a first insulating layer, a via which is formed in a second insulating layer over the first insulating layer and which is connected to the first lower wiring, and an upper wiring connected to the via. The upper wiring has an outer edge at which a nick portion is formed beside a portion of the upper wiring to which the via is connected. The formation of the nick portion at the outer edge of the upper wiring prevents the via from enlarging.

Abstract: A method for joining members according to an embodiment of the present invention includes: providing a bumper stay including two integrated pipe portions extending in an identical direction, the bumper stay including a recess provided between the pipe portions being adjacent to each other, the recess extending in a longitudinal direction of the pipe portions from end surfaces of the pipe portions, a part of the recess serving as a locking portion, and a bumper beam including a rear inclined wall formed with two hole portions into which the pipe portions of the bumper stay are insertable respectively; inserting the bumper stay into the hole portions of the bumper beam until the locking portion abuts on the rear inclined wall; and pipe-expanding an insertion portion of the bumper stay into the bumper beam to join the insertion portion to the bumper beam by press-fitting.

Abstract: A method for manufacturing a semiconductor device includes: forming an ohmic electrode including Al on a semiconductor substrate; forming a SiN film covering the ohmic electrode; forming a first photoresist on the SiN film, the first photoresist having an opening pattern overlapping the ohmic electrode; performing ultraviolet curing of the first photoresist; forming an opening in the SiN film exposed through the opening pattern and causing a surface of the ohmic electrode to be exposed inside the opening; forming a barrier metal layer on the first photoresist and on the ohmic electrode exposed through the opening; forming a second photoresist in the opening pattern; performing a heat treatment on the second photoresist and covering the barrier metal layer overlapping the opening with the second photoresist; and etching the barrier metal layer using the second photoresist.

Abstract: An oil pump driving control device of a vehicle having a main oil pump (14) that is driven by a motor/generator (4) and produces a pump discharge oil to a first clutch (3), a second clutch (5) and a belt-type continuously variable transmission (6) provided on a driving force transmission line. A hybrid control module (81) is provided in this FF hybrid vehicle. The hybrid control module (81) is configured to perform a control so that during vehicle stop, the lower an ATF oil temperature is, the more the pump driving energy to drive the main oil pump (14) is decreased. With this control, consumption energy during the vehicle stop can be reduced.

Abstract: Provided are an epoxy resin composition which contains an epoxy resin and a curing agent, and satisfies the following (1), (2), and (3): (1) the bending elastic modulus of a cured product of the epoxy resin composition is 3.3 GPa or higher; (2) the bending strain at break of the cured product of the epoxy resin composition is 9% or higher; and (3) the fiber-reinforced plastic ? formed of the cured product of the epoxy resin composition and a reinforcing fiber substrate in which carbon fibers, which are continuous fibers, are evenly aligned in one direction has 90° bending strength of 95 MPa or higher, and a film, a prepreg, and fiber-reinforced plastic that are produced by using the epoxy resin composition.

Abstract: This anti-NASH composition, this food composition for preventing NASH, and this beverage composition for preventing NASH include, as an active ingredient, a Basidiomycetes-X FERM BP-10011 dry powder or an extract composition thereof. In addition, a composition for preventing cirrhosis and a composition for preventing hepatocellular carcinoma include, as an active ingredient, a Basidiomycetes-X FERM BP-10011 dry powder or an extract composition thereof, and prevent metastasis of cirrhosis and hepatocellular carcinoma from NASH.

Abstract: A steel plate frame and a thin plate are made of different materials. A plurality of through holes are formed in a portion of the thin plate to be placed on the steel plate frame. A plurality of projections 6c are formed on a support plate, each of the projections being allowed to be inserted into a corresponding one of the through holes. An adhesive is applied to a portion of the steel plate frame on which the thin plate is placed. The thin plate is placed on the steel plate frame, and the steel plate frame and the thin plate are bonded together by the adhesive. The support plate is placed on the thin plate to insert the projections into the through holes. The projections and the steel plate frame are welded to form a plurality of welded spots.

Abstract: A curable resin composition including components (A), (B), (C) and (D) below: component (A): a bisphenol epoxy resin with a softening point of 80° C. or more, component (B): a bisphenol epoxy resin which is liquid at 25° C., component (C): a bi- or more-functional (meth)acrylate compound, and component (D): a curing agent.

Abstract: A power supply device installed in an electronic apparatus includes a first power supply outputting power upon a plug being connected to a system power supply, a second power supply outputting power upon receiving of a power supply control signal, a third power supply outputting power from a battery, a controller operating using the power from the second power supply and configured to control the electronic apparatus, a flip-flop configured to operate using the power from the third power supply and configured to store, upon activating the electronic apparatus, first logic data or upon shutting down the electronic apparatus, second logic data, and a power supply control switch operating using the power from the first power supply, to output the power supply control signal to the second power supply, in response to activating the electronic apparatus or in response to storing the first logic data in the flip-flop.

Abstract: The semiconductor device has insulating films 40, 42 formed over a substrate 10; an interconnection 58 buried in at least a surface side of the insulating films 40, 42; insulating films 60, 62 formed on the insulating film 42 and including a hole-shaped via-hole 60 and a groove-shaped via-hole 66a having a pattern bent at a right angle; and buried conductors 70, 72a buried in the hole-shaped via-hole 60 and the groove-shaped via-hole 66a. A groove-shaped via-hole 66a is formed to have a width which is smaller than a width of the hole-shaped via-hole 66. Defective filling of the buried conductor and the cracking of the inter-layer insulating film can be prevented. Steps on the conductor plug can be reduced. Accordingly, defective contact with the upper interconnection layer and the problems taking place in forming films can be prevented.

Abstract: A controller is provided so as to control, when an electric vehicle (EV) mode is selected, a belt clamping pressure on the basis of discharged oil from a main oil pump which is driven by a motor generator. The controller is provided for a hybrid vehicle and is configured to perform control such that when the vehicle is stopped in the EV mode and a creep cut condition which does not require creep torque from the motor generator is met, a first motor idling rotation speed is set as a motor rotation speed. When the vehicle is stopped in the EV mode and a standby learning control completes learning of a zero-point oil pressure command value, the controller reduces a rotation speed of the motor generator to a second motor idling rotation speed which is lower than the first motor idling rotation speed.

Abstract: Provided are a carbon fiber thermoplastic resin prepreg which is a carbon fiber prepreg obtained by impregnating a PAN-based carbon fiber in which the average fiber fineness of a single fiber is 1.0 dtex to 2.4 dtex with a thermoplastic resin, wherein the thermoplastic resin satisfies 20?(FM/FS)?40 (where FM: flexural modulus (MPa) of a resin sheet comprising only the thermoplastic resin, and FS: flexural strength (MPa) of the resin sheet), a method for manufacturing the same, and a carbon fiber composite material employing the carbon fiber prepreg.