Abstract: Provided are a carbon fiber thermoplastic resin prepreg which is a carbon fiber prepreg obtained by impregnating a PAN-based carbon fiber in which the average fiber fineness of a single fiber is 1.0 dtex to 2.4 dtex with a thermoplastic resin, wherein the thermoplastic resin satisfies 20?(FM/FS)?40 (where FM: flexural modulus (MPa) of a resin sheet comprising only the thermoplastic resin, and FS: flexural strength (MPa) of the resin sheet), a method for manufacturing the same, and a carbon fiber composite material employing the carbon fiber prepreg.

Abstract: Disclosed is a method for producing a steel part, which includes the steps of: preparing a built-up steel sheet including a steel sheet 20 including: C: 0.15 to 0.5% by mass, Si: 0.10 to 3% by mass, Mn: 0.5 to 5% by mass, P: 0.05% by mass or less (excluding 0%), S: 0.05% by mass or less (excluding 0%), Al: 0.01 to 1% by mass, B: 0.0002 to 0.01% by mass, Ti: 0.005 to (3.4[N]+0.1) % by mass (in which [N] represents a content of N (% by mass)), and N: 0.001 to 0.01% by mass, with the balance being iron and inevitable impurities, and one or more built-up portions 30 provided on the steel sheet 20; hot-forming the built-up steel sheet at a temperature of an Ac3 point or higher of the steel sheet 20; and cooling the hot-formed built-up steel sheet to a temperature of an Ms point or lower of the steel sheet such that an area ratio of martensite in the metal structure of the steel sheet 20 is 70% or more.

Abstract: A method for joining members includes: providing a wall surface body which is a die-molded article provided with a hole portion with a draft angle provided from its opposite end portions toward its center portion, a tubular body with a hollow shape, and an elastic body; inserting the tubular body into the hole portion in the wall surface body; inserting the elastic body into the inside of the tubular body; and compressing the elastic body in the direction of an axial line L of the tubular body to expand the elastic body outwardly in the radial direction of the axial line L, thereby deforming and expanding the tubular body to joint the tubular body to the wall surface body by press-fitting.

Abstract: In a method for joining members of the present invention, a B-pillar, a rocker, a side panel served as frame members of a vehicle body, and an elastic body are provided. The B-pillar includes a tubular portion and an extension portion extended from the tubular portion. The rocker includes a first hole portion. The side panel includes a support portion. Next, the tubular portion of the B-pillar is inserted into the first hole portion of the rocker. The elastic body is inserted into the tubular portion of the rocker. The elastic body is pressurized in an axial line L1 direction of the tubular portion of the B-pillar to be expanded outward in a radial direction of the axial line L1, so that the tubular portion of the B-pillar is expanded and deformed to be joined to the first hole portion of the rocker by press-fitting. Further, the extension portion of the B-pillar and the support portion of the side panel are joined by a method different from joining by press-fitting.

Abstract: A manufacturing method of a press-formed article includes arranging a member to be pressed between first and second dies, and relatively moving the first and second dies so as to approach each other, thereby press forming to a portion to be pressed so that a height of the portion to be pressed decreases. In the press forming step, while first bent portions in a pair each bent in a protruded shape toward the second die on the portion to be pressed are held by groove-shaped holding portions in a pair separated from each other on the second die, a second bent portion bent in a protruded shape from a position between the first bent portions toward the first die on the portion to be pressed is pressed and deformed by a pressing portion of the first die.

Abstract: A light load abnormality determination method for an electric oil pump (3) that circulates oil to an object to be cooled by the electric oil pump driven by a motor (11), the method comprising: a detection step (41) to detect a current flowing through the motor, a voltage supplied to the motor, and a rotation speed of the motor; a calculation step (42) to calculate a piping resistance equivalent value or a reciprocal value of the piping resistance equivalent value, as a load evaluation value for light load abnormality determination, based on the current, the voltage and the rotation speed detected by the detection step; and a light load abnormality determination step (44) to determine a light load abnormality of the electric oil pump based on the load evaluation value.

Abstract: First and second sensor elements are arranged on a substrate. First sensor-wiring line is connected to the first sensor element. An insulating film covers the first sensor-wiring line. Second sensor-wiring line is connected to the second sensor element and separated from the first sensor-wiring line by the insulating film in the thickness direction. First and second terminal parts are for being connected to an external circuit board, and are provided at an end of the first sensor-wiring line and at an end of the second sensor-wiring line, respectively. First and second lead lines extend from the first and second terminal parts, respectively. The short-circuit wiring line connects the first and second lead lines to each other.

Abstract: Disclosed is a joining method of members, which includes the steps of: preparing a first member in which a first hole portion having a polygonal cross-sectional shape is formed, and a second member having a hollow shape, wherein the second member has a cross-sectional shape corresponding to the polygonal cross-sectional shape of the first hole portion, the second member including a plurality of straight line portions extending linearly and corner portions positioned between the adjacent two straight line portions in the cross-sectional shape; inserting the second member into the first hole portion of the first member; and caulking and joining the second member to the first member by enlarging and deforming the corner portions.

Abstract: The joining method for members according to the present invention includes: providing an aluminum component including an insertion hole provided with a rib in at least part of an edge part, and a hollow steel pipe; inserting the steel pipe into the insertion hole of the aluminum component; and expanding and deforming the steel pipe to join the steel pipe to the aluminum component by press-fitting.

Abstract: A manufacturing method of press-molded article of the present invention comprises a step of placing a member to be pressed in a press molding apparatus and a step of pressing a flat plate portion of the member to be pressed by bringing a first press portion and a second press portion closer to each other. A first opposing surface and a second opposing surface, while facing to each other, keep in contact with the flat plate portion during pressing. In the press step, a thick part is formed on the flat plate portion by allowing a part of a material of the flat plate portion to flow, in a press direction, into a thickened portion-forming section formed on the first opposing surface. The second opposing surface is moved to the press direction as the flat plate portion is pressed by the first press portion and the second press portion.

Abstract: A received power control device (200) that performs control of received energy, which is an amount of power received from a power system per predetermined time at a power receiving point to which a load (302) and an electric storage device (303) are electrically connected, the received power control device (200) performing the control by controlling charge and discharge of at least the electric storage device (303), including: a received energy obtainer (201) that periodically obtains information indicating the received energy; a controller (202) that causes at least the electric storage device (303) to discharge to prevent the received energy from exceeding a first threshold; a remaining capacity obtainer (203) that periodically obtains information indicating a remaining capacity of the electric storage device (303); and a threshold setter (204) that increases the first threshold when an amount of decrease in the remaining capacity per unit time exceeds a second threshold.

Abstract: An input shaft (1) connectable to an engine (5), an output gear (2), a transmission case (3) and a Ravigneaux planetary gear unit (4) are provided. Four rotational elements of the Ravigneaux planetary gear unit (4) are a single pinion side sun gear (Ss), a carrier (C), a ring gear (R) and a double pinion side sun gear (Sd) which are arranged orderly on a common speed diagram. The single pinion side sun gear (Ss) is constantly connected to a motor/generator (6), and the ring gear (R) is constantly connected to the output gear (2). And, with usage of a low & reverse clutch (L&R/C), a high clutch (H/C) and a low brake (L/B), a first speed (1st), a second speed (2nd), a third speed (3rd) and a stepless change speed (eCVT) are established.

Abstract: A frequency control method for use in a frequency control system including: a server that receives, from a power system operator, a power command for controlling a frequency of a power grid within a predetermined frequency; at least one distributed energy resource; and a local controller connected to the server through a communication network and to the at least one distributed energy resource, the frequency control method includes: receiving the power command from the power system operator; obtaining a frequency measurement of the power grid; predicting a next power command using the frequency measurement, before the next power command is received from the power system operator; and controlling an input or output of the at least one distributed power energy resource using the predicted next power command, before the next power command is received from the power system operator.

Abstract: The semiconductor device has insulating films 40, 42 formed over a substrate 10; an interconnection 58 buried in at least a surface side of the insulating films 40, 42; insulating films 60, 62 formed on the insulating film 42 and including a hole-shaped via-hole 60 and a groove-shaped via-hole 66a having a pattern bent at a right angle; and buried conductors 70, 72a buried in the hole-shaped via-hole 60 and the groove-shaped via-hole 66a. A groove-shaped via-hole 66a is formed to have a width which is smaller than a width of the hole-shaped via-hole 66. Defective filling of the buried conductor and the cracking of the inter-layer insulating film can be prevented. Steps on the conductor plug can be reduced. Accordingly, defective contact with the upper interconnection layer and the problems taking place in forming films can be prevented.

Abstract: A multilayer wiring in a semiconductor device includes a first lower wiring formed in a first insulating layer, a via which is formed in a second insulating layer over the first insulating layer and which is connected to the first lower wiring, and an upper wiring connected to the via. The upper wiring has an outer edge at which a nick portion is formed beside a portion of the upper wiring to which the via is connected. The formation of the nick portion at the outer edge of the upper wiring prevents the via from enlarging.

Abstract: An epoxy resin composition comprising the following Component (A), Component (B), Component (C), and Component (D): Component (A): an organic phosphinic acid metal salt; Component (B): an epoxy resin; Component (C): dicyandiamide or a derivative thereof; and Component (D): a curing accelerator having a dimethylureido group. The epoxy resin composition described above, further comprising the Component (E) which is an imidazole-based curing accelerator having a curing initiation temperature of 100° C. or higher as measured by the following method. Measurement method of a curing initiation temperature: a sample resin composition is prepared by adding 10 parts by mass of an imidazole-based curing accelerator to 100 parts by mass of a bisphenol A type epoxy resin having an epoxy equivalent of 180 to 220, and mixing the components. For this sample resin composition, the calorific value is measured using a differential scanning calorimeter (DSC) at a rate of temperature increase of 10° C.

Abstract: An epoxy-resin composition of the components (A), (B), (D) and (E), where component (A) is an epoxy resin having an oxazolidone-ring structure, (B) is a bisphenol bifunctional epoxy resin with a number-average molecular weight of at least 600 but no more than 1300, which does not have an oxazolidone-ring structure, (D) is a triblock copolymer, and (E) is a curing agent. A film made of the epoxy-resin composition, a prepreg and a fiber-reinforced plastic is also disclosed. The epoxy resin composition is capable of achieving both a processability of a prepreg at room temperature and a suppression of voids in the molded product. A fiber-reinforced plastic having excellent mechanical properties, especially excellent fracture toughness and heat tolerance, is also obtained by using the epoxy-resin composition.

Abstract: A buffer means includes a buffer unit that makes paper sheets temporarily stand by and a paper stacking unit that intermittently conveys paper sheets and sucks the trailing edges of the paper sheets to stack the paper sheets stepwise and make them temporarily stand by.

Abstract: The semiconductor device has insulating films 40, 42 formed over a substrate 10; an interconnection 58 buried in at least a surface side of the insulating films 40, 42; insulating films 60, 62 formed on the insulating film 42 and including a hole-shaped via-hole 60 and a groove-shaped via-hole 66a having a pattern bent at a right angle; and buried conductors 70, 72a buried in the hole-shaped via-hole 60 and the groove-shaped via-hole 66a. A groove-shaped via-hole 66a is formed to have a width which is smaller than a width of the hole-shaped via-hole 66. Defective filling of the buried conductor and the cracking of the inter-layer insulating film can be prevented. Steps on the conductor plug can be reduced. Accordingly, defective contact with the upper interconnection layer and the problems taking place in forming films can be prevented.

Abstract: A multilayer wiring in a semiconductor device includes a first lower wiring formed in a first insulating layer, a via which is formed in a second insulating layer over the first insulating layer and which is connected to the first lower wiring, and an upper wiring connected to the via. The upper wiring has an outer edge at which a nick portion is formed beside a portion of the upper wiring to which the via is connected. The formation of the nick portion at the outer edge of the upper wiring prevents the via from enlarging.