Abstract: A photovoltaic element includes: a semiconductor substrate; a first i-type semiconductor film provided on a part of one of surfaces of the semiconductor substrate; a first semiconductor region including a first-conductivity-type semiconductor film provided on the first i-type semiconductor film; a first electrode layer provided on the first semiconductor region; a first conductive film interposed at least at a site between the first semiconductor region and the first electrode layer.

Abstract: Provided is a fare box where the entire structure of the fare box can be simplified even when an operation system for setting an operation of receiving and collecting money is provided to the fare box. A touch-panel-type operating part which is operated at the time of changing an operation of receiving and collecting money is mounted on a back surface of a lid portion of a fare box. The touch-panel-type operating part is operated by a driver, for example, and is preferably a resistance-film-type. Setting which can be made by operating the touch-panel-type operating part includes: a fare change of fares; counting of a student certificate; inputting of a defect, a wireless communication between communication equipment in a vehicle (a Wi-Fi rooter, for example) and the fare box, intercommunication with an information reading part and the like.

Abstract: A photovoltaic element includes: a semiconductor substrate; a first i-type semiconductor film provided on a part of one of surfaces of the semiconductor substrate; a first semiconductor region including a first-conductivity-type semiconductor film provided on the first i-type semiconductor film; a first electrode layer provided on the first semiconductor region; a first conductive film interposed at least at a site between the first semiconductor region and the first electrode layer.

Abstract: A photoelectric conversion element includes a semiconductor, an intrinsic layer disposed on the semiconductor and containing hydrogenated amorphous silicon, a first-conductivity-type layer that covers a part of the intrinsic layer and contains hydrogenated amorphous silicon of a first conductivity type, a second-conductivity-type layer that covers a part of the intrinsic layer and contains hydrogenated amorphous silicon of a second conductivity type, an insulating film covering an end region of the first-conductivity-type layer, a first electrode disposed on the first-conductivity-type layer, and a second electrode disposed on the second-conductivity-type layer. An end portion of the second-conductivity-type layer is located on the insulating film or above the insulating film.

Abstract: A photoelectric conversion element includes an intrinsic layer that is disposed on a semiconductor of a first conductivity type and contains hydrogenated amorphous silicon; and a first-conductivity-type layer containing hydrogenated amorphous silicon of the first conductivity type, a second-conductivity-type layer containing hydrogenated amorphous silicon of a second conductivity type, and an insulating layer, each of which covers a part of the intrinsic layer. A first electrode is disposed on the first-conductivity-type layer with the second-conductivity-type layer therebetween. At least a part of the first electrode is located above a region where the first-conductivity-type layer contacts the intrinsic layer, and at least a part of the second electrode is located above a region where the second-conductivity-type layer contacts the intrinsic layer.

Abstract: There is provided a photoelectric conversion device which can prevent the contact resistance between a non-crystalline semiconductor layer containing impurities and an electrode formed on the non-crystalline silicon layer from increasing, and can improve the element characteristics. A photoelectric conversion element (10) includes a silicon substrate (12), a first non-crystalline semiconductor layer (20n), a second non-crystalline semiconductor layer (20p), a first electrode (22n), and a second electrode (22p). One electrode (22n) includes first conductive layers (26n, 26p), and second conductive layers (28n, 28p). The first conductive layers (26n, 26p) have a first metal as a main component. The second conductive layers (28n, 28p) contain a second metal which is more likely to be oxidized than the first metal, are formed to be in contact with the first conductive layers (26n, 26p), and are disposed to be closer to the silicon substrate (12) than the first conductive layers (26n, 26p).

Abstract: A photoelectric conversion element 100 includes an n-type monocrystalline silicon substrate 1, an non-crystalline thin film 2, i-type non-crystalline thin films 11 to 1m and 21 to 2m?1, p-type non-crystalline thin films 31 to 3m, and n-type non-crystalline thin films 41 to 4m?1. The non-crystalline thin film 2 is configured of non-crystalline thin films 201 and 202 and is disposed in contact with the surface on the light incident side of the n-type monocrystalline silicon substrate 1. The non-crystalline thin film 201 is configured of a-Si, and the non-crystalline thin film 202 is configured of a-SiNx (0.78?x?1.03). The i-type non-crystalline thin films 11 to 1m and 21 to 2m?1 are disposed in contact with the rear surface of the n-type monocrystalline silicon substrate 1. The p-type non-crystalline thin films 31 to 3m are disposed in contact with the i-type non-crystalline thin films 11 to 1m.

Abstract: There is provided a photoelectric conversion element which can prevent the contact resistance between a non-crystalline semiconductor layer containing impurities and an electrode formed on the non-crystalline semiconductor layer from increasing, and can improve the element characteristics. A photoelectric conversion element (10) includes a semiconductor substrate (12), a first semiconductor layer (20n), a second semiconductor layer (20p), a first electrode (22n), and a second electrode (22p). The first semiconductor layer has a first conductive type. The second semiconductor layer has a second conductive type. The first electrode is formed on the first semiconductor layer. The second electrode is formed on the second semiconductor layer. The first electrode includes a first transparent conductive layer (26n) formed on the first semiconductor layer, and a first metal layer (28n) formed on the first transparent conductive layer.

Abstract: A photoelectric conversion element 100 includes an n-type monocrystalline silicon substrate 1, an non-crystalline thin film 2, i-type non-crystalline thin films 11 to 1m and 21 to 2m-1, p-type non-crystalline thin films 31 to 3m, and n-type non-crystalline thin films 41 to 4m-1. The non-crystalline thin film 2 is configured of non-crystalline thin films 201 and 202 and is disposed in contact with the surface on the light incident side of the n-type monocrystalline silicon substrate 1. The non-crystalline thin film 201 is configured of a-Si, and the non-crystalline thin film 202 is configured of a-SiNx (0<x<0.85) and is disposed further on the light incident side than the non-crystalline thin film 201. The i-type non-crystalline thin films 11 to 1m and 21 to 2m-1 are disposed in contact with the rear surface of the n-type monocrystalline silicon substrate 1. The p-type non-crystalline thin films 31 to 3m are disposed in contact with the i-type non-crystalline thin films 11 to 1m.

Abstract: There is provided a photoelectric conversion element which can prevent the contact resistance between a non-crystalline semiconductor layer containing impurities and an electrode formed on the non-crystalline semiconductor layer from increasing, and can improve the element characteristics. A photoelectric conversion element (10) includes a semiconductor substrate (12), a first semiconductor layer (20n), a second semiconductor layer (20p), a first electrode (22n), and a second electrode (22p). The first semiconductor layer (20n) has a first conductive type. The second semiconductor layer (20p) has a second conductive type opposite to the first conductive type. The first electrode (22n) is formed on the first semiconductor layer (20n). The second electrode (22p) is formed on the second semiconductor layer (20p). At least one electrode of the first electrode (22n) and the second electrode (22p) includes a plurality of metal crystal grains.

Abstract: A safe unlocking machine is provided with: an operation direction switching mechanism for selectively switching between a first direction allowance state in which only the operation of an operation unit in the first direction is allowed, and a second direction allowance state in which only the operation of the operation unit in the second direction is allowed; detectors for detecting the action of the safe unlocking machine and generating a detection signal; and a switching controller for controlling an operation direction switching mechanism on the basis of the detection signal from the detectors and thereby selectively setting the direction of movement of the operation unit to the first direction or the second direction.

Abstract: A safe unlocking machine includes a currency container that may be moved into and out of a container unit. The currency container includes a coin inlet, a bill inlet, and a lock-incorporated shutter that opens and closes a tag. When the shutter is operated to open, RFID wireless verification is performed between an antenna located in the container unit and the tag of the currency container. When predetermined conditions including accomplishment of the RFID verification are satisfied, rotation of a receiver handle is permitted. When the receiver handle is rotated once, a safe main body of a safe, which is located in the safe unlocking machine, is solely moved rearward. The currency in the safe main body falls down due to its own weight and is stored in the currency container.

Abstract: The photoelectric conversion element includes a semiconductor substrate, a first amorphous film of a first conductivity type disposed on an entire surface of one surface of the semiconductor substrate, a first conductive oxide layer disposed on the first amorphous film, a second amorphous film of the first conductivity type disposed on a part of the other surface of the semiconductor substrate, a second conductive oxide layer disposed on the second amorphous film, a third amorphous film of a second conductivity type disposed on the other part of the other surface of the semiconductor substrate, and a third conductive oxide layer disposed on the third amorphous film. Electric conductivity of the first conductive oxide layer is lower than electric conductivities of the second and the third conductive oxide layer. Transmittance of the first conductive oxide layer is higher than transmittances of the second and the third conductive oxide layer.

Abstract: A photoelectric conversion element includes a semiconductor, an intrinsic layer disposed on the semiconductor and containing hydrogenated amorphous silicon, a first-conductivity-type layer that covers a part of the intrinsic layer and contains hydrogenated amorphous silicon of a first conductivity type, a second-conductivity-type layer that covers a part of the intrinsic layer and contains hydrogenated amorphous silicon of a second conductivity type, an insulating film covering an end region of the first-conductivity-type layer, a first electrode disposed on the first-conductivity-type layer, and a second electrode disposed on the second-conductivity-type layer. An end portion of the second-conductivity-type layer is located on the insulating film or above the insulating film.

Abstract: A photoelectric conversion element includes an intrinsic layer that is disposed on a semiconductor of a first conductivity type and contains hydrogenated amorphous silicon; and a first-conductivity-type layer containing hydrogenated amorphous silicon of the first conductivity type, a second-conductivity-type layer containing hydrogenated amorphous silicon of a second conductivity type, and an insulating layer, each of which covers a part of the intrinsic layer. A first electrode is disposed on the first-conductivity-type layer with the second-conductivity-type layer therebetween. At least a part of the first electrode is located above a region where the first-conductivity-type layer contacts the intrinsic layer, and at least a part of the second electrode is located above a region where the second-conductivity-type layer contacts the intrinsic layer.

Abstract: A photoelectric conversion element includes a first lower electrode in contact with a first-conductivity-type layer and a first upper electrode disposed on the first lower electrode. A part of the first-conductivity-type layer and a part of a second-conductivity-type layer are located above a region where an intrinsic layer contacts an insulating layer.

Abstract: A core-shell particle including a semiconductor core and a first semiconductor shell on a surface of the semiconductor core, wherein the semiconductor core contains a semiconductor and an impurity that forms an intermediate band in a band gap of the semiconductor. An upconversion layer and a photoelectric conversion device each containing the core-shell particle.

Abstract: A safe unlocking machine is provided with: an operation direction switching mechanism for selectively switching between a first direction allowance state in which only the operation of an operation unit in the first direction is allowed, and a second direction allowance state in which only the operation of the operation unit in the second direction is allowed; detectors for detecting the action of the safe unlocking machine and generating a detection signal; and a switching controller for controlling an operation direction switching mechanism on the basis of the detection signal from the detectors and thereby selectively setting the direction of movement of the operation unit to the first direction or the second direction.

Abstract: The photoelectric conversion element includes a semiconductor substrate, a first amorphous film of a first conductivity type disposed on an entire surface of one surface of the semiconductor substrate, a first conductive oxide layer disposed on the first amorphous film, a second amorphous film of the first conductivity type disposed on a part of the other surface of the semiconductor substrate, a second conductive oxide layer disposed on the second amorphous film, a third amorphous film of a second conductivity type disposed on the other part of the other surface of the semiconductor substrate, and a third conductive oxide layer disposed on the third amorphous film. Electric conductivity of the first conductive oxide layer is lower than electric conductivities of the second and the third conductive oxide layer. Transmittance of the first conductive oxide layer is higher than transmittances of the second and the third conductive oxide layer.