Patents by Inventor Kenji Ono

Kenji Ono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7736535
    Abstract: A phosphor having high luminescence when excited by vacuum ultraviolet ray and a vacuum ultraviolet radiation excited light-emitting device comprising the phosphor. The phosphor comprises a metal oxide comprises at least one metal element M1 selected from the group consisting of Ca, Sr and Ba, at least one metal element M2 selected from the group consisting of Y, La, Gd and Lu, at least one metal element M3 selected from the group consisting of Si and Ge and oxygen, and at least one metal element Ln1 selected from the group consisting of Ce, Pr, Nd, Pm, Sm, Eu, Tb, Dy, Ho, Er, Tm, Yb, and Mn, as an activator.
    Type: Grant
    Filed: August 28, 2003
    Date of Patent: June 15, 2010
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Takashi Takeda, Kenji Ono, Susumu Miyazaki
  • Patent number: 7727411
    Abstract: The present invention provides a manufacturing method of a substrate for an ink jet head including forming an ink supply opening to a silicon substrate, including (a) forming, at the back surface of the silicon substrate, an etching mask layer, which has an opening that is asymmetric with a center line, extending in the longitudinal direction, of an area on the surface of the silicon substrate where the ink supply opening is to be formed; (b) forming a non-through hole on the silicon substrate via the opening on the etching mask layer; and (c) forming the ink supply opening by performing a crystal anisotropic etching to the silicon substrate from the opening.
    Type: Grant
    Filed: March 2, 2007
    Date of Patent: June 1, 2010
    Assignee: Canon Kabushiki Kaisha
    Inventors: Jun Yamamuro, Shuji Koyama, Kenji Ono, Toshiyasu Sakai
  • Publication number: 20100102473
    Abstract: A method of manufacturing a liquid discharge head including a flow path member for forming a flow path communicating with a discharge port discharging a liquid forms a mold of the flow path made of a positive photosensitive resin on a substrate; applies a coated layer on the mold for forming the flow path member, which coated layer includes a solvent, an epoxy resin, and a curing agent of the epoxy resin; removes the solvent from the coated layer at a normal temperature under substantially 1 atm. so that the weight of the coated layer may become 93% or less of that of the coated layer at a time of the applying of the coated layer, and then further removes the solvent from the coated layer under a depressurized condition; cures the coated layer; and removes the mold to form the flow path.
    Type: Application
    Filed: October 6, 2009
    Publication date: April 29, 2010
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Masahisa Watanabe, Shuji Koyama, Kenji Ono, Kenji Fujii, Shuhei Oya, Seiko Minami
  • Publication number: 20100087069
    Abstract: The coverage characteristics or loading effect of an oxide film can be improved without having to increase the supply amount or time of an oxidant. There is provided method of manufacturing a semiconductor device. The method comprises loading at least one substrate to a processing chamber; forming an oxide film on the substrate by alternately supplying a first reaction material and a second reaction material containing oxygen atoms to the processing chamber while heating the substrate; and unloading the substrate from the processing chamber, wherein the forming of the oxide film is performed by keeping the substrate at a temperature equal to or lower than a self-decomposition temperature of the first reaction material and irradiating ultraviolet light to the second reaction material.
    Type: Application
    Filed: October 1, 2009
    Publication date: April 8, 2010
    Inventors: Hironobu MIYA, Kazuyuki Toyoda, Masanori Sakai, Norikazu Mizuno, Tsutomu Kato, Yuji Takebayashi, Kenji Ono, Atsushi Morikawa, Satoshi Okada
  • Patent number: 7681993
    Abstract: An ink jet head circuit board is provided which has heaters to generate thermal energy for ejecting ink as they are energized. This circuit board is so constructed as to reduce wire resistances for the heaters while at the same time preventing an increase in the size of the board and realizing a high-density integration of the heaters required for high resolution printing. This construction is made possible by forming electrode wires of first and second electrode wire layers to reduce an area that the wire patterns for the heater occupy on the circuit board. In reducing the effective thickness of protective insulation layer formed on the heater to prevent a possible degradation of thermal efficiency, one of the protective insulation layers over the electrode wires is removed from the heater, depending on the thickness of the electrode wires.
    Type: Grant
    Filed: August 15, 2005
    Date of Patent: March 23, 2010
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kenji Ono, Teruo Ozaki, Toshiyasu Sakai, Ichiro Saito, Satoshi Ibe, Sakai Yokoyama, Kazuaki Shibata
  • Patent number: 7669981
    Abstract: An ink jet print head substrate capable of precisely blowing fuse element to store data reliably is provided. An ink jet print head incorporating such a substrate and an ink jet printing apparatus are also provided. The interlayer insulating film formed over the fuse element is made of a material that has a lower melting point than the material of the fuse element and which forms a cavity therein by heat produced when the fuse elements is blown.
    Type: Grant
    Filed: March 19, 2009
    Date of Patent: March 2, 2010
    Assignee: Canon Kabushiki Kaisha
    Inventors: Teruo Ozaki, Ichiro Saito, Sakai Yokoyama, Kenji Ono, Satoshi Ibe, Kazuaki Shibata, Toshiyasu Sakai
  • Patent number: 7641316
    Abstract: An ink jet head circuit board is provided which has heaters to generate thermal energy for ink ejection as they are energized. This circuit board reduces areas of the heaters to achieve higher printing resolution and image quality. This board also prevents a degradation of thermal energy efficiency and reduces power consumption. The protective insulation layer for the electrode wire layer is formed of two layers and one of the two layers is removed from above the heater to improve the heat energy efficiency. The resistor layer is deposited over the electrode wire layer. The patterning for removing the protective insulation layer is done in a wider range than a gap of the electrode wire layer, the gap being used to form the heater. Further, by forming the electrode wires in two layers, a possible reduction in an effective bubble generation area of the heater can be prevented.
    Type: Grant
    Filed: August 15, 2005
    Date of Patent: January 5, 2010
    Assignee: Canon Kabushiki Kaisha
    Inventors: Toshiyasu Sakai, Teruo Ozaki, Kenji Ono, Ichiro Saito, Sakai Yokoyama, Satoshi Ibe, Kazuaki Shibata
  • Publication number: 20090325389
    Abstract: To grasp an accumulation state of residual matters inside of a vaporizer without decomposing the vaporizer, and grasp the timing of performing maintenance to the inside of the vaporizer in advance.
    Type: Application
    Filed: June 16, 2009
    Publication date: December 31, 2009
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Yuji Takebayashi, Masanori Sakai, Tsutomu Kato, Kenji Ono
  • Patent number: 7591071
    Abstract: A semiconductor device includes a lateral end surface and a connection electrode for external electrical connection. The connection electrode is exposed at the side surface. A manufacturing method of the semiconductor device includes steps of forming a linear recess in a silicon substrate between adjacent semiconductor devices, forming, on an inner surface of the recess, the electrode for external electrical connection of one of the semiconductor devices, and a step of separating the one semiconductor device from another on the silicon substrate by cutting the silicon substrate along the linear recess. Forming the electrode includes steps of forming a metal thin film astride a cutting line at which the silicon substrate is to be cut, forming a resist layer and patterning the resist layer on the metal thin film, growing metal at a portion not having the patterned resist layer, and removing the patterned resist layer and the metal thin film below the patterned resist layer.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: September 22, 2009
    Assignee: Canon Kabushiki Kaisha
    Inventors: Satoshi Ibe, Teruo Ozaki, Ichiro Saito, Sakai Yokoyama, Kenji Ono, Kazuaki Shibata, Toshiyasu Sakai
  • Patent number: 7566116
    Abstract: In an ink jet head circuit board including a heater for generating thermal energy used for ejecting ink in response to application of electricity, a drop in thermal energy efficiency is prevented while reducing an area of the heater to achieve higher-resolution and higher-image-quality printing, and damages on the heater attributable to a manufacturing process are avoided. To achieve this, a resistor layer is disposed on an electrode wire layer; and two protective layers are disposed thereon. Then the upper protective layer is removed in a site above the heater. Accordingly, it is possible to dispose the protective layers without causing a decrease in an effective bubble generating region, and to improve thermal energy efficiency by reducing the effective thickness of the protective layer above the heater. Moreover, the resistor layer is covered with the first protective layer and is thereby prevented from adverse effects in the manufacturing process such as etching processes.
    Type: Grant
    Filed: November 2, 2005
    Date of Patent: July 28, 2009
    Assignee: Canon Kabushiki Kaisha
    Inventors: Ichiro Saito, Toshiyasu Sakai, Teruo Ozaki, Sakai Yokoyama, Kenji Ono, Satoshi Ibe, Kazuaki Shibata
  • Publication number: 20090179938
    Abstract: An ink jet print head substrate capable of precisely blowing fuse element to store data reliably is provided. An ink jet print head incorporating such a substrate and an ink jet printing apparatus are also provided. The interlayer insulating film formed over the fuse element is made of a material that has a lower melting point than the material of the fuse element and which forms a cavity therein by heat produced when the fuse elements is blown.
    Type: Application
    Filed: March 19, 2009
    Publication date: July 16, 2009
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: TERUO OZAKI, ICHIRO SAITO, SAKAI YOKOYAMA, KENJI ONO, SATOSHI IBE, KAZUAKI SHIBATA, TOSHIYASU SAKAI
  • Patent number: 7533969
    Abstract: An ink jet print head substrate capable of precisely blowing fuse element to store data reliably is provided. An ink jet print head incorporating such a substrate and an ink jet printing apparatus are also provided. The interlayer insulating film formed over the fuse element is made of a material that has a lower melting point than the material of the fuse element and which forms a cavity therein by heat produced when the fuse elements is blown.
    Type: Grant
    Filed: April 21, 2006
    Date of Patent: May 19, 2009
    Assignee: Canon Kabushiki Kaisha
    Inventors: Teruo Ozaki, Ichiro Saito, Sakai Yokoyama, Kenji Ono, Satoshi Ibe, Kazuaki Shibata, Toshiyasu Sakai
  • Patent number: 7505895
    Abstract: A translation apparatus translates article information in a first language including an article body and a related headline as a summary of the article body. A decision unit discriminately identifies the article body and the headline in the article information. A translation unit respectively translates the article body and the headline into a second language based on identification result of the decision unit.
    Type: Grant
    Filed: May 15, 2006
    Date of Patent: March 17, 2009
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Kenji Ono
  • Publication number: 20090065474
    Abstract: A method for manufacturing a liquid-ejection head substrate including a silicon substrate having a supply port for supplying liquid is provided. The method includes: forming an etching mask layer on a surface of the silicon substrate, the etching mask layer having an opening in a portion corresponding to the supply port; forming a first recess in the surface of the silicon substrate by anisotropically etching the silicon substrate through the opening in the etching mask layer; forming a second recess that extends toward the other surface of the silicon substrate, in a surface of the first recess in the silicon substrate; and forming the supply port by anisotropically etching the silicon substrate from the surface provided with the second recess.
    Type: Application
    Filed: September 5, 2008
    Publication date: March 12, 2009
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Mitsuru Chida, Toshiyasu Sakai, Noriyasu Ozaki, Hiroyuki Abo, Kazuya Abe, Kenji Ono
  • Publication number: 20090067061
    Abstract: The invention relates to a zoom lens and an imaging apparatus incorporating the same. More particularly, the invention is concerned with a zoom lens that is downsized for use with imaging apparatus inclusive of video cameras and digital cameras. The zoom lens comprises a positive first group G1, a negative lens group G2, a positive third group G3, a positive fourth group G4 and an aperture stop S. At least the first group G1 and the second group G2 move for zooming from the wide-angle end to the telephoto end. The first group G1, the third group G3 and the aperture stop S are positioned more on the object side in a state of the telephoto end than in a state of the wide-angle end. The spacing sandwiched between the first group G1 and the second group G2 grows wide, the spacing sandwiched between the second group G2 and the third group G3 becomes narrows, and the spacing sandwiched between the third group G3 and the fourth lens group G4 grows wide.
    Type: Application
    Filed: June 24, 2008
    Publication date: March 12, 2009
    Inventors: Kenji Ono, Keisuke Ichikawa, Fumikazu Kanetaka
  • Patent number: 7462922
    Abstract: A semiconductor device provided with a temperature detection function having a high temperature detection accuracy for improving the ESD resistance of a temperature detection diode. The semiconductor device has a semiconductor element. A temperature detection diode is used to detect the temperature of the semiconductor element and an ambient temperature of the semiconductor element. A protection diode is connected between a cathode of the temperature detection diode and a ground side of the semiconductor element when the semiconductor element is activated.
    Type: Grant
    Filed: December 10, 2004
    Date of Patent: December 9, 2008
    Assignee: Kabushiki Kaisha Toyota Jidoshokki
    Inventors: Shogo Mori, Kenji Ono
  • Patent number: 7450314
    Abstract: A zoom lens system comprises, in order from an object side, a first lens unit having a positive refractive power; a second lens unit having a negative refractive power; a third lens unit having a positive refractive power; a fourth lens unit having a negative refractive power; and a fifth lens unit having a positive refractive power, and during magnification change from a wide-angle end to a telephoto end, each of the space between the respective lens units changes.
    Type: Grant
    Filed: April 2, 2007
    Date of Patent: November 11, 2008
    Assignee: Olympus Imaging Corp.
    Inventors: Tomoyuki Satori, Yuji Kamo, Kenji Ono
  • Publication number: 20080228465
    Abstract: A translation apparatus translates article information in a first language including an article body and a related headline as a summary of the article body. A decision unit discriminately identifies the article body and the headline in the article information. A translation unit respectively translates the article body and the headline into a second language based on identification result of the decision unit.
    Type: Application
    Filed: May 15, 2006
    Publication date: September 18, 2008
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventor: Kenji Ono
  • Publication number: 20080188018
    Abstract: An ink jet head circuit board is provided which has heaters to generate thermal energy for ink ejection as they are energized. This circuit board has the heaters formed with high precision to reduce their areas. It also has provisions to protect the electrode wires against corrosion and prevent a progress of corrosion. The substrate is deposited with the thin first electrodes made of a corrosion resistant metal. This is further deposited with the resistor layer. The second electrodes made of aluminum are deposited to overlap the first electrodes to form the heater without causing large dimensional variations among the heaters. With this construction, if a defect should occur in a protective layer on or near the heater, a progress of corrosion can effectively be prevented because the material of the resistor layer is more resistant to encroachment than aluminum and the first electrodes are corrosion resistant.
    Type: Application
    Filed: April 7, 2008
    Publication date: August 7, 2008
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Kazuaki Shibata, Kenji Ono, Teruo Ozaki, Satoshi Ibe, Ichiro Saito, Sakai Yokoyama, Toshiyasu Sakai
  • Publication number: 20080180487
    Abstract: The present invention provides an ink jet recording head which includes a substrate, an energy generating element which is disposed on the substrate and generates energy for discharging a liquid, an electrode which is disposed on the substrate and is electrically connected to the energy generating element, a passage-forming member which is disposed on the substrate, an adhesion layer which is disposed on the substrate and facilitates adhesion between the passage-forming member and the substrate, and a bump disposed on the electrode. The area of an upper surface of the bump is larger than the area of a lower surface of the bump, the lower surface being located on the substrate side, the upper surface being located opposite the lower surface, and a side face of the bump is covered with the adhesion layer. Thereby, a protective film is formed around the bump.
    Type: Application
    Filed: January 30, 2008
    Publication date: July 31, 2008
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Kazuya Abe, Kenji Ono, Toshiyasu Sakai, Hiroyuki Abo, Noriyasu Ozaki, Mitsuru Chida