Patents by Inventor Kenji Osawa

Kenji Osawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110076348
    Abstract: To provide a prophylactic and/or therapeutic agent for atopic dermatitis with minimal concerns of adverse drug reactions and high safety, various researches were conducted. As a result, it was found that an extract extracted from a mangosteen (Garcinia mangostana L.) peel with a polar solvent prevented or healed atopic dermatitis. That is, the present invention provides a prophylactic and/or therapeutic agent for atopic dermatitis comprising an extract extracted from a mangosteen peel with a polar solvent. Furthermore, the present invention provides a food containing the above-mentioned prophylactic and/or therapeutic agent for atopic dermatitis.
    Type: Application
    Filed: May 19, 2009
    Publication date: March 31, 2011
    Inventors: Reiko Kuroda, Higuchi Hiroaki, Narise Atsushi, Katsumasa Shimizu, Kenji Osawa
  • Publication number: 20110033392
    Abstract: The present invention provides a deodorizing composition containing as an active ingredient thereof a natural plant extract with high safety, which can be used for foods without any anxiety concerning safety in use and shows a high deodorizing effect even in a weakly acidic condition, and foods and drinks containing such a composition. The deodorizing composition comprises a plant of the genus Rubus of the family Rosaceae, laccase and an acid.
    Type: Application
    Filed: February 6, 2009
    Publication date: February 10, 2011
    Inventors: Atsushi Narise, Takahito Takase, Sanae Kikuchi, Kenji Osawa
  • Publication number: 20110002859
    Abstract: It is an object of the present invention to provide a chewing gum, by which an effect of preventing periodontal disease is obtained through mastication without performance required for a chewing gum being impaired, such as taste, appearance, and physical properties and storage stability as a product. A chewing gum containing Eucalyptus extract of the present invention is characterized by containing at least one kind of macrocarpal A, macrocarpal B, and macrocarpal C, contents of the macrocarpal A, the macrocarpal B, and the macrocarpal C being 0.001 to 0.0045% by weight, 0.003 to 0.0045% by weight, and 0.0015 to 0.0045% by weight with respect to a total weight of the chewing gum, respectively.
    Type: Application
    Filed: February 17, 2009
    Publication date: January 6, 2011
    Applicant: LOTTE CO., LTD.
    Inventors: Yuuichi Maeda, Takahito Takase, Atsushi Narise, Kenji Osawa
  • Patent number: 7823793
    Abstract: An IC card and card adapters are designed so that the IC card of a specific standard (e.g., MMC standard) is compatible with IC cards and terminals of other standards (e.g., MS card standard and USB terminal standard). In the IC card (MMC), a controller IC, which is connected to a flash memory, includes a voltage pull-down detector, a mode controller, a USB-mode interface controller, a MS-mode interface controller, and an MMC/SD-mode interface controller. The card adapters suffice to have component parts which are easy in formation and low in cost such as wiring lines and resistors. The voltage pull-down detector of the IC card detects the voltage pull-down caused by the resistors, and the mode controller selects the USB-mode interface controller, MS-mode interface controller or MMC/SD-mode interface controller so that the IC card becomes compatible with the corresponding IC card standard.
    Type: Grant
    Filed: October 30, 2008
    Date of Patent: November 2, 2010
    Assignees: Renesas Electronics Corporation, Hitachi ULSI Systems Co., Ltd.
    Inventors: Akira Higuchi, Hirotaka Nishizawa, Junichiro Osako, Kenji Osawa
  • Patent number: 7669773
    Abstract: To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals.
    Type: Grant
    Filed: October 18, 2007
    Date of Patent: March 2, 2010
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Takashi Totsuka, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama
  • Patent number: 7646085
    Abstract: A semiconductor device includes external interface terminals and processing circuits, and it is fed with an operating power source when detachably set in a host equipment. Power source feeding terminals (VCC, VSS) among the external interface terminals are long enough to keep touching the corresponding terminals of the host equipment for, at least, a predetermined time period since the separation of an extraction detecting terminal among the external interface terminals, from the corresponding terminal of the host equipment, and they are formed to be longer in the extraction direction of the semiconductor device than the extraction detecting terminal. Thus, a time period till the cutoff of the power source is easily made comparatively long. The power source feeding terminals should preferably be extended onto the insertion side of the semiconductor device, but an extendible distance is sometimes liable to be limited.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: January 12, 2010
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Kenji Osawa, Hideo Koike, Junichiro Osako, Tamaki Wada
  • Publication number: 20090283885
    Abstract: On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.
    Type: Application
    Filed: July 23, 2009
    Publication date: November 19, 2009
    Inventors: Tamaki Wada, Hirotaka Nishizawa, Masachika Masuda, Kenji Osawa, Junichiro Osako, Satoshi Hatakeyama, Haruji Ishihara, Kazuo Yoshizaki, Kazunori Furusawa
  • Patent number: 7615855
    Abstract: An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.
    Type: Grant
    Filed: May 6, 2008
    Date of Patent: November 10, 2009
    Assignee: Renesas Technology Corp.
    Inventors: Junichiro Osako, Hirotaka Nishizawa, Kenji Osawa, Akira Higuchi
  • Patent number: 7549593
    Abstract: A semiconductor device includes external interface terminals and processing circuits, and it is fed with an operating power source when detachably set in a host equipment. Power source feeding terminals (VCC, VSS) among the external interface terminals are long enough to keep touching the corresponding terminals of the host equipment for, at least, a predetermined time period since the separation of an extraction detecting terminal among the external interface terminals, from the corresponding terminal of the host equipment, and they are formed to be longer in the extraction direction of the semiconductor device than the extraction detecting terminal. The processing circuits include an interface control circuit (2) which is connected to the external interface terminals, and a rewritable nonvolatile memory (3) which is controlled by the interface control circuit. The nonvolatile memory stores information on the basis of the difference of the threshold voltages of memory cells.
    Type: Grant
    Filed: September 24, 2004
    Date of Patent: June 23, 2009
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Kenji Osawa, Hideo Koike, Junichiro Osako, Tamaki Wada
  • Patent number: 7543757
    Abstract: A semiconductor device includes external interface terminals and processing circuits, and it is fed with an operating power source when detachably set in a host equipment. Power source feeding terminals (VCC, VSS) among the external interface terminals are long enough to keep touching the corresponding terminals of the host equipment for, at least, a predetermined time period since the separation of an extraction detecting terminal among the external interface terminals, from the corresponding terminal of the host equipment, and they are formed to be longer in the extraction direction of the semiconductor device than the extraction detecting terminal. These power source feeding terminals are a power source terminal and a ground terminal, and any power source compensating capacitor is not connected between the power source terminal and the ground terminal.
    Type: Grant
    Filed: March 4, 2008
    Date of Patent: June 9, 2009
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Kenji Osawa, Hideo Koike, Junichiro Osako, Tamaki Wada
  • Publication number: 20090065593
    Abstract: An IC card and card adapters are designed so that the IC card of a specific standard (e.g., MMC standard) is compatible with IC cards and terminals of other standards (e.g., MS card standard and USB terminal standard). In the IC card (MMC), a controller IC, which is connected to a flash memory, includes a voltage pull-down detector, a mode controller, a USB-mode interface controller, a MS-mode interface controller, and an MMC/SD-mode interface controller. The card adapters suffice to have component parts which are easy in formation and low in cost such as wiring lines and resistors. The voltage pull-down detector of the IC card detects the voltage pull-down caused by the resistors, and the mode controller selects the USB-mode interface controller, MS-mode interface controller or MMC/SD-mode interface controller so that the IC card becomes compatible with the corresponding IC card standard.
    Type: Application
    Filed: October 30, 2008
    Publication date: March 12, 2009
    Inventors: Akira Higuchi, Hirotaka Nishizawa, Junichiro Osaka, Kenji Osawa
  • Patent number: 7478473
    Abstract: The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar outline of the memory body is smaller than half of a planar outline of the memory card. The memory body is disposed so as to be positioned closer to a first end side as one short side of the memory card with respect to a midline between the first end side and a second end side as an opposite short side of the memory card positioned on the side opposite to the first end side. The other area than the memory body-disposed area in the first and the second case is used as another functional area.
    Type: Grant
    Filed: September 28, 2006
    Date of Patent: January 20, 2009
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Kenji Osawa, Akira Higuchi, Junichiro Osako, Tamaki Wada
  • Publication number: 20080283619
    Abstract: An IC card is prevented from falling off readily an electronic device while maintaining the mechanical strength of the IC card. A recess for preventing a memory card from falling off an electronic device is provided at the side of one side of a principal surface of a cap of the memory card which is configured by fitting a memory body in a recess formed on a parts mounting surface of the cap. The bottom of the recess is terminated in the middle of the thickness of the cap. This construction makes it possible to prevent the memory card from falling off readily an electronic device while maintaining the mechanical strength of the memory card.
    Type: Application
    Filed: July 29, 2008
    Publication date: November 20, 2008
    Inventors: Hirotaka Nishizawa, Akira Higuchi, Kenji Osawa, Junichiro Osako, Tamaki Wada
  • Publication number: 20080272197
    Abstract: An antenna connection function for a noncontact interface is provided by suppressing a modification in a pin arrangement and a pin shape of a memory card that does not correspond to the noncontact interface. Two antenna connecting pins having the memory card are divided into two areas in which a size of one potential supply pin is the largest and used as a split pin arranged at intervals. Because a size of the two antenna connecting pins is at maximum as large as the size of the potential supply pin, the two antenna connecting pins are provided and the memory card that corresponds to the noncontact interface is obtained by devoting a pin area having the size of the one potential supply pin to the memory card that does not correspond to the noncontact interface. Accordingly, the pin area of the memory card that corresponds to the noncontact interface can be formed without departing from the pin area of the memory card that does not correspond to the noncontact interface.
    Type: Application
    Filed: December 16, 2007
    Publication date: November 6, 2008
    Inventors: Hirotaka NISHIZAWA, Akira Higuchi, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama
  • Publication number: 20080257967
    Abstract: To realize compatibility with an SIM card and adaptation to a high-speed memory access in an IC card module having a microcomputer and a memory card controller. An IC card module includes a plurality of first external connecting terminals and a plurality of second external connecting terminals both exposed to one surface of a card substrate, a microcomputer connected to the first external connecting terminals, a memory controller connected to the second external connecting terminals, and a volatile memory connected to the memory controller. The shape of the card substrate and the layout of the first external connecting terminals are based on a standard of plug-in UICC of ETSI TS 102 221 V4.4.0 (2001-10) or have compatibility. The second external connecting terminals are disposed outside the minimum range of the terminal layout based on the standard for the first external connecting terminals.
    Type: Application
    Filed: October 18, 2007
    Publication date: October 23, 2008
    Inventors: Hirotaka Nishizawa, Takashi Totsuka, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama
  • Patent number: 7427032
    Abstract: An adapter for a memory card is disclosed which performs a change of size so that a memory card smaller in planar size but almost equal in thickness as compared with a multi-media card can be used as a multi-media card. A protuberant portion is formed behind plural external terminals formed on a back side of the adapter, whereby, while the thickness of a front side of the adapter is maintained at a standardized thickness of the multi-media card, a rear side of the adapter is made thicker than the front side and internal terminals for contact with external terminals of the memory card are disposed in the interior of the thick portion of the adapter. The versatility of an extremely small-sized memory card can be improved.
    Type: Grant
    Filed: February 27, 2006
    Date of Patent: September 23, 2008
    Assignee: Renesas Technology Corp.
    Inventors: Junichiro Osako, Hirotaka Nishizawa, Kenji Osawa, Hideo Koike
  • Publication number: 20080225498
    Abstract: An adapter for a memory card is disclosed which performs a change of size so that a memory card smaller in planar size but almost equal in thickness as compared with a multi-media card can be used as a multi-media card. A protuberant portion is formed behind plural external terminals formed on a back side of the adapter, whereby, while the thickness of a front side of the adapter is maintained at a standardized thickness of the multi-media card, a rear side of the adapter is made thicker than the front side and internal terminals for contact with external terminals of the memory card are disposed in the interior of the thick portion of the adapter. The versatility of an extremely small-sized memory card can be improved.
    Type: Application
    Filed: May 23, 2008
    Publication date: September 18, 2008
    Inventors: JUNICHIRO OSAKO, Hirotaka Nishizawa, Kenji Osawa, Hideo Koike
  • Publication number: 20080211074
    Abstract: An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.
    Type: Application
    Filed: May 6, 2008
    Publication date: September 4, 2008
    Inventors: Junichiro OSAKO, Hirotaka Nishizawa, Kenji Osawa, Akira Higuchi
  • Patent number: 7416133
    Abstract: An IC card is prevented from falling off readily an electronic device while maintaining the mechanical strength of the IC card. A recess for preventing a memory card from falling off an electronic device is provided at the side of one side of a principal surface of a cap of the memory card which is configured by fitting a memory body in a recess formed on a parts mounting surface of the cap. The bottom of the recess is terminated in the middle of the thickness of the cap. This construction makes it possible to prevent the memory card from falling off readily an electronic device while maintaining the mechanical strength of the memory card.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: August 26, 2008
    Assignee: Renesas Technology Corp.
    Inventors: Hirotaka Nishizawa, Akira Higuchi, Kenji Osawa, Junichiro Osako, Tamaki Wada
  • Patent number: D581932
    Type: Grant
    Filed: May 17, 2007
    Date of Patent: December 2, 2008
    Assignees: Renesas Technology Corp., Sony Kabushiki Kaisha
    Inventors: Hirotaka Nishizawa, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama, Takashi Totsuka, Yoshitaka Aoki, Keiichi Tsutsui