Patents by Inventor Kenji Osawa
Kenji Osawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20070150633Abstract: An IC card and card adapters are designed so that the IC card of a specific standard (e.g., MMC standard) is compatible with IC cards and terminals of other standards (e.g., MS card standard and USB terminal standard). In the IC card (MMC), a controller IC, which is connected to a flash memory, includes a voltage pull-down detector, a mode controller, a USB-mode interface controller, a MS-mode interface controller, and an MMC/SD-mode interface controller. The card adapters suffice to have component parts which are easy in formation and low in cost such as wiring lines and resistors. The voltage pull-down detector of the IC card detects the voltage pull-down caused by the resistors, and the mode controller selects the USB-mode interface controller, MS-mode interface controller or MMC/SD-mode interface controller so that the IC card becomes compatible with the corresponding IC card standard.Type: ApplicationFiled: March 1, 2007Publication date: June 28, 2007Inventors: Akira HIGUCHI, Hirotaka Nishizawa, Junichiro Osako, Kenji Osawa
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Patent number: 7233058Abstract: On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.Type: GrantFiled: August 16, 2005Date of Patent: June 19, 2007Assignee: Renesas Technology Corp.Inventors: Tamaki Wada, Hirotaka Nishizawa, Masachika Masuda, Kenji Osawa, Junichiro Osako, Satoshi Hatakeyama, Haruji Ishihara, Kazuo Yoshizaki, Kazunori Furusawa
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Publication number: 20070125866Abstract: An IC card 1CD includes a frame member portion 1CB1, and an IC card main body 15 held in a state of being hung by a connecting portion 1CB2 in a frame thereof. The IC card main body 15 is made to constitute a card type information medium having a high functional performance having both of a function as a so-to-speak IC card and a function as a so-to-speak memory card having a capacity larger than that of the IC card and a function higher than that of the IC card capable of executing a security processing. An outer shape of the IC card main body 15 is formed in compliance with RS-MMC outer shape standard. A surface of a cap portion 1CB3 of the IC card main body 15 is printed with a desired character, pattern, diagram and photograph or the like by a printing method used in steps of fabricating a general IC card, and the IC card 15 is provided with higher acknowledgement performance, security performance and outlook.Type: ApplicationFiled: February 20, 2004Publication date: June 7, 2007Inventors: Hirotaka Nishizawa, Junichiro Osako, Kenji Osawa, Tamaki Wada, Michiaki Sugiyama
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Publication number: 20070023885Abstract: The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar outline of the memory body is smaller than half of a planar outline of the memory card. The memory body is disposed so as to be positioned closer to a first end side as one short side of the memory card with respect to a midline between the first end side and a second end side as an opposite short side of the memory card positioned on the side opposite to the first end side. The other area than the memory body-disposed area in the first and the second case is used as another functional area.Type: ApplicationFiled: September 28, 2006Publication date: February 1, 2007Inventors: Hirotaka Nishizawa, Kenji Osawa, Akira Higuchi, Junichiro Osako, Tamaki Wada
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Publication number: 20070001279Abstract: A semiconductor device includes external interface terminals and processing circuits, and it is fed with an operating power source when detachably set in a host equipment. Power source feeding terminals (VCC, VSS) among the external interface terminals are long enough to keep touching the corresponding terminals of the host equipment for, at least, a predetermined time period since the separation of an extraction detecting terminal among the external interface terminals, from the corresponding terminal of the host equipment, and they are formed to be longer in the extraction direction of the semiconductor device than the extraction detecting terminal. Thus, a time period till the cutoff of the power source is easily made comparatively long. The power source feeding terminals should preferably be extended onto the insertion side of the semiconductor device, but an extendible distance is sometimes liable to be limited.Type: ApplicationFiled: September 24, 2004Publication date: January 4, 2007Inventors: Hirotaka Nishizawa, Kenji Osawa, Hideo Koike, Junichiro Osako, Tamaki Wada
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Publication number: 20060249580Abstract: A semiconductor device includes external interface terminals and processing circuits, and it is fed with an operating power source when detachably set in a host equipment. Power source feeding terminals (VCC, VSS) among the external interface terminals are long enough to keep touching the corresponding terminals of the host equipment for, at least, a predetermined time period since the separation of an extraction detecting terminal among the external interface terminals, from the corresponding terminal of the host equipment, and they are formed to be longer in the extraction direction of the semiconductor device than the extraction detecting terminal. The processing circuits include an interface control circuit (2) which is connected to the external interface terminals, and a rewritable nonvolatile memory (3) which is controlled by the interface control circuit. The nonvolatile memory stores information on the basis of the difference of the threshold voltages of memory cells.Type: ApplicationFiled: September 24, 2004Publication date: November 9, 2006Inventors: Hirotaka Nishizawa, Kenji Osawa, Hideo Koike, Junichiro Osako, Tamaki Wada
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Patent number: 7120029Abstract: The productivity of an IC card is to be improved. In a memory card of the type in which a memory body having a wiring substrate and a semiconductor chip mounted on a main surface of the wiring substrate is held so as to be sandwiched in between a first case and a second case, a planar outline of the memory body is smaller than half of a planar outline of the memory card. The memory body is disposed so as to be positioned closer to a first end side as one short side of the memory card with respect to a midline between the first end side and a second end side as an opposite short side of the memory card positioned on the side opposite to the first end side. The other area than the memory body-disposed area in the first and the second case is used as another functional area.Type: GrantFiled: September 24, 2003Date of Patent: October 10, 2006Assignees: Renesas Technology Corp., Hitachi ULSI Systems Co., Ltd.Inventors: Hirotaka Nishizawa, Kenji Osawa, Akira Higuchi, Junichiro Osako, Tamaki Wada
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Publication number: 20060220204Abstract: On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.Type: ApplicationFiled: May 10, 2006Publication date: October 5, 2006Inventors: Tamaki Wada, Hirotaka Nishizawa, Masachika Masuda, Kenji Osawa, Junichiro Osako, Satoshi Hatakeyama, Haruji Ishihara, Kazuo Yoshizaki, Kazunori Furusawa
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Publication number: 20060220202Abstract: An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.Type: ApplicationFiled: June 13, 2006Publication date: October 5, 2006Inventors: Junichiro Osako, Hirotaka Nishizawa, Kenji Osawa, Akira Higuchi
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Publication number: 20060220203Abstract: On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.Type: ApplicationFiled: May 10, 2006Publication date: October 5, 2006Inventors: Tamaki Wada, Hirotaka Nishizawa, Masachika Masuda, Kenji Osawa, Junichiro Osako, Satoshi Hatakeyama, Haruji Ishihara, Kazuo Yoshizaki, Kazunori Furusawa
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Publication number: 20060208091Abstract: A semiconductor device includes external interface terminals and processing circuits, and it is fed with an operating power source when detachably set in a host equipment. Power source feeding terminals (VCC, VSS) among the external interface terminals are long enough to keep touching the corresponding terminals of the host equipment for, at least, a predetermined time period since the separation of an extraction detecting terminal among the external interface terminals, from the corresponding terminal of the host equipment, and they are formed to be longer in the extraction direction of the semiconductor device than the extraction detecting terminal. These power source feeding terminals are a power source terminal and a ground terminal, and any power source compensating capacitor is not connected between the power source terminal and the ground terminal.Type: ApplicationFiled: September 24, 2004Publication date: September 21, 2006Inventors: Hirotaka Nishizawa, Kenji Osawa, Hideo Koike, Junichiro Osako, Tamaki Wada
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Publication number: 20060202041Abstract: A semiconductor chip is mounted onto a wiring substrate having external connecting terminals, electrodes on the semiconductor chip and wiring lines on the wiring substrate are connected together electrically through bonding wires, and a sealing portion is formed by resin molding, to form an IC body. Further, a case formed of a thermoplastic resin is provided. The IC body is mounted into a recess of the case through a bonding material. Thereafter, a region near the recess of the case is deformed plastically to fix the IC body to the case and then the bonding material is cured. In this way there is fabricated an IC card comprising the case and the IC body whose stability is improved by being bonded to the case through the bonding material. The production yield of the IC card can be improved.Type: ApplicationFiled: March 7, 2006Publication date: September 14, 2006Inventors: Hirotaka Hishizawa, Kenji Osawa, Junichiro Osako, Tamaki Wada
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Publication number: 20060205280Abstract: A semiconductor device comprising a first wiring board having a plurality of external connection terminals on one side, semiconductor chips mounted on the other side of the first wiring board and electrically connected to the first wiring board by a plurality of wires, a sealing resin for sealing the semiconductor chips and the wires, and a second wiring board having a plurality of contact points on one side and bonded to the top surface of the sealing resin on the other side, wherein the upper end portions of the loops of the plurality of wires for electrically connecting the first wiring board to the semiconductor chips are exposed from the top surface of the sealing resin and electrically connected to the second wiring board.Type: ApplicationFiled: March 10, 2006Publication date: September 14, 2006Inventors: Hirotaka Nishizawa, Tamaki Wada, Kenji Osawa, Junichiro Osako, Michiaki Sugiyama
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Publication number: 20060194479Abstract: An adapter for a memory card is disclosed which performs a change of size so that a memory card smaller in planar size but almost equal in thickness as compared with a multi-media card can be used as a multi-media card. A protuberant portion is formed behind plural external terminals formed on a back side of the adapter, whereby, while the thickness of a front side of the adapter is maintained at a standardized thickness of the multi-media card, a rear side of the adapter is made thicker than the front side and internal terminals for contact with external terminals of the memory card are disposed in the interior of the thick portion of the adapter. The versatility of an extremely small-sized memory card can be improved.Type: ApplicationFiled: February 27, 2006Publication date: August 31, 2006Inventors: Junichiro Osako, Hirotaka Nishizawa, Kenji Osawa, Hideo Koike
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Publication number: 20060151614Abstract: A multifunction card device has an external connection terminal, an interface controller, a memory, and the security controller connected to the interface controller and the external connection terminal. The interface controller has a plurality of interface control modes, and controls an external-interface action and a memory interface action by the control mode according to the instruction from the outside. The external connection terminals have an individual terminal individualized for every interface control mode, and a communalized common terminal. A clock input terminal, a power supply terminal, and an earthing terminal are included in the common terminals. A data terminal, and a dedicated terminal of the security controller are included in the individual terminals. Partial communalization and individualization of an external connection terminal attain a guarantee of the reliability of an interface, and increase control of physical magnitude to some kinds of interface control modes.Type: ApplicationFiled: July 3, 2003Publication date: July 13, 2006Inventors: Hirotaka Nishizawa, Akira Higuchi, Kenji Osawa, Junichiro Osako, Tamaki Wada, Michiaki Sugiyama
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Patent number: 7053471Abstract: On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.Type: GrantFiled: October 10, 2002Date of Patent: May 30, 2006Assignees: Renesas Technologies Corp., Hitachi ULSI Systems Co., Ltd.Inventors: Tamaki Wada, Hirotaka Nishizawa, Masachika Masuda, Kenji Osawa, Junichiro Osako, Satoshi Hatakeyama, Haruji Ishihara, Kazuo Yoshizaki, Kazunori Furusawa
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Patent number: 7025623Abstract: An adapter for a memory card having a frame metal fitting to which an end portion of the card is inserted, whereby the card is detachably fitted, and a resin-molded body core assembled in the frame metal fitting by insertion, wherein an entire thickness of the adapter being approx. the same as that of the card, the frame metal fitting having a pair of holding portions in an approx. C shape in both end portions on the side of the card attached to hold both sides of the card, a hook portion between a pair of the holding portions being detachably engaged with the end portion of the card by spring force to prevent the card from coming off, a caulking projection fixing the core by caulking to the core, and an insulative coating film formed on the outer surface of the frame metal fitting.Type: GrantFiled: March 31, 2004Date of Patent: April 11, 2006Assignees: Sanwa Denki Kogyo Co., Ltd., Renesas Technology Corp.Inventors: Akira Katsumata, Hirotaka Nishizawa, Kenji Osawa
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Publication number: 20060054711Abstract: An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.Type: ApplicationFiled: November 2, 2005Publication date: March 16, 2006Inventors: Junichiro Osako, Hirotaka Nishizawa, Kenji Osawa, Akira Higuchi
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Publication number: 20060033191Abstract: On an adapter mounting portion 3a having a projecting cross section which is formed on a cap 3 of a small-sized memory card 1, a recessed portion of an adapter 2 side is fitted so that both parts are formed as an integral unit in a replaceable manner. Accordingly, the small-sized memory card 1 can maintain the dimensional compatibility with respect to existing memory cards whereby the small-sized memory card 1 can be used also in equipment which is designed to cope with the existing memory cards.Type: ApplicationFiled: August 16, 2005Publication date: February 16, 2006Inventors: Tamaki Wada, Hirotaka Nishizawa, Masachika Masuda, Kenji Osawa, Junichiro Osako, Satoshi Hatakeyama, Haruji Ishihara, Kazuo Yoshizaki, Kazunori Furusawa
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Patent number: 6988668Abstract: An IC body is loaded on a case made of a thermoplastic resin material and sealed to the case with a sealing portion made of thermoplastic resin material, whereby an IC card is manufactured. The IC body includes a wiring substrate formed with an external connection terminal at a back surface thereof, a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via an interconnect, and a sealing portion made of thermoplastic resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. Thus, making it possible to increase the strength of IC cards and, at the same time, to reduce the manufacturing cost and improve the reliability.Type: GrantFiled: September 24, 2003Date of Patent: January 24, 2006Assignees: Renesas Technology Corp., Hitachi ULSI Systems Co., Ltd.Inventors: Junichiro Osako, Hirotaka Nishizawa, Kenji Osawa, Akira Higuchi